NTC thin film thermistor and method for producing an NTC thin film thermistor

Patent metadata

Field	Value
Publication number	US-12033774-B2
Application number	US-202017617760-A
Country	US
Kind code	B2
Filing date	Jul 3, 2020
Priority date	Jul 5, 2019
Publication date	Jul 9, 2024
Grant date	Jul 9, 2024

Abstract

An NTC thin film thermistor that includes at least a first thin film electrode, at least an NTC thin film, and at least a second thin film electrode. A further aspect relates to a method for producing an NTC thin film thermistor.

First claim

The invention claimed is:

1. An NTC thin film thermistor comprising:
a plurality of first thin film electrodes;
a plurality of second thin film electrodes; and
at least two layers of NTC thin film, wherein a respective layer of the at least two layers of NTC thin film is disposed between a respective one of the plurality of first thin film electrodes and a respective one of the plurality of the second thin film electrodes,
wherein the plurality of first thin film electrodes overhangs on a first side of the NTC thin film thermistor with respect to the at least two layers of NTC thin film and the plurality of second thin film electrodes are shortened on the first side with respect to the at least two layers of NTC thin film, and
wherein the plurality of second thin film electrodes on a second side of the NTC thin film thermistor opposite to the first side overhangs with respect to the at least two layers of NTC thin film and the plurality of first thin film electrodes on the second side are shortened with respect to the at least two layers of NTC thin film.

2. The NTC thin film thermistor according to claim 1 ,
wherein the NTC thin film comprises a single crystalline or polycrystalline functional ceramic having a spinel structure or a perovskite structure.

3. The NTC thin film thermistor according to claim 1 ,
wherein the NTC thin film comprises at least one of Mn, Ni, Zn, Fe, Co, Cu, Zr, Y, Cr, Ca or Al.

4. The NTC thin film thermistor according to claim 1 ,
wherein the plurality of first thin film electrodes or the plurality of second thin film electrodes consist of a conductive ceramic.

5. The NTC thin film thermistor according to claim 1 ,
wherein the plurality of first thin film electrodes or the plurality of second thin film electrodes consist of one or more layers of metals, or Cu, Pt, Cr, Ni, Ag, Pd, Au, Ti, a mixture, or an alloy of these elements.

6. The NTC thin film thermistor according to claim 1 ,
wherein each of the plurality of first thin film electrodes and each of the plurality of second thin film electrodes are disposed on a different surface of the at least two layers of NTC thin film.

7. The NTC thin film thermistor according to claim 6 ,
wherein the plurality of first thin film electrodes and the plurality of second thin film electrodes are arranged in an interdigital comb structure.

8. The NTC thin film thermistor according to claim 1 ,
wherein in a region where the plurality of first thin film electrodes or the plurality of second thin film electrodes overhang with respect to the at least two layers of NTC thin film,
(a) an adjacent first thin film electrode of the plurality of first thin film electrodes rests on an underlying first thin film electrode of the plurality of first thin film electrodes that overhangs with respect to the at least two layers of NTC thin film, or
(b) an adjacent second thin film electrode of the plurality of second thin film electrodes rests on an underlying second thin film electrode of the plurality of second thin film electrodes that overhangs with respect to the at least two layers of NTC thin film.

9. The NTC thin film thermistor according to claim 1 ,
wherein in a region where the plurality of first thin film electrodes or the plurality of second thin film electrodes overhang with respect to the at least two layers of NTC thin film,
(a) an adjacent first thin film electrode of the plurality of second thin film electrodes is shorter than an underlying first thin film electrode of the plurality of second thin film electrodes that overhangs with respect to the at least two layers of NTC thin film, or
(b) an adjacent second thin film electrode of the plurality of second thin film electrodes is shorter than an underlying second thin film electrode of the plurality of second thin film electrodes that overhangs with respect to the at least two layers of NTC thin film.

10. The NTC thin film thermistor according to claim 1 ,
wherein portions of the plurality of first thin film electrodes and portions of the plurality of second thin film electrodes overhanging at the first side and the second side are reinforced with a metallized paste or other conductive medium.

11. The NTC thin film thermistor according to claim 1 ,
wherein the at least two layers of NTC thin film overhang with respect to the plurality of first thin film electrodes and the plurality of second thin film electrodes, the at least two layers of NTC thin film overhanging on a third side of the NTC thin film thermistor and a fourth side of the NTC thin film thermistor,
wherein both the third side and the fourth side are perpendicular to both the first side and the second side, and
wherein the third side and the fourth side are opposite beach other.

12. The NTC thin film thermistor according to claim 9 ,
wherein in a region where the at least two layers of NTC thin film overhang with respect to the plurality of first thin film electrodes or the plurality of second thin film electrodes, an adjacent layer of NTC thin film is shorter than an underlying layer of NTC thin films.

13. The NTC thin film thermistor according to claim 1 ,
wherein the NTC thin film thermistor is arranged on a carrier material.

14. The NTC thin film thermistor according to claim 13 ,
wherein the carrier material is formed as one of the first electrodes in the plurality of first thin film electrodes.

15. The NTC thin film thermistor according to claim 13 ,
wherein a circuit or a microelectronic mechanical system is integrated in the carrier material, or the carrier material is a part of an electronic component.

16. The NTC thin film thermistor according to claim 1 ,
wherein one or more of the at least two layers of the NTC thin film is thinner than 3 μm.

17. The NTC thin film thermistor according to claim 1 ,
wherein one or more of the plurality of first thin film electrodes or one or more of the plurality of second thin film electrodes are thinner than 10 μm.

18. The NTC thin film thermistor according to claim 1 ,
wherein a thickness of the NTC thin film thermistor is less than 100 μm.

19. The NTC thin film thermistor according to claim 1 ,
wherein the NTC thin film thermistor is suitable to be integrated into a substrate or a printed circuit board.

20. An arrangement comprising an NTC thin film thermistor according to claim 1 and
a printed circuit board,
wherein the NTC thin film thermistor is integrated in the printed circuit board.

21. An arrangement, comprising:
a plurality of NTC thin film thermistors according to claim 1 ,
wherein the NTC thin film thermistors are arranged in a matrix.

22. A method of manufacturing an NTC thin film thermistor comprising the steps of:
a) providing a non-conductive carrier material;
b) depositing at least one first thin film electrode;
c) applying at least one NTC thin film; and
d) applying at least one second thin film electrode,
wherein step b) can be performed before or after step c),
wherein in step b) the at least one first thin film electrode is also deposited in a first region where none of the at least one NTC thin film underlies,
wherein in step d) the at least one second thin film electrode is also deposited in a second region where none of the at least one NTC thin film underlies, and
wherein the first region and the second region do not overlap with each other, and
wherein:
a first one of the at least one first thin film electrode is first applied,
a first one of the a

Assignees

• Tdk Electronics Ag

Inventors

• Stendel Thomas
• Ihle Jan
• Mead Christl Lisa
• Bernert Thomas
• Redolfi Sebastian
• Vrabelj Marko

Classifications

• H05K2201/10196

  Variable component, e.g. variable resistor · CPC title

• H05K1/182

  associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] · CPC title

• H01C17/075

  by thin-film techniques · CPC title

• H01C7/006 Primary

  Thin film resistors · CPC title

• H01C1/14

  Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors · CPC title