Waterborne adhesives for reduced basis weight multilayer substrates and use thereof

Patent metadata

Field	Value
Publication number	US-11970634-B2
Application number	US-202217823294-A
Country	US
Kind code	B2
Filing date	Aug 30, 2022
Priority date	Sep 27, 2012
Publication date	Apr 30, 2024
Grant date	Apr 30, 2024

Abstract

The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.

First claim

The invention claimed is:

1. A multilayer substrate package comprising:
(a) a first substrate, which is a substantially flat, having a first and a second side;
(b) a second substrate, which is a substantially flat, having a first and a second side; and
(c) an adhesive composition, sandwiched between the first substrate and the second substrate, comprising (i) an emulsion-based polymer selected from the group consisting of vinyl acetate ethylene dispersion, polyvinyl acetate, polyvinyl acetate polyvinyl alcohol, dextrin stabilized polyvinyl acetate, polyvinyl acetate copolymers, vinyl acetate—ethylene copolymers, vinylacrylic, styrene acrylic, acrylic, styrene butyl rubber, polyurethane and mixtures thereof; (ii) a plurality of expandable microspheres, wherein the microspheres is present in the adhesive composition in a volume of about 10 V/V % to about 50 V/V %;
wherein the adhesive composition is partially set, coalesced onto the first and the second substrates, and contains greater than 10% moisture content; and
wherein the expandable microspheres in the adhesive composition expand upon exposure to heat and/or radiation and the adhesive composition fully sets upon exposure to heat and/or radiation.

2. The multilayer substrate package of claim 1 , wherein the adhesive composition contacts the first and the second substrates in a pattern of dots, or a polyhedron shape that have substantially a flat base.

3. The multilayer substrate package of claim 1 , where in the radiation is microwave, infrared, radiofrequency, and/or ultrasonic energy.

Assignees

• Henkel Ag & Co Kgaa

Inventors

• Huang Tianjian
• Thompson Kristina
• Waski Daniel
• Meccia John

Classifications

• C09J11/08 Primary

  Macromolecular additives · CPC title

• B32B7/12 Primary

  using interposed adhesives or interposed materials with bonding properties · CPC title

• B32B27/08

  of synthetic resin · CPC title

• B32B27/10

  of paper or cardboard · CPC title

• B32B27/32

  comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)} · CPC title