Apparatus and memory device including conductive lines and contacts, and methods of forming an apparatus including conductive lines and contacts

Patent metadata

Field	Value
Publication number	US-11990367-B2
Application number	US-202117444948-A
Country	US
Kind code	B2
Filing date	Aug 12, 2021
Priority date	Aug 16, 2019
Publication date	May 21, 2024
Grant date	May 21, 2024

Abstract

An apparatus comprises a structure including an upper insulating material overlying a lower insulating material, a conductive element underlying the lower insulating material, and a conductive material comprising a metal line and a contact. The conductive material extends from an upper surface of the upper insulating material to an upper surface of the conductive element. The structure also comprises a liner material adjacent the metal line. A width of an uppermost surface of the conductive material of the metal line external to the contact is relatively less than a width of an uppermost surface of the conductive material of the contact. Related methods, memory devices, and electronic systems are disclosed.

First claim

What is claimed is:

1. An apparatus comprising:
conductive elements underlying an insulative material;
conductive lines operably coupled to the conductive elements; and
contacts intersecting the conductive lines and extending from upper surfaces of the conductive lines to upper surfaces of the conductive elements with the contacts directly adjacent to the insulative material and the conductive elements, an outer diameter of the contacts at an elevation of the upper surfaces of the conductive lines is greater than a width of the conductive lines external to the contacts.

2. The apparatus of claim 1 , further comprising a liner material laterally adjacent to the conductive lines and overlying portions of the contacts.

3. The apparatus of claim 2 , wherein the liner material comprises a metal nitride material located on opposing sides of the conductive lines.

4. The apparatus of claim 1 , further comprising an etch stop material overlying the insulative material and an additional insulative material overlying the etch stop material, the conductive lines and upper portions of the contacts laterally adjacent to the additional insulative material.

5. The apparatus of claim 4 , wherein portions of the conductive lines are directly adjacent to the additional insulative material.

6. The apparatus of claim 1 , wherein the conductive lines and the contacts comprise the same material.

7. The apparatus of claim 1 , wherein openings comprising the conductive lines and the contacts are entirely free of seed materials and diffusion barrier materials.

8. A method of forming an apparatus, comprising:
forming an insulative material over conductive elements;
forming contacts comprising a first portion of a conductive material directly adjacent to the insulative material and the conductive elements; and
forming conductive lines operably coupled to the conductive elements, the conductive lines intersected by the contacts and comprising a second portion of the conductive material, the contacts extending from upper surfaces of the conductive lines to upper surfaces of the conductive elements with an outer diameter of the contacts at an elevation of the upper surfaces of the conductive lines being greater than a width of the conductive lines external to the contacts.

9. The method of claim 8 , further comprising forming trenches in an upper portion of the insulative material overlying a lower portion of the insulative material and thereafter forming contact vias extending entirely through the upper portion and the lower portion of the insulative material, the trenches containing the conductive lines and the contact vi as containing the contacts.

10. The method of claim 9 , wherein forming the insulative material comprises forming the upper portion and the lower portion thereof in a single deposition stage of a dual damascene process.

11. The method of claim 8 , further comprising forming contact openings extending from an upper surface of the insulative material to the upper surfaces of the conductive elements and thereafter forming conductive line trenches in the insulative material.

12. The method of claim 8 , further comprising selectively forming a metal nitride material on an upper surface of the first portion of the conductive material of the contacts prior to forming the conductive lines.

13. The method of claim 8 , wherein forming the contacts and forming the conductive lines comprises forming conductive structures comprising a continuous portion of the conductive material.

14. The method of claim 8 , wherein forming the contacts and forming the conductive lines comprises forming the conductive material in one or more stages after forming an entirety of the insulative material.

15. The method of claim 8 , wherein forming the contacts comprises removing upper surfaces of the first portion of the conductive material of the contacts after forming the conductive lines, without removing the upper surfaces of the first portion of the conductive material prior to forming the conductive lines.

16. A memory device, comprising:
conductive elements;
conductive lines extending in a horizontal direction over the conductive elements; and
contacts vertically intersecting the conductive lines and extending from upper surfaces of the conductive lines to upper surfaces of the conductive elements, wherein the upper surfaces of the conductive lines external to the contacts are relatively narrower than upper surfaces of the contacts, and wherein openings comprising the conductive lines and the contacts are entirely free of seed materials and diffusion barrier materials.

17. The memory device of claim 16 , wherein the contacts exhibit a tapered profile with an upper portion of individual contacts having a greater critical dimension than a lower portion of the individual contacts.

18. The memory device of claim 16 , further comprising at least one array of memory cells and a complementary metal-oxide-semiconductor (CMOS) under array (CUA) region vertically aligned with the at least one array of memory cells.

19. The memory device of claim 16 , further comprising a liner material comprising a metal silicon nitride or a metal boron nitride adjacent to the conductive lines in regions flanking the contacts.

20. The memory device of claim 19 , wherein a portion of the liner material intervenes between the conductive lines and the contacts.

Assignees

• Micron Technology Inc

Inventors

• Zhang Xiaosong
• Hu Yongjun J
• Kewley David A
• Hossain Md Zahid
• Irwin Michael J
• Billingsley Daniel
• Ramarajan Suresh
• Hanson Robert J
• Ong Biow Hiem
• Chow Keen Wah

Classifications

• H10W20/082

  the openings being tapered via holes · CPC title

• H10W20/057

  by selectively depositing, e.g. by using selective CVD or plating · CPC title

• H10W20/033

  in openings in dielectrics · CPC title

• H10W20/4441

  the principal metal being a refractory metal · CPC title

• H10W20/056 Primary

  by filling conductive material into holes, grooves or trenches · CPC title