Method and apparatus for post exposure processing of photoresist wafers

Patent metadata

Field	Value
Publication number	US-11899366-B2
Application number	US-202117468536-A
Country	US
Kind code	B2
Filing date	Sep 7, 2021
Priority date	Nov 30, 2015
Publication date	Feb 13, 2024
Grant date	Feb 13, 2024

Abstract

Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.

First claim

What is claimed is:

1. A substrate processing apparatus, comprising:
a chamber body defining a process volume;
a pedestal disposed in the process volume;
a first electrode adapted to support a substrate;
a ring disposed radially outward of the first electrode;
a bearing coupled to the chamber body and disposed opposite the first electrode;
a stem, rotatably coupled to the bearing, the stem rotatable about an axis parallel to the first electrode; and
a second electrode coupled to the stem.

2. The apparatus of claim 1 , wherein a fluid inlet is disposed in the pedestal.

3. The apparatus of claim 2 , wherein the fluid inlet is disposed radially outward of the first electrode.

4. The apparatus of claim 2 , wherein the fluid inlet is disposed radially inward of the ring.

5. The apparatus of claim 2 , wherein a first conduit extends from the fluid inlet through the pedestal and the chamber body.

6. The apparatus of claim 1 , wherein a fluid outlet is disposed in the pedestal.

7. The apparatus of claim 6 , wherein the fluid outlet is disposed radially outward of the first electrode.

8. The apparatus of claim 6 , wherein the fluid outlet is disposed radially inward of the ring.

9. The apparatus of claim 6 , wherein a second conduit extends from the fluid outlet through the pedestal and the chamber body.

10. The apparatus of claim 1 , further comprising:
a heat source coupled to the first electrode.

Assignees

• Applied Materials Inc

Inventors

• Babayan Viachslav
• Buchberger Jr Douglas A
• Liang Qiwei
• Godet Ludovic
• Nemani Srinivas D
• Woodruff Daniel J
• Harris Randy
• Moore Robert B

Classifications

• H10P72/7618

  characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

• H10P72/0432 Primary

  mainly by conduction · CPC title

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• G03F7/40

  Treatment after imagewise removal, e.g. baking · CPC title

• H10P76/2041

  Photolithographic processes · CPC title