Dual damascene fill

Patent metadata

Field	Value
Publication number	US-9768063-B1
Application number	US-201615199632-A
Country	US
Kind code	B1
Filing date	Jun 30, 2016
Priority date	Jun 30, 2016
Publication date	Sep 19, 2017
Grant date	Sep 19, 2017

Abstract

A method for filling vias formed in a dielectric layer with a metal or metal alloy that has a low solubility with copper over copper containing interconnects, wherein the vias are part of a dual damascene structure with trenches and vias is provided. A sealing layer of a first metal or metal alloy that has a low solubility with copper is selectively deposited directly on the copper containing interconnects in at bottoms of the vias, wherein sidewalls of the dielectric layer forming the vias are exposed to the depositing the sealing layer, and wherein the first metal or metal alloy that has a low solubility is selectively deposited to only form a layer on the copper containing interconnects. A via fill of a second metal or metal alloy that has a low solubility with copper is electrolessly deposited over the sealing layer, which fills the vias.

First claim

What is claimed is:

1. A method for filling vias formed in a dielectric layer with a metal or metal alloy that has a low solubility with copper over copper containing interconnects, wherein the vias are part of an interconnect structure with trenches and vias, comprising:
selectively depositing a sealing layer of a first metal that has a low solubility with copper or metal alloy that has a low solubility with copper directly on the copper containing interconnects at bottoms of the vias, wherein sidewalls of the dielectric layer forming the vias are exposed to the depositing the first metal or metal alloy, and wherein the first metal that has a low solubility with copper or metal alloy that has a low solubility is selectively deposited to only form a layer on the copper containing interconnects; and
electrolessly depositing a via fill of a second metal that has a low solubility with copper or metal alloy that has a low solubility with copper over the sealing layer, which fills the vias.

2. The method, as recited in claim 1 , wherein the electrolessly depositing the via fill comprises:
providing a cleaning;
performing an electroless deposition of the second metal that has a low solubility with copper or metal alloy that has a low solubility with copper; and
providing an acid clean to remove metallic contamination.

3. The method, as recited in claim 2 , wherein the selective depositing the sealing layer comprises a chemical vapor deposition (CVD) of the first metal that has a low solubility with copper or metal alloy that has a low solubility with copper.

4. The method, as recited in claim 3 , wherein the first metal that has a low solubility with copper or metal alloy that has a low solubility with copper is one or more of cobalt, ruthenium, or iridium or its alloys with other elements such as but not restricted to W, Mo, Re, P, and B.

5. The method, as recited in claim 4 , further comprising:
forming a barrier layer over the via fill and a trench adjacent to the via; and
filling the trench with a conductive metal or metal alloy containing at least one of copper, cobalt, ruthenium, nickel or tungsten.

6. The method, as recited in claim 2 , wherein the selective depositing the sealing layer comprises:
providing a pre-deposition cleaning;
electrolessly depositing a layer of the first metal that has a low solubility with copper or metal alloy that has a low solubility with copper on the copper containing interconnects to form a layer on the copper containing interconnects, wherein the electroless deposition of the via fill uses an electroless deposition bath that is more reactive than an electroless deposition bath that is used for electrolessly depositing the sealing layer;
providing a post-deposition cleaning; and
rinsing and drying the electrolessly deposited layer.

7. The method, as recited in claim 6 , wherein the first metal that has a low solubility with copper or metal alloy that has a low solubility with copper is one or more of cobalt, ruthenium, or iridium or its alloys with other elements such as but not restricted to W, Mo, Re, P, and B.

8. The method, as recited in claim 7 , further comprising:
forming a barrier layer over the via fill and a trench adjacent to the via; and
filling the trench with a conductive metal or metal alloy containing at least one of copper, cobalt, ruthenium, nickel or tungsten.

9. The method, as recited in claim 2 , wherein the depositing the sealing layer comprises: electrolessly depositing a layer of the first metal that has a low solubility with copper or metal alloy that has a low solubility with copper on the copper containing interconnects to form a layer on the copper containing interconnects, wherein the electroless deposition of the via fill uses an electroless deposition bath that is more reactive to copper than an electroless deposition bath that is used for electrolessly depositing the layer; and
rinsing and drying the electrolessly deposited layer.

10. The method, as recited in claim 9 , wherein the first metal that has a low solubility with copper or metal alloy that has a low solubility with copper is one or more of cobalt, ruthenium, or iridium or its alloys with other elements such as but not restricted to W, Mo, Re, P, and B.

11. The method, as recited in claim 10 , further comprising:
forming a barrier layer over the via fill and a trench adjacent to the via; and
filling the trench with a conductive metal or metal alloy containing at least one of copper, cobalt, ruthenium, nickel or tungsten.

12. The method, as recited in claim 1 , wherein the first metal that has a low solubility with copper or metal alloy that has a low solubility with copper is one or more of cobalt, ruthenium, or iridium or its alloys with other elements such as but not restricted to W, Mo, Re, P, and B.

13. The method, as recited in claim 1 , further comprising:
forming a barrier layer over the via fill and a trench adjacent to the via; and
filling the trench with a conductive metal or metal alloy containing at least one of copper, cobalt, ruthenium, nickel or tungsten.

14. The method, as recited in claim 1 , wherein the sealing layer has a thickness of between 5 Å-100 Å.

15. A method for filling vias formed in a dielectric layer with a metal or metal alloy that has a low solubility with copper over copper containing interconnects, wherein the vias are part of an interconnect structure with trenches and vias, comprising:
electrolessly depositing a layer of a first metal or metal alloy that has a low solubility with copper on the copper containing interconnects to form a layer on the copper containing interconnects;
drying the electrolessly deposited layer; and
electrolessly depositing a via fill of a second metal or metal alloy that has a low solubility with copper over the layer, which fills the vias; comprising:
performing an electroless deposition of the second metal or metal alloy that has a low solubility with copper, wherein the electroless deposition of the via fill uses an electroless deposition bath that is more reactive than an electroless deposition bath that is used for electrolessly depositing the layer; and
providing an acid clean to remove metallic contamination.

16. The method, as recited in claim 15 , wherein the first metal or metal alloy that has a low solubility with copper is one or more of cobalt, ruthenium, or iridium or its alloys with other elements such as but not restricted to W, Mo, Re, P, and B.

17. The method, as recited in claim 16 , further comprising:
forming a barrier layer over the via fill and a trench adjacent to the via; and
filling the trench with a conductive metal or metal alloy containing at least one of copper, cobalt, ruthenium, nickel or tungsten.

18. A method for filling vias formed in a dielectric layer with a metal or metal alloy that has a low solubility with copper over copper containing interconnects, wherein the vias are part of an interconnect structure with trenches and vias, comprising:
depositing a chemical vapor deposition (CVD) of a layer of a first metal or metal alloy that has a low solubility with copper on the copper containing interconnects; and
electrolessly depositing a via fill of a second metal or metal alloy that has a low solubility with copper over the layer, which fills the vias; comprising:
performing an electroless deposition of the second metal or metal alloy that has a low solubility with copper; and
providing an acid clean to remove metallic contamination.

19. The method, as recited in claim 18 , w

Assignees

• Lam Res Corp

Inventors

• Kolics Artur
• Nalla Praveen
• Zhao Lie

Classifications

• H10P14/432

  using selective deposition · CPC title

• H10P14/46 Primary

  using a liquid · CPC title

• H10W20/4403

  based on metals, e.g. alloys, metal silicides (H10W20/4484 takes precedence) · CPC title

• H10W20/425

  Barrier, adhesion or liner layers · CPC title

• H10W20/081

  by forming openings in the dielectric parts · CPC title