Controlling photo acid diffusion in lithography processes

Patent metadata

Field	Value
Publication number	US-2016011518-A1
Application number	US-201414472306-A
Country	US
Kind code	A1
Filing date	Aug 28, 2014
Priority date	Jul 10, 2014
Publication date	Jan 14, 2016
Grant date	—

Abstract

Methods and apparatuses for minimizing line edge/width roughness in lines formed by photolithography are provided. The random diffusion of acid generated by a photoacid generator during a lithography process contributes to line edge/width roughness. Methods disclosed herein apply an electric field, a magnetic field, and/or a standing wave during photolithography processes. The field and/or standing wave application controls the diffusion of the acids generated by the photoacid generator along the line and spacing direction, preventing the line edge/width roughness that results from random diffusion. Apparatuses for carrying out the aforementioned methods are also disclosed herein.

First claim

1 . An apparatus for processing a substrate, the apparatus comprising:
a substrate support, the substrate support comprising a surface configured to support a substrate thereon; a heat source, the heat source configured to heat a substrate positioned on the surface of the substrate support; and an electrode assembly positioned proximate to the surface of the substrate support, the electrode assembly comprising a plurality of individually addressable electrodes, each individually addressable electrode comprising one or more antennas, wherein the electrode assembly is configured to generate an electric field in a direction substantially parallel to the surface of the substrate support.

2 . The apparatus of claim 1 , wherein the plurality of individually addressable electrodes comprises about 8 to about 80 individually addressable electrodes.

3 . The apparatus of claim 1 , wherein the electrode assembly is on the surface of the substrate support.

4 . The apparatus of claim 1 , wherein the electrode assembly is integrated with the substrate support.

5 . The apparatus of claim 1 , wherein the antennas associated with the plurality of individually addressable electrodes are substantially parallel to each other.

6 . The apparatus of claim 5 , wherein the distance between each adjacent antenna included in the plurality of individually addressable electrodes is substantially the same.

7 . The apparatus of claim 6 , wherein the substrate support and electrode assembly are positioned within a vacuum chamber.

8 . The apparatus of claim 1 , further comprising:
a cavity positioned proximate to the surface of the substrate support; and at least one generator proximate to the cavity and configured to generate a standing wave within the cavity.

9 . The apparatus of claim 8 , wherein the at least one generator is configured to generate a frequency of less than about 6 GHz.

10 . The apparatus of claim 8 , wherein the at least one generator is configured to generate a standing wave having a period of about 100 nanometers to about 500 nanometers.

11 . The apparatus of claim 8 , wherein the at least one generator comprises at least one of a microwave generator and a long-wavelength laser.

12 . A method of processing a substrate, the method comprising:
applying a photoresist layer comprising a photoacid generator to a substrate; exposing portions of the photoresist layer to electromagnetic radiation to form substantially parallel lines of material in the photoresist layer having different chemical properties than the portions of the photoresist layer not exposed to the electromagnetic radiation; heating the substrate after exposing the substrate; and applying an electric field to the substrate in a direction parallel to the direction of the lines with an electrode assembly positioned proximate to the substrate, the electrode assembly comprising a plurality of individually addressable electrodes, each individually addressable electrode comprising one or more antennas, wherein the electric field is applied during the heating.

13 . The method of claim 12 , wherein the electrode assembly is on a surface of a substrate support on which the substrate is positioned.

14 . The method of claim 12 , wherein the electrode assembly is integrated with a substrate support on which the substrate is positioned.

15 . The method of claim 12 , wherein applying the electric field comprises varying the polarities of three or more individually addressable electrodes included in the plurality of individually addressable electrodes as a function of time.

16 . The method of claim 12 , wherein applying the electric field comprises driving a first set of electrodes included in the plurality of individually addressable electrodes according to a first pattern, and driving a second set of electrodes included in the plurality of individually addressable electrodes according to a second pattern.

17 . The method of claim 12 , wherein each individually addressable electrode included in the plurality of individually addressable electrodes comprises one or more antennas, and the antennas associated with the plurality of individually addressable electrodes are substantially parallel to each other.

18 . (canceled)

19 . The method of claim 17 , wherein the plurality of individually addressable electrodes includes about 8 to about 80 individually addressable electrodes.

20 . The method of claim 19 , wherein the electric field is generated by applying a voltage of between about 500V and 100 kV from a pulsed DC power source having a frequency of between about 10 Hz and 1 MHz to at least one independently addressable electrode, the duty cycle of the pulsed DC power is between about 5% and about 95%, and the rise and fall time of the pulsed DC power is between about 1 ns about 1000 ns;
wherein the substrate is heated to a temperature of between about 70° C. and about 160° C.; and wherein the temperature of the antennas of the independently addressable electrodes are controlled to substantially match the temperature of the substrate.

21 . An apparatus for processing a substrate, the apparatus comprising:
a substrate support, the substrate support comprising a surface configured to support a substrate thereon; a heat source, the heat source configured to heat a substrate positioned on the surface of the substrate support; a cavity positioned proximate to the surface of the substrate support; and at least one generator proximate to the cavity and configured to generate a standing wave within the cavity.

22 - 30 . (canceled)

Assignees

• Applied Materials Inc

Inventors

• Xie Peng
• Godet Ludovic
• Bencher Christopher

Classifications

• G03F7/26

  Processing photosensitive materials; Apparatus therefor (G03F7/12 - G03F7/24 take precedence) · CPC title

• G03F7/0045

  with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title

• G03F7/38 Primary

  Treatment before imagewise removal, e.g. prebaking {(G03F7/265 takes precedence)} · CPC title

• G03F7/20

  Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) · CPC title

• G03F7/16

  Coating processes; Apparatus therefor (applying coatings to base materials in general B05; applying photosensitive compositions to base for photographic purposes G03C1/74) · CPC title