Display device including an inspection pattern and method for manufacturing of the display device

Patent metadata

Field	Value
Publication number	US-12022722-B2
Application number	US-202117555181-A
Country	US
Kind code	B2
Filing date	Dec 17, 2021
Priority date	Sep 15, 2017
Publication date	Jun 25, 2024
Grant date	Jun 25, 2024

Abstract

A method for manufacturing a display device is provided. A process of forming an inspection pattern, in which a protective film unit is partially removed in a thickness direction, in a pad area portion of the protective film unit, which corresponds to a pad area of a display unit, may be performed, and then, a process of delaminating the pad area portion of the protective film unit may be performed. A process of checking whether the inspection pattern exists may be performed to check whether the delamination has succeeded, and, at the same time, a process of measuring distances from an alignment mark to each of a long side and a short side of the display unit may be performed.

First claim

What is claimed is:

1. A method for manufacturing a display device, the method comprising:
providing a panel comprising a substrate comprising a display area in which pixels are disposed and a pad area adjacent to the display area, and a protective film attached onto the substrate;
forming a cutting line in the protective film overlapping a boundary between the display area and the pad area;
forming an inspection pattern in the protective film overlapping the pad area, the inspection pattern being spaced apart from the cutting line along a direction crossing a thickness direction of the protective film;
delaminating the protective film overlapping the pad area in the panel; and
checking whether the inspection pattern exists in the panel,
wherein the cutting line penetrates an entire thickness of the protective film, and the inspection pattern partially penetrates the thickness of the protective film.

2. The method of claim 1 , wherein the panel comprises a plurality of wires and a plurality of alignment marks, and
the inspection pattern overlaps at least one of the plurality of alignment marks.

3. The method of claim 2 , wherein the inspection pattern overlaps at least one of the plurality of wires.

4. The method of claim 2 , wherein the plurality of alignment marks is formed on a same layer as that of a wire of the plurality of wires.

5. The method of claim 2 , further comprising measuring distances from an alignment mark of the plurality of alignment marks to each of a long side and a short side of the panel.

6. The method of claim 5 , wherein measuring distances from the alignment mark to each of the long side and the short side of the panel and checking whether the inspection pattern exists are performed at the same time.

7. The method of claim 1 , wherein an adhesive layer is between the panel and the protective film, and
wherein the cutting line is formed by completely removing the protective film in the thickness direction of the protective film along the boundary and exposing the adhesive layer to the outside.

8. The method of claim 7 , wherein a thickness in the adhesive layer overlapping the cutting line is 25 μm to about 40 μm.

9. The method of claim 1 , wherein the substrate comprises a base substrate, a circuit element layer, a display element layer, and a thin-film encapsulation layer, which are sequentially laminated.

10. The method of claim 1 , wherein the inspection pattern removes a portion of the protective film in the thickness direction of the protective film, and the cutting line removes the entire protective film in the thickness direction.

11. A display device comprising:
a substrate comprising a display area in which pixels are disposed and a pad area adjacent to the display area;
a protective film disposed on the substrate and in which a cutting line overlapping a boundary between the display area and the pad area and an inspection pattern overlapping the pad area are defined, the inspection pattern being spaced apart from the cutting line along a direction crossing a thickness direction of the protective film; and
an adhesive layer disposed between the substrate and the protective film,
wherein the cutting line penetrates an entire thickness of the protective film, and the inspection pattern partially penetrates the thickness of the protective film.

12. The display device of claim 11 , wherein the substrate further comprises a plurality of wires connected to the pixels and extending to the pad area, and
wherein the inspection pattern overlaps at least one of the plurality of wires.

13. The display device of claim 12 , wherein an alignment mark is on a same layer as at least one of the plurality of wires.

14. A display device comprising:
a substrate comprising a display area in which pixels are disposed and a pad area adjacent to the display area;
a protective film disposed on the substrate and in which a cutting line overlapping a boundary between the display area and the pad area and an inspection pattern overlapping the pad area are defined; and
an adhesive layer disposed between the substrate and the protective film,
wherein the cutting line penetrates an entire thickness of the protective film, and the inspection pattern partially penetrates the thickness of the protective film, and
wherein when the protective film is separated from the substrate, the adhesive layer overlapping the pad area is exposed to an outside of the display device along a thickness direction of the protective film.

15. The display device of claim 11 , wherein the protective film overlapping the pad area is separated from the substrate by the cutting line as a boundary.

16. The display device of claim 11 , wherein when the protective film is separated from the substrate, an alignment mark is exposed to an outside.

Assignees

• Samsung Display Co Ltd

Inventors

• Cheon Beomjun
• Kim Kyungsik
• Eo Yun-Seok
• Lee Sang-Geun
• Lee Seungkuk
• Lim Sehee
• Choi Jinsoo

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P72/0606

  Position monitoring, e.g. misposition detection or presence detection · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10W46/603

  Formed on wafers or substrates before dicing and remaining on chips after dicing · CPC title

• H10W46/301

  for alignment · CPC title