Transistor package with three-terminal clip
US-2019074243-A1 · Mar 7, 2019 · US
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Lee Teck Sim patents
Lee Teck Sim is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Teck Sim |
| Total patents | 2 |
| First publication | May 25, 2017 |
| Latest publication | Mar 7, 2019 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor chip package comprising side wall marking
US-2017148743-A1 · May 25, 2017 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 1 |
| Infineon Technologies Austria Ag | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/481 | 2 |
| H10W72/884 | 2 |
| H10W90/756 | 2 |
| H10W70/465 | 2 |
| H10W90/767 | 1 |