Semiconductor packages including a package body with grooves formed therein
US-12512380-B2 · Dec 30, 2025 · US
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Schmoelzer Bernd patents
Schmoelzer Bernd is listed as an inventor on 41 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Schmoelzer Bernd |
| Total patents | 41 |
| First publication | May 25, 2017 |
| Latest publication | Dec 30, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor package comprising a cavity with exposed contacts and a semiconductor module
US-12506051-B2 · Dec 23, 2025 · US
Method for fabricating a semiconductor device including an embedded semiconductor die
US-12463116-B2 · Nov 4, 2025 · US
Stacked module arrangement
US-12438068-B2 · Oct 7, 2025 · US
Package with electrically insulated carrier and at least one step on encapsulant
US-2024395646-A1 · Nov 28, 2024 · US
Method of forming a semiconductor package with connection lug
US-12125772-B2 · Oct 22, 2024 · US
Package with electrically insulated carrier and at least one step on encapsulant
US-12094793-B2 · Sep 17, 2024 · US
Semiconductor device module having vertical metallic contacts and a method for fabricating the same
US-12080669-B2 · Sep 3, 2024 · US
Method for fabricating a semiconductor device including an embedded semiconductor die
US-2024250004-A1 · Jul 25, 2024 · US
Semiconductor device including an embedded semiconductor die
US-12002739-B2 · Jun 4, 2024 · US
Recent patents
Latest publications not already listed above.
Semiconductor Package Providing an Even Current Distribution and Stray Inductance Reduction and a Semiconductor Device Module
US-2024170377-A1 · May 23, 2024 · US
Power semiconductor package and method for fabricating the same
US-2024162205-A1 · May 16, 2024 · US
Linear spacer for spacing a carrier of a package
US-11942383-B2 · Mar 26, 2024 · US
Package with electrically insulated carrier and at least one step on encapsulant
US-2024038612-A1 · Feb 1, 2024 · US
Package with electrically insulated carrier and at least one step on encapsulant
US-11876028-B2 · Jan 16, 2024 · US
Semiconductor Package or a Printed Circuit Board, Both Modified to One or More of Reduce, Inverse or Utilize Magnetic Coupling Caused by the Load Current of a Semiconductor Transistor
US-2024014104-A1 · Jan 11, 2024 · US
Electronic device module and a device module both having an adhesion promoter layer
US-2023378011-A1 · Nov 23, 2023 · US
Semiconductor package having an embedded electrical conductor connected between pins of a semiconductor die and a further device
US-2023361009-A1 · Nov 9, 2023 · US
Method for fabricating a semiconductor device module with increased reliability and a semiconductor device module
US-2023360929-A1 · Nov 9, 2023 · US
Semiconductor packages including a package body with grooves formed therein
US-2023298956-A1 · Sep 21, 2023 · US
Semiconductor package and a semiconductor device module including the same
US-2023282591-A1 · Sep 7, 2023 · US
Semiconductor package with connection lug
US-11728250-B2 · Aug 15, 2023 · US
Stacked module arrangement
US-2023230905-A1 · Jul 20, 2023 · US
Embedded package with delamination mitigation
US-2023106642-A1 · Apr 6, 2023 · US
Semiconductor Package Comprising a Cavity with Exposed Contacts and a Semiconductor Module
US-2023093341-A1 · Mar 23, 2023 · US
Semiconductor Package with Connection Lug
US-2022375830-A1 · Nov 24, 2022 · US
Method of Forming a Semiconductor Package with Connection Lug
US-2022375832-A1 · Nov 24, 2022 · US
Package with electrically insulated carrier and at least one step on encapsulant
US-2022157682-A1 · May 19, 2022 · US
Linear spacer for spacing a carrier of a package
US-2022148934-A1 · May 12, 2022 · US
Semiconductor device module having vertical metallic contacts and a method for fabricating the same
US-2022102311-A1 · Mar 31, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Austria Ag | 31 |
| Infineon Technologies Ag | 10 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/111 | 30 |
| H10W70/481 | 29 |
| H10W90/736 | 25 |
| H10W90/756 | 23 |
| H10W90/811 | 22 |