Linear spacer for spacing a carrier of a package

Patent metadata

Field	Value
Publication number	US-11942383-B2
Application number	US-202117501568-A
Country	US
Kind code	B2
Filing date	Oct 14, 2021
Priority date	Nov 9, 2020
Publication date	Mar 26, 2024
Grant date	Mar 26, 2024

Abstract

A package for mounting on a mounting base is disclosed. In one example, the package comprises a carrier, an electronic component mounted at the carrier, leads electrically coupled with the electronic component and to be electrically coupled with the mounting base, and a linear spacer for defining a spacing with respect to the carrier.

First claim

What is claimed is:

1. An electronic device, comprising:
a package for mounting on a mounting base and for being thermally coupled with a heat sink, wherein the package comprises:
a carrier to be thermally coupled with the heat sink;
an electronic component mounted at the carrier;
leads electrically coupled with the electronic component and to be electrically coupled with the mounting base;
an encapsulant encapsulating at least part of the electronic component, at least part of the carrier, and part of the leads;
wherein a main surface of the package is constituted by a planar area defined by material of the encapsulant and by a surface of the carrier;
a linear spacer which protrudes beyond the planar area;

the heat sink mounted on the package so as to be thermally coupled with the carrier; and
the linear spacer defining a spacing between the carrier and the heat sink.

2. The electronic device according to claim 1 , comprising at least one of the following features:
wherein the spacer forms part of one of the group consisting of the package, the heat sink, and an intermediate body arranged between the package and the heat sink; and
comprising the mounting base on which the package is mounted and being electrically coupled with the leads.

3. A method of manufacturing the package of claim 1 for mounting on a mounting base, wherein the method comprises:
mounting an electronic component at a carrier;
electrically coupling leads, to be electrically coupled with the mounting base, with the electronic component; and
providing a linear spacer for defining a spacing with respect to the carrier;
encapsulating at least part of the electronic component, at least part of the carrier, and part of the leads by an encapsulant, so that a main surface of the package is constituted by a planar area defined by material of the encapsulant and by a surface of the carrier; and
wherein the linear spacer protrudes beyond the planar area.

4. The method according to claim 3 , wherein the method comprises forming the spacer as part of the encapsulant, in particular by molding, using at least one mold insert.

5. The method according to claim 3 , wherein the method comprises forming an electrically insulating and thermally conductive gap filler on an exterior side of the encapsulant encapsulating at least part of the electronic component, at least part of the carrier and part of the leads, and/or on an exterior side of the carrier, and in particular on part of the leads.

6. The method according to claim 5 , comprising at least one of the following features:
wherein the method comprises forming the gap filler by applying a flowable or viscous precursor and subsequently hardening the precursor, in particular by heating and/or by a chemical reaction between different constituents of the precursor;
wherein the method comprises dispensing a flowable or viscous precursor of the gap filler on the carrier and/or on the encapsulant, and distributing the flowable or viscous precursor by pressing a heat sink onto the spacer.

7. The electronic device according to claim 1 , comprising at least one of the following features:
wherein the linear spacer forms part of the encapsulant;
wherein another part of the carrier is exposed with respect to the encapsulant; and
wherein an extension of the linear spacer extends beyond an extension of the exposed part of the carrier.

8. The electronic device according to claim 1 , comprising:
wherein the linear spacer has a vertical extension of at least 30 μm;
wherein the carrier and the leads form part of a common patterned metal plate; and
wherein the linear spacer forms a top end of the package.

9. The electronic device according to claim 1 , wherein the linear spacer comprises at least one of the group consisting of at least one straight spacer body, at least one curved spacer body, at least one spacer body extending between a first free end and a second free end, an annularly closed spacer body, and at least two separate linear spacer bodies.

10. The electronic device according to claim 1 , wherein the linear spacer comprises at least one spacer bar.

11. The electronic device according to claim 10 , comprising at least one of the following features:
wherein at least one of the at least one spacer bar extends through a central region of the package; and
wherein at least one of the at least one spacer bar extends along a periphery of an exposed surface of the carrier.

12. The electronic device according to claim 1 , wherein the linear spacer comprises two spacer bars extending along two opposing sides of the package, wherein in particular each of the two spacer bars extends along essentially an entire side of the package.

13. The electronic device according to claim 1 , wherein the linear spacer comprises four spacer bars extending along each of all four sides of the package.

14. The electronic device according to claim 13 , wherein each of the four spacer bars extends along not more than half of a respective side of the package.

15. The electronic device according to claim 1 , comprising at least one of the following features:
wherein the linear spacer is made of an electrically insulating material, in particular a mold compound;
wherein an exterior surface of the carrier and contact areas of the leads, to be electrically coupled with the mounting base, are arranged on opposing sides of the package;
wherein an electrically insulating and thermally conductive gap filler on an exterior side of the carrier and/or on an exterior side of the encapsulant encapsulating at least part of the electronic component, at least part of the carrier and part of the leads, wherein in particular the gap filler covers part of the leads and/or comprises thermally conductive filler particles;
wherein at least part of the carrier is electrically conductive;
wherein an end portion of at least part of the leads is bent away from the carrier; and
wherein at least two electronic components being laterally spaced by at least part of the spacer.

Assignees

• Infineon Technologies Ag

Inventors

• Fuergut Edward
• Hong Chii Shang
• Lee Teck Sim
• Otremba Ralf
• Pedone Daniel
• Schmoelzer Bernd

Classifications

• H10W74/129

  forming a chip-scale package [CSP] · CPC title

• H10W74/016

  using moulds · CPC title

• H10W70/02

  of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title

• H10W40/226 Primary

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title