Magnetic multi-turn sensor and method of manufacture

US11953567B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11953567-B2
Application numberUS-202117412046-A
CountryUS
Kind codeB2
Filing dateAug 25, 2021
Priority dateSep 8, 2020
Publication dateApr 9, 2024
Grant dateApr 9, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure provides a magnetic multi-turn sensor comprising a continuous coil of magnetoresistive elements and a method of manufacturing said sensor. The continuous coil is formed on a substrate such as a silicon wafer that has been fabricated so as to form a trench and bridge arrangement that enables the inner and outer spiral to be connected without interfering with the magnetoresistive elements of the spiral winding in between. Once the substrate has been fabricated with the trench and bridge arrangement, a film of the magnetoresistive material can be deposited to form a continuous coil on the surface of the substrate, wherein a portion of the coil is formed in the trench and a portion of the coil is formed on the bridge.

First claim

Opening claim text (preview).

The invention claimed is: 1. A magnetic multi-turn sensor, comprising: a plurality of magnetoresistive sensor elements connected in series and arranged in a continuous spiral configuration; and a substrate on which the plurality of magnetoresistive sensor elements are formed, the substrate comprising: a trench configured to receive at least one magnetoresistive element; and at least one bridge formed over the trench, the at least one bridge being formed by a portion of substrate and being configured to support at least one magnetoresistive element. 2. A magnetic multi-turn sensor according to claim 1 , wherein the trench is configured to receive a plurality of magnetoresistive elements defining one side of the continuous spiral configuration, and wherein the substrate comprises one bridge configured to receive one magnetoresistive element connecting an inner and outer loop of the continuous spiral configuration. 3. A magnetic multi-turn sensor according to claim 1 , wherein the trench is configured to receive one magnetoresistive element connecting an inner and outer loop of the continuous spiral configuration, and wherein the substrate comprises the at least one bridge formed over the trench for receiving a plurality of magnetoresistive elements defining one side of the continuous spiral configuration. 4. A magnetic multi-turn sensor according to claim 1 , wherein the substrate comprises a plurality of bridges formed over the trench for receiving a plurality of magnetoresistive elements defining one side of the continuous spiral configuration, each bridge receiving one magnetoresistive element. 5. A magnetic multi-turn sensor according to claim 1 , wherein the plurality of magnetoresistive elements are one of: giant magnetoresistive (GMR) elements or tunnel magnetoresistive (TMR) elements.

Assignees

Inventors

Classifications

  • Inductive arrangements (H10W44/20 takes precedence) · CPC title

  • Inductive arrangements or effects of, or between, wiring layers · CPC title

  • Interconnections over air gaps, e.g. air bridges · CPC title

  • Materials of the active region · CPC title

  • G01R33/098Primary

    comprising tunnel junctions, e.g. tunnel magnetoresistance sensors · CPC title

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Frequently asked questions

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What does patent US11953567B2 cover?
The present disclosure provides a magnetic multi-turn sensor comprising a continuous coil of magnetoresistive elements and a method of manufacturing said sensor. The continuous coil is formed on a substrate such as a silicon wafer that has been fabricated so as to form a trench and bridge arrangement that enables the inner and outer spiral to be connected without interfering with the magnetores…
Who is the assignee on this patent?
Analog Devices International Unlimited Co
What technology area does this patent fall under?
Primary CPC classification G01R33/098. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Apr 09 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).