Systems and methods for integrated multi-layer magnetic films

Patent metadata

Field	Value
Publication number	US-9647053-B2
Application number	US-201414571649-A
Country	US
Kind code	B2
Filing date	Dec 16, 2014
Priority date	Dec 16, 2013
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

Integrated multi-layer magnetic films for use in passive devices in microelectronic applications and methods of manufacture thereof. Soft ferromagnetic materials exhibiting high permeability and low coercivity are laminated together with insulating layers interposed. Electrical conductors coupled to interconnects are magnetically coupled to magnetic film layers to engender an inductor (self and mutual). Soft ferromagnetic materials are provided in an alternating array of parallel plate capacitors. Each alternating magnetic film is electrically coupled to either a primary or secondary electrical conductor interconnects and separated by an electrically insulating dielectric material. Alternatively, each alternating magnetic layer comprises an induced anisotropy material, which can also be combined with coiled conductor giving rise to a hybrid inductive/capacitive device. Also, soft ferromagnetic material are also selected and tuned to provide for FMR notch filtering.

First claim

What is claimed is:

1. A structure comprising:
a semiconductor integrated circuit comprising a multilevel wiring network; and
an inductor integrated into said multilevel wiring network, wherein said inductor comprises a planar laminated magnetic core and a conductive winding that turns around in a generally spiral manner on the outside of said planar laminated magnetic core, said planar laminated magnetic core comprising an electrical insulator layer and a first interface layer, wherein the electrical insulator layer and the first interface layer are disposed between a first magnetic layer and a second magnetic layer, and wherein said first interface layer comprises at least one of tantalum, titanium, tungsten, chromium, or platinum.

2. The structure of claim 1 wherein said electrical insulator is configured to reduce eddy currents.

3. The structure of claim 1 wherein said first magnetic layer is in electrical communication with a primary terminal and said second magnetic layer is in electrical communication with a secondary terminal.

4. The structure of claim 3 , said planar laminated magnetic core further comprising a third magnetic layer in electrical communication with said primary terminal, said second magnetic layer disposed between said first magnetic layer and said third magnetic layer.

5. The structure of claim 4 , said planar laminated magnetic core further comprising a second electrical insulator layer and a second interface layer, wherein the second electrical insulator layer and the second interface layer are disposed between said second magnetic layer and said third magnetic layer, and wherein said second interface layer comprises at least one of tantalum, titanium, tungsten, chromium, or platinum.

6. The structure of claim 3 , said planar laminated magnetic core further comprising a fourth magnetic layer in electrical communication with said secondary terminal, said third magnetic layer disposed between said second magnetic layer and said fourth magnetic layer.

7. The structure of claim 6 , said planar laminated magnetic core further comprising a third electrical insulator layer and a third interface layer, wherein the third electrical insulator layer and the third interface layer are disposed between said third magnetic layer and said fourth magnetic layer, and wherein said third interface layer comprises at least one of tantalum, titanium, tungsten, chromium, or platinum.

8. The structure of claim 1 wherein the first magnetic layer comprises a primary magnetic material having a relative permeability greater than about 500μ.

9. The structure of claim 1 wherein the second magnetic layer comprises a secondary magnetic material having an induced anisotropy greater than about 10 O e .

10. The structure of claim 2 wherein the electrical insulator layer has an electrical resistivity of greater than about 500 microOhm-centimeters.

11. The structure of claim 1 wherein the first magnetic layer is comprised of a first material and the electrical insulator layer is comprised of an oxide of the first material.

12. The structure of claim 1 wherein said first interface layer comprises a material that is selected to reduce a roughness at an interface between said electrical insulator layer and said first magnetic layer, said reduced roughness causing a reduced magnetic coercivity of said magnetic core.

13. The structure of claim 1 wherein said first interface layer comprises a material that is selected to improve an adhesion at an interface between said electrical insulator layer and said first magnetic layer, said improved adhesion causing a reduced potential for film delamination at said interface.

14. The structure of claim 1 wherein said first interface layer serves as a diffusion barrier between said electrical insulator layer and said first magnetic layer, said diffusion barrier preventing a diffusion of material constituents between said electrical insulator layer and said first magnetic layer.

15. The structure of claim 1 wherein said interface layer comprises a material that is selected to reduce a mechanical film stress in said magnetic core.

16. The structure of claim 1 , said planar laminated magnetic core further comprising a second interface layer, wherein:
said first interface layer is disposed between said electrical insulator layer and said first magnetic layer;
said second interface layer is disposed between said electrical insulator layer and said second magnetic layer; and
said second interface layer comprises at least one of tantalum, titanium, tungsten, chromium, or platinum.

17. The structure of claim 16 wherein:
said first interface layer serves as a first diffusion barrier between said electrical insulator layer and said first magnetic layer, said first diffusion barrier preventing a diffusion of material constituents between said electrical insulator layer and said first magnetic layer; and
said second interface layer serves as a second diffusion barrier between said electrical insulator layer and said second magnetic layer, said second diffusion barrier preventing a diffusion of material constituents between said electrical insulator layer and said second magnetic layer.

18. The structure of claim 16 wherein:
said first interface layer comprises a material that is selected to improve an adhesion at a first interface between said electrical insulator layer and said first magnetic layer, said improved adhesion causing a reduced potential for film delamination at said first interface; and
said second interface layer comprises a material that is selected to improve an adhesion at a second interface between said electrical insulator layer and said second magnetic layer, said improved adhesion causing a reduced potential for film delamination at said second interface.

19. The structure of claim 16 wherein:
said first interface layer comprises a material that is selected to reduce a roughness at a first interface between said electrical insulator layer and said first magnetic layer; and
said second interface layer comprises a material that is selected to reduce a roughness at a second interface between said electrical insulator layer and said second magnetic layer,
said reduced roughness at said first and second interfaces causing a reduced magnetic coercivity of said magnetic core.

Assignees

• Ferric Inc

Inventors

• Sturcken Noah Andrew
• Davies Ryan

Classifications

• H10P14/412

  Deposition of metallic or metal-silicide materials · CPC title

• H10W44/501

  Inductive arrangements (H10W44/20 takes precedence) · CPC title

• H10W20/497

  Inductive arrangements or effects of, or between, wiring layers · CPC title

• H10W20/496

  Capacitor integral with wiring layers · CPC title

• H01L23/5223

  Electricity · mapped topic