Methods and devices for preventing thermally-induced stress cracks in large footprint solid oxide fuel cell columns

US12027728B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12027728-B2
Application numberUS-202218053834-A
CountryUS
Kind codeB2
Filing dateNov 9, 2022
Priority dateMar 26, 2022
Publication dateJul 2, 2024
Grant dateJul 2, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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A method of making an interconnect for an electrochemical cell stack includes providing the interconnect, and creep flattening the interconnect prior to placing the interconnect into the electrochemical cell stack.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of making an interconnect for an electrochemical cell stack, comprising: forming the interconnect by a powder metallurgy method by pressing a metal powder to form a green interconnect and sintering the green interconnect, such that the interconnect has a density of at least 6.5 grams per cubic centimeter after the sintering the green interconnect; and creep flattening the interconnect after the step of sintering the green interconnect and prior to placing the interconnect into the electrochemical cell stack, wherein the creep flattening is conducted from 4 hours to 60 hours at an elevated temperature ranging from 920° C. to 1100° C., and under a load ranging from 100 to 500 pounds. 2. The method of claim 1 , wherein the creep flattening is conducted in an oxidizing ambient such that the interconnect is oxidized during the creep flattening. 3. The method of claim 2 , further comprising: removing a metal oxide from a surface of the interconnect; and forming a coating comprising at least one of lanthanum strontium manganite (LSM) or (Mn, Co) 3 O 4 spinel (MCO) on air-side ribs located in an air flow field of the interconnect. 4. The method of claim 3 , further comprising performing an initial oxidation of the interconnect in the oxidizing ambient at a temperature above room temperature prior to the creep flattening. 5. The method of claim 4 , wherein: the removing the metal oxide occurs after the initial oxidation and before the creep flattening; and the forming the coating occurs after the creep flattening. 6. The method of claim 4 , wherein: the removing the metal oxide occurs after the initial oxidation and before the creep flattening; and the forming the coating occurs after the removing the metal oxide and before the creep flattening. 7. The method of claim 4 , wherein: the creep flattening occurs after the initial oxidation and before removing the metal oxide; and the removing the metal oxide occurs after the creep flattening and before the forming the coating. 8. The method of claim 3 , wherein the removing the metal oxide occurs after the creep flattening and before the forming the coating. 9. The method of claim 3 , wherein: the air side further comprises riser seal surfaces disposed on two opposing sides of the air flow field and which surround fuel inlets and outlets; and the riser seal surfaces are recessed with respect to a plane extending across a top surface of the coating on tips of the air-side ribs. 10. The method of claim 1 , wherein: the interconnect comprises a chromium alloy comprising 3 to 6 weight percent iron, 0 to 1 weight percent yttrium, and 94 to 97 weight percent chromium. 11. The method of claim 10 , wherein the interconnect comprises the chromium alloy comprising 3 to 3.9 weight percent iron, and 96.1 to 97 weight percent chromium. 12. The method of claim 1 , further comprising placing the interconnect into the electrochemical stack after the creep flattening, wherein the electrochemical stack comprises a solid oxide fuel cell stack containing solid oxide fuel cells, or a solid oxide electrolyzer cell stack containing solid oxide electrolyzer cells. 13. The method of claim 1 , wherein the interconnect comprises: fuel inlets and outlets that extend through the interconnect adjacent to opposing first and second peripheral edges of the interconnect; an air side comprising an air flow field comprising air-side ribs and air channels that extend in a first direction, from a third peripheral edge of the interconnect to a fourth peripheral edge of the interconnect that is opposite to the third peripheral edge, and riser seal surfaces disposed on the first and second peripheral edges of the interconnect, wherein the riser seal surfaces surround the fuel inlets and outlets; a fuel side opposing the air side, the fuel side comprising a fuel flow field comprising fuel-side ribs and fuel channels that extend in a second direction substantially perpendicular to the first direction between the fuel inlets and outlets; and a coating comprising at least one of lanthanum strontium manganite (LSM) or (Mn, Co) 3 O 4 spinel (MCO) located on the air-side ribs but not on the riser seal surfaces, wherein the riser seal surfaces are recessed with respect to a plane extending across a top surface of the coating on tips of the air-side ribs.

Assignees

Inventors

Classifications

  • characterised by the configuration of channels, e.g. by the flow field of the reactant or coolant · CPC title

  • Sealing or supporting means around electrodes, matrices or membranes · CPC title

  • by electrolytic decomposition of the electrolytic solution or the formed water product · CPC title

  • with both reactants being gaseous or vaporised · CPC title

  • Alloys based on refractory metals · CPC title

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Frequently asked questions

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What does patent US12027728B2 cover?
A method of making an interconnect for an electrochemical cell stack includes providing the interconnect, and creep flattening the interconnect prior to placing the interconnect into the electrochemical cell stack.
Who is the assignee on this patent?
Bloom Energy Corp
What technology area does this patent fall under?
Primary CPC classification H01M8/0228. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 02 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).