Method of manufacturing devices

US12044980B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12044980-B2
Application numberUS-201917296316-A
CountryUS
Kind codeB2
Filing dateOct 30, 2019
Priority dateDec 3, 2018
Publication dateJul 23, 2024
Grant dateJul 23, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for analyzing a process, the method including obtaining a multi-dimensional probability density function representing an expected distribution of values for a plurality of process parameters; obtaining a performance function relating values of the process parameters to a performance metric of the process; and using the performance function to map the probability density function to a performance probability function having the process parameters as arguments.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method comprising: obtaining a multi-dimensional probability density function representing an expected distribution of values of a plurality of process parameters of a manufacturing process; obtaining a performance function relating values of the process parameters to a performance metric of the process; using, by a hardware computer, the performance function to map the multi-dimensional probability density function to a performance probability function having the process parameters as arguments; and physically controlling or configuring the manufacturing process based on the performance probability function and/or providing a signal representing, or based on, the performance probability function to a tool or system for use by the tool or system to enable control or configuration of the manufacturing process. 2. The method according to claim 1 , wherein the process is a lithographic process and the process parameters include one or more selected from: focus, dose, overlay, optical aberration, a parameter relating to movement of a stage of a lithographic apparatus, pupil intensity distribution, and/or source bandwidth. 3. The method according to claim 1 , wherein the process includes transferring a pattern to the substrate and the process parameters include one or more selected from: RF power (per frequency), substrate temperature, (partial) gas pressure in a plasma, composition of a plasma, a CMP pressure, a CMP polish routine, etch time, and/or deposition thickness. 4. The method according to claim 1 , wherein obtaining a multi-dimensional probability density function comprises measuring values of the process parameters on a plurality of processed substrates or simulating the performance of the process a plurality of times. 5. The method according to claim 1 , wherein obtaining a multi-dimensional probability density function comprises training a machine learning algorithm. 6. The method according to claim 1 , wherein the process parameters have a normal distribution and/or are at least partially correlated. 7. The method according to claim 1 , wherein the performance function is non-linear. 8. The method according to claim 1 , wherein the performance metric is selected from: edge placement error, critical dimension, and/or critical dimension uniformity. 9. The method according to claim 1 , further comprising identifying one or more ranges of the process parameters for which the performance probability function meets a criterion. 10. The method according to claim 9 , further comprising calibrating a process window associated with the process parameters by performing exposures at one or more edges of the one or more ranges of the process parameters and measuring failure rates associated with one or more features formed as a result of the exposures. 11. The method according to claim 9 , further comprising selecting a process setting based on the one or more identified ranges of the process parameters. 12. The method according to claim 1 , further comprising analyzing the performance probability function to determine changes to the performance function and/or the multi-dimensional probability density function that would improve yield. 13. The method of claim 1 , wherein the obtaining a multi-dimensional probability density function is preceded by selecting the process parameters based on a characteristic of an expected statistical distribution of their values. 14. The method of claim 13 , wherein the characteristic is an expected similarity to a normal distribution. 15. A computer program product comprising a non-transitory computer-readable medium having instructions therein, the instructions, when executed by one or more computers, configured to cause the one or more computers to at least: obtain a multi-dimensional probability density function representing an expected distribution of values of a plurality of process parameters of a manufacturing process; obtain a performance function relating values of the process parameters to a performance metric of the process; use the performance function to map the multi-dimensional probability density function to a performance probability function having the process parameters as arguments; and cause physical control or configuration of the manufacturing process based on the performance probability function and/or provide a signal representing, or based on, the performance probability function to a tool or system for use by the tool or system to enable control or configuration of the manufacturing process. 16. The computer program product according to claim 15 , wherein the instructions configured to obtain a multi-dimensional probability density function are further configured to obtain measured values of the process parameters on a plurality of processed substrates or simulate the performance of the process a plurality of times. 17. The computer program product according to claim 15 , wherein the instructions are further configured to cause the one or more computers to identify one or more ranges of the process parameters for which the performance probability function meets a criterion. 18. The computer program product according to claim 17 , wherein the instructions are further configured to cause the one or more computers to select a process setting based on the one or more identified ranges of the process parameters. 19. The computer program product according to claim 15 , wherein the instructions are further configured to cause the one or more computers to analyze the performance probability function to determine a change to the performance function and/or the multi-dimensional probability density function that would improve yield. 20. The computer program product according to claim 15 , wherein the instructions are further configured to cause the one or more computers to select the process parameters based on a characteristic of an expected statistical distribution of their values preceding to obtaining of a multi-dimensional probability density function.

Assignees

Inventors

Classifications

  • Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure · CPC title

  • Monitoring the printed patterns · CPC title

  • characterised by CIM planning or realisation · CPC title

  • Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness · CPC title

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What does patent US12044980B2 cover?
A method for analyzing a process, the method including obtaining a multi-dimensional probability density function representing an expected distribution of values for a plurality of process parameters; obtaining a performance function relating values of the process parameters to a performance metric of the process; and using the performance function to map the probability density function to a p…
Who is the assignee on this patent?
Asml Netherlands Bv
What technology area does this patent fall under?
Primary CPC classification G03F7/70525. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jul 23 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).