Scanning ion beam deposition and etch
US-12176178-B2 · Dec 24, 2024 · US
uniformity
uniformity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01J2237/3323 |
| Official title | uniformity |
| Display label | uniformity |
| Total patents | 335 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 16 |
| 2016 | 38 |
| 2017 | 22 |
| 2018 | 19 |
| 2019 | 32 |
| 2020 | 30 |
| 2021 | 39 |
| 2022 | 22 |
| 2023 | 32 |
| 2024 | 35 |
| 2025 | 32 |
| 2026 | 18 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Substrate support assembly with non-uniform gas flow clearance
US-2017275759-A1 · Sep 28, 2017 · US
Apparatus of high frequency plasma
US-9741541-B1 · Aug 22, 2017 · US
Methodology for chamber performance matching for semiconductor equipment
US-2017098565-A1 · Apr 6, 2017 · US
Contoured showerhead for improved plasma shaping and control
US-9598770-B2 · Mar 21, 2017 · US
Plasma Excitation for Spatial Atomic Layer Deposition (ALD) Reactors
US-2017067156-A1 · Mar 9, 2017 · US
Substrate processing apparatus, and storage medium
US-2016376699-A1 · Dec 29, 2016 · US
Method for Controlling Plasma Uniformity in Plasma Processing Systems
US-2016372306-A1 · Dec 22, 2016 · US
Substrate processing method and substrate processing apparatus
US-2016362789-A1 · Dec 15, 2016 · US
Symmetric plasma process chamber
US-2016314942-A1 · Oct 27, 2016 · US
Symmetric plasma process chamber
US-2016314937-A1 · Oct 27, 2016 · US
Symmetric plasma process chamber
US-2016314936-A1 · Oct 27, 2016 · US
Symmetric plasma process chamber
US-2016314940-A1 · Oct 27, 2016 · US
Control of impedance of rf delivery path
US-2016307738-A1 · Oct 20, 2016 · US
Electronic device manufacturing method and sputtering method
US-9472384-B2 · Oct 18, 2016 · US
Anode Shield
US-2016300700-A1 · Oct 13, 2016 · US
Substrate support with thermal zones for semiconductor processing
US-2016300741-A1 · Oct 13, 2016 · US
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Non-Transitory Computer-Readable Recording Medium
US-2016284517-A1 · Sep 29, 2016 · US
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
US-2016284532-A1 · Sep 29, 2016 · US
Substrate carrier for a reduced transmission of thermal energy
US-2016276142-A1 · Sep 22, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01J2237/3323?
- CPC H01J2237/3323 is the Cooperative Patent Classification code for “uniformity.”
- How many patents are filed under CPC H01J2237/3323 (uniformity)?
- Our database includes 335 publications tagged with this CPC code.
- Is patent activity under CPC H01J2237/3323 growing?
- Publication counts under this code: 35 in 2024 vs 32 in 2025 (latest complete years).