Multi-zone azimuthal heater
US-2020343112-A1 · Oct 29, 2020 · US
US11895741B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11895741-B2 |
| Application number | US-202217832890-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 6, 2022 |
| Priority date | Nov 21, 2017 |
| Publication date | Feb 6, 2024 |
| Grant date | Feb 6, 2024 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A support pedestal includes a support member including a resistive layer having a plurality of zones, a routing layer, and a plurality of conductive vias. The plurality of zones are defined by a plurality of independently controllable resistive heating elements. The resistive layer and the routing layer are disposed in different planes of the support member and are connected by the plurality of conductive vias.
Opening claim text (preview).
What is claimed is: 1. A support pedestal comprising: a support member including a resistive layer having a plurality of zones, a routing layer, and a plurality of conductive vias, wherein: the plurality of zones are defined by a plurality of independently controllable resistive heating elements, and the resistive layer and the routing layer are disposed in different planes of the support member and are connected by the plurality of conductive vias; and a plurality pairs of electric terminals, each pair of electric terminals connected to a corresponding one of the plurality of independently controllable resistive heating elements via the routing layer and a corresponding pair of the plurality of conductive vias. 2. The support pedestal according to claim 1 , wherein the resistive layer and the routing layer are disposed in a plane normal to the support member and overlap such that the resistive layer extends across a central region of the support member. 3. The support pedestal according to claim 1 , wherein the routing layer includes a central portion and a plurality of arm portions extending from the central portion and electrically connected to the plurality of zones, and wherein a number of arm portions corresponds to a number of independently controllable resistive heating elements defined by the plurality of zones. 4. The support pedestal according to claim 1 , wherein the plurality pairs of electric terminals are connected to a central portion of the routing layer. 5. The support pedestal according to claim 1 , wherein the support member includes a main substrate having a top surface and a bottom surface, the resistive layer being disposed on the top surface, the routing layer being disposed on the bottom surface, and the plurality of conductive vias extend from the top surface to the bottom surface of the main substrate. 6. The support pedestal according to claim 5 , wherein the plurality of conductive vias are perpendicular to the top surface and the bottom surface. 7. The support pedestal according to claim 6 further comprising and a plurality of blind recesses open to the bottom surface, wherein the plurality pairs of electric terminals are disposed within the blind recesses. 8. The support pedestal according to claim 7 , wherein the routing layer includes a plurality of arm portions each having one end connected to a pair of the plurality of conductive vias and another end connected to a corresponding pair of the plurality pairs of electric terminals. 9. The support pedestal according to claim 7 , wherein at least a portion of the plurality pairs of electric terminals are flush with the bottom surface of the main substrate. 10. The support pedestal according to claim 1 , wherein the support member further includes a top layer, a main substrate, and a bottom layer, wherein the resistive layer is disposed between the top layer and the main substrate, and the routing layer is disposed between the main substrate and the bottom layer. 11. The support pedestal according to claim 1 further comprising a second resistive layer disposed along a same plane as the routing layer. 12. The support pedestal according to claim 11 , wherein the routing layer overlaps a portion of the second resistive layer. 13. The support pedestal according to claim 11 , wherein the routing layer abuts the second resistive layer. 14. The support pedestal according to claim 11 further comprising a transition trace disposed along the same plane as the second resistive layer and the routing layer, wherein a resistance of the transition trace is less than or equal to a resistance of the second resistive layer. 15. The support pedestal according to claim 1 , wherein the resistive layer has one or more of a two-wire heater configuration, a matrix wiring configuration for connecting the resistive layer to an external power source, and a multi-parallel wiring configuration for connecting the resistive layer to the external power source. 16. A support pedestal comprising: a support member including a resistive layer having a plurality of zones, a routing layer, a main substrate having opposing surfaces, and a plurality of conductive vias, wherein: the plurality of zones are defined by a plurality of independently controllable resistive heating elements, the resistive layer and the routing layer being disposed on the opposing surfaces of the main substrate, the resistive layer and the routing layer are connected by the plurality of conductive vias, and the plurality of conductive vias extend through the main substrate; and a plurality pairs of electric terminals, each pair of electric terminals connected to a corresponding one of the plurality of independently controllable resistive heating elements via the routing layer and a corresponding pair of the plurality of conductive vias. 17. The support pedestal according to claim 16 , wherein the resistive layer and the routing layer are disposed in a plurality of trenches defined by the opposing surfaces of the main substrate. 18. The support pedestal according to claim 16 , wherein the routing layer includes a central portion and a plurality of arm portions extending from the central portion. 19. The support pedestal according to claim 18 , wherein each arm of the plurality of arm portions is connected to a corresponding pair of the plurality of conductive vias. 20. The support pedestal according to claim 16 , wherein the resistive layer has one or more of a two-wire heater configuration, a matrix wiring configuration for connecting the resistive layer to an external power source, and a multi-parallel wiring configuration for connecting the resistive layer to the external power source.
characterised by a coating, a hardness or a material · CPC title
characterised by edge profile or support profile · CPC title
Temperature monitoring · CPC title
mainly by convection · CPC title
mainly by conduction · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.