Low temperature chuck for plasma processing systems

Patent metadata

Field	Value
Publication number	US-12009228-B2
Application number	US-202318175104-A
Country	US
Kind code	B2
Filing date	Feb 27, 2023
Priority date	Feb 3, 2015
Publication date	Jun 11, 2024
Grant date	Jun 11, 2024

Abstract

A wafer chuck assembly includes a puck, a shaft and a base. The puck includes an electrically insulating material that defines a top surface of the puck; a plurality of electrodes are embedded within the electrically insulating material. The puck also includes an inner puck element that forms one or more channels for a heat exchange fluid, the inner puck element being in thermal communication with the electrically insulating material, and an electrically conductive plate disposed proximate to the inner puck element. The shaft includes an electrically conductive shaft housing that is electrically coupled with the plate, and a plurality of connectors, including electrical connectors for the electrodes. The base includes an electrically conductive base housing that is electrically coupled with the shaft housing, and an electrically insulating terminal block disposed within the base housing, the plurality of connectors passing through the terminal block.

First claim

We claim:

1. A wafer chuck assembly, comprising:
a shaft;
a puck coupled with the shaft, the puck comprising:
an electrically insulating material defining a top surface of the puck, wherein the electrically insulating material defines a recessed ledge extending to an outer radius of the electrically insulating material;
a plurality of electrodes embedded within the electrically insulating material;
an inner puck element that forms one or more channels for a heat exchange fluid; and
an electrically conductive plate comprising a body disposed in contact with the inner puck element and defining a recessed cavity, wherein the inner puck element is seated within the recessed cavity, wherein the electrically conductive plate defines an outer radius of the puck, and wherein the electrically conductive plate defines an exterior housing of the shaft; and

a ring element seated atop the top surface of the puck, the ring element comprising a body extending about the puck, wherein a first downward-facing portion of the ring element is disposed on and in contact with the recessed ledge of the electrically insulating material and a second downward-facing portion of the ring element is disposed on and in contact with an upward-facing portion of the electrically conductive plate defining the recessed cavity within the electrically conductive plate.

2. The wafer chuck assembly of claim 1 , further comprising:
an electrically conductive base housing extending about the shaft housing.

3. The wafer chuck assembly of claim 2 , wherein:
the electrically conductive base housing defines one or more channels for the heat exchange fluid.

4. The wafer chuck assembly of claim 2 , further comprising:
an electrically insulating terminal block disposed within the electrically conductive base housing.

5. The wafer chuck assembly of claim 4 , wherein:
the terminal block comprises polyether ether ketone.

6. The wafer chuck assembly of claim 1 , wherein:
the shaft comprises a plurality of connectors comprising electrical connectors for the electrodes.

7. The wafer chuck assembly of claim 6 , wherein:
the plurality of connectors further comprise one or more connectors for a thermocouple or a resistance temperature detector.

8. The wafer chuck assembly of claim 6 , wherein:
the plurality of connectors further comprise one or more fluid conduits.

9. The wafer chuck assembly of claim 8 , wherein:
at least one of the one or more fluid conduits is configured to provide a heat transfer gas; and
the electrically insulating material defines channels for the heat transfer gas to spread between the top surface and a bottom surface of a wafer.

10. The wafer chuck assembly of claim 6 , wherein:
each of the electrical connectors for the plurality of electrodes comprises an inner conductor, an insulating layer about the inner conductor, a ground tube about the insulating layer, and a ceramic tube about the ground tube.

11. The wafer chuck assembly of claim 6 , further comprising:
a DC probe that extends through the top surface of the puck, wherein the plurality of connectors further comprise a connector for the DC probe.

12. The wafer chuck assembly of claim 1 , further comprising:
a connective element disposed between the inner puck element and the electrically insulating material.

13. The wafer chuck assembly of claim 12 , wherein:
the connective element is at least partially seated within the cavity of the electrically conductive plate.

14. The wafer chuck assembly of claim 12 , wherein:
the connective element extends fully across a surface of the inner puck element facing the electrically insulating material.

15. The wafer chuck assembly of claim 12 , wherein:
the connective element comprises aluminum silicon carbide.

16. The wafer chuck assembly of claim 1 , wherein:
the one or more channels each comprise a spiral configuration.

17. The wafer chuck assembly of claim 1 , wherein:
the exterior housing of the shaft forms an outer surface of the shaft; and
the shaft comprises a ceramic liner disposed within the exterior housing of the shaft that electrically insulates internal components of the shaft from the exterior housing of the shaft.

18. The wafer chuck assembly of claim 17 , wherein:
the ceramic liner is integrally formed with the inner puck element.

19. The wafer chuck assembly of claim 1 , wherein:
each of the one or more channels defines an internal fin.

Assignees

• Applied Materials Inc

Inventors

• Tran Toan Q
• Weng Zilu
• Lubomirsky Dmitry
• Kobayashi Satoru
• Cho Tae Seung
• Park Soonam
• Phi Son M
• Venkataraman Shankar

Classifications

• H10P50/287

  by chemical means · CPC title

• H10P50/283

  by chemical means · CPC title

• H10P72/7626

  characterised by the construction of the shaft · CPC title

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/7616

  characterised by a coating, a hardness or a material · CPC title