Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink

Patent metadata

Field	Value
Publication number	US-10497637-B2
Application number	US-201615566817-A
Country	US
Kind code	B2
Filing date	Apr 11, 2016
Priority date	Apr 16, 2015
Publication date	Dec 3, 2019
Grant date	Dec 3, 2019

Abstract

A bonded body is provided that is formed by bonding a metal member formed from copper, nickel, or silver, and an aluminum alloy member formed from an aluminum alloy of which a solidus temperature is lower than a eutectic temperature of aluminum and a metal element that constitutes the metal member. The aluminum alloy member and the metal member are subjected to solid-phase diffusion bonding. A chill layer, in which a Si phase of which an aspect ratio of a crystal grain is 2.5 or less and a crystal grain diameter is 15 μm or less is dispersed, is formed on a bonding interface side with the metal member in the aluminum alloy member. The thickness of the chill layer is set to 50 μm or greater.

First claim

The invention claimed is:

1. A bonded body that is formed by bonding a metal member formed from copper, nickel, or silver, and an aluminum alloy member formed from an aluminum alloy of which a solidus temperature is lower than a eutectic temperature of aluminum and a metal element that constitutes the metal member,
wherein the aluminum alloy member and the metal member are subjected to solid-phase diffusion bonding,
a chill layer, in which a Si phase of which an aspect ratio of a crystal grain is 2.5 or less and a crystal grain diameter is 15 μm or less is dispersed, is formed on a bonding interface side with the metal member in the aluminum alloy member
the thickness of the chill layer is 50 μm or greater,
the aluminum alloy member contains Si in a range of 1 mass % to 25 mass %,
an intermetallic compound layer is formed at a bonding interface between the metal member and the chill layer, and
at a bonding interface between the metal member and the intermetallic compound layer, oxides are dispersed in a layer shape along the bonding interface.

2. A power module substrate with heat sink, comprising:
an insulating layer;
a circuit layer that is formed on one surface of the insulating layer;
a metal layer that is formed on the other surface of the insulating layer; and
a heat sink that is disposed on a surface, which is opposite to the insulating layer, of the metal layer,
wherein in the metal layer, a bonding surface with the heat sink is constituted by copper, nickel, or silver,
in the heat sink, a bonding surface with the metal layer is constituted by an aluminum alloy of which a solidus temperature is lower than a eutectic temperature of aluminum and a metal element that constitutes the bonding surface of the metal layer,
the heat sink and the metal layer are subjected to solid-phase diffusion bonding,
a chill layer, in which a Si phase of which an aspect ratio of a crystal grain is 2.5 or less and a crystal grain diameter is 15 μm or less is dispersed, is formed on a bonding interface side with the metal layer in the heat sink
the thickness of the chill layer is 50 μm or greater,
the aluminum alloy member contains Si in a range of 1 mass % to 25 mass %,
an intermetallic compound layer is formed at a bonding interface between the metal layer and the chill layer, and
at a bonding interface between the metal layer and the intermetallic compound layer, oxides are dispersed in a layer shape along the bonding interface.

3. A heat sink, comprising:
a heat sink main body; and
a metal member layer,
wherein the metal member layer is formed from copper, nickel, or silver,
the heat sink main body is constituted by an aluminum alloy of which a solidus temperature is lower than a eutectic temperature of aluminum and a metal element that constitutes the metal member layer,
a chill layer, in which a Si phase of which an aspect ratio of a crystal grain is 2.5 or less and a crystal grain diameter is 15 μm or less is dispersed, is formed on a bonding interface side with the metal member layer in the heat sink main body
the thickness of the chill layer is 50 μm or greater,
the aluminum alloy member contains Si in a range of 1 mass % to 25 mass %,
an intermetallic compound layer is formed at a bonding interface between the metal member layer and the chill layer, and
at a bonding interface between the metal member layer and the intermetallic compound layer, oxides are dispersed in a layer shape along the bonding interface.

4. The bonded body according to claim 1 , wherein the thickness of the chill layer is set to 50 μm or greater and 1000 μm or less.

5. The power module substrate with heat sink according claim 2 , wherein the thickness of the metal layer formed from nickel is set to 1 μm to 30 μm.

6. The heat sink according to claim 3 , wherein
the thickness of the metal member layer formed from nickel is set to 1 μm to 30 μm.

7. The power module substrate with heat sink according claim 2 , wherein the thickness of the metal layer formed from silver is set to 1 mm to 20 μm.

8. The heat sink according to claim 3 , wherein
the thickness of the metal member layer formed from silver is set to 1 μm to 20 μm.

9. The power module substrate with heat sink according claim 2 , wherein
the intermetallic compound layer has a structure in which a plurality of intermetallic compounds are laminated along the bonding interface.

10. The heat sink according to claim 3 , wherein
the intermetallic compound layer has a structure in which a plurality of intermetallic compounds are laminated along the bonding interface.

Assignees

• Mitsubishi Materials Corp

Inventors

• Terasaki Nobuyuki
• Nagatomo Yoshiyuki

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W40/231

  characterised by their places of attachment or cooling paths · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W70/68

  Shapes or dispositions thereof · CPC title

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title