Package with electrically insulated carrier and at least one step on encapsulant

Patent metadata

Field	Value
Publication number	US-11876028-B2
Application number	US-202117502082-A
Country	US
Kind code	B2
Filing date	Oct 15, 2021
Priority date	Nov 19, 2020
Publication date	Jan 16, 2024
Grant date	Jan 16, 2024

Abstract

A package is disclosed. In one example, the package includes a first main face for mounting a heat sink and an opposing second main face for being mounted on a mounting base. The package comprises a carrier, an electronic component mounted at the carrier, and an encapsulant encapsulating at least part of the electronic component and at least part of the carrier. Electrically insulating material covers electrically conductive material of the carrier at said first main face. The encapsulant comprises at least one step at the first main face.

First claim

What is claimed is:

1. A package having a first main face for mounting a heat sink and an opposing second main face for being mounted on a mounting base, wherein the package comprises:
a carrier;
an electronic component mounted at the carrier;
an encapsulant encapsulating at least part of the electronic component and at least part of the carrier;
electrically insulating material covering electrically conductive material of the carrier at said first main face;
wherein the encapsulant comprises at least one step at the first main face; and
wherein a sum of a height of the at least one step and a height of the electrically insulating material is at least 0.25 mm.

2. The package according to claim 1 , comprising at least one of the following features:
the electrically insulating material comprises or consists of material of the encapsulant;
the electrically insulating material comprises or consists of an exterior portion of the carrier;
the electrically insulating material is applied on a surface of the carrier being exposed with respect to the encapsulant.

3. The package according to claim 1 , wherein each of the at least one step is formed by a slanted or vertical surface portion connecting two vertically spaced slanted or horizontal surface portions of the encapsulant at the first main face.

4. The package according to claim 1 , comprising a plurality of steps at the first main face, wherein the carrier is arranged laterally between different ones of the steps.

5. The package according to claim 4 , wherein said different steps are arranged symmetrically with respect to the carrier and/or with respect to the electrically insulating material.

6. The package according to claim 4 , wherein said different steps are arranged asymmetrically with respect to the carrier and/or with respect to the electrically insulating material.

7. The package according to claim 1 , comprising leads which are electrically coupled with the electronic component.

8. The package according to claim 7 , wherein a part of the leads is encapsulated by the encapsulant and another part of the leads is exposed with respect to the encapsulant.

9. The package according to claim 7 , wherein the leads comprise a first group of leads and a second group of leads extending side by side, wherein each adjacent pair of the leads of the first group and each adjacent pair of the leads of the second group is spaced by a lateral lead-to-lead distance being smaller than a lateral group-to-group distance between the first group and the second group of leads.

10. The package according to claim 9 , wherein the first group of leads and the second group of leads extend out of the same side wall of the encapsulant.

11. The package according to claim 10 , wherein the leads further comprise a third group of leads and a fourth group of leads extending side by side, wherein each adjacent pair of the leads of the third group and each adjacent pair of the leads of the fourth group is spaced by a lateral lead-to-lead distance being smaller than a lateral group-to-group distance between the third group and the fourth group of leads, and wherein the third group of leads and the fourth group of leads extend out of another side wall of the encapsulant opposing the side wall out of which the first group of leads and the second group of leads extend.

12. The package according to claim 9 , wherein the package is designed so that a creepage distance between adjacent groups of leads differs by not more than 20% from a creepage distance between the package and the heat sink.

13. The package according to claim 7 , wherein the leads are bent away downwardly from the carrier, the carrier having a thickness being larger than a thickness of the leads.

14. The package according to claim 1 , wherein a side wall of the encapsulant comprises a protrusion or an indentation, in particular between different leads or different groups of leads.

15. The package according to claim 1 ,
comprising a further carrier and a further electronic component mounted at the further carrier; and
wherein the encapsulant encapsulates at least part of the further electronic component and at least part of the further carrier, and wherein the electrically insulating material covers electrically conductive material of the further carrier at said first main face.

16. The package according to claim 15 , comprising one of the following features:
wherein the carrier and the further carrier are identical structures rotated by 180° relative to each other;
wherein the carrier and the further carrier are identical structures aligned in parallel to each other.

17. An electronic device, comprising:
a package according to claim 1 ; and
the heat sink mounted on the first main face of the package.

18. The electronic device according to claim 17 , comprising the mounting base on which the package is mounted.

19. An electronic device comprising:
a package having a first main face and an opposing second main face for being mounted on a mounting base; and
a heat sink mounted on the first main face of the package, wherein the package comprises:
a carrier;
an electronic component mounted at the carrier;
an encapsulant encapsulating at least part of the electronic component and at least part of the carrier;
electrically insulating material covering electrically conductive material of the carrier at the first main face;
wherein the encapsulant comprises at least one step at the first main face, and
wherein the electrically insulating material is arranged at an interface between the heat sink and the package.

20. A method of manufacturing a package having a first main face for mounting a heat sink and an opposing second main face for being mounted on a mounting base, wherein the method comprises:
mounting an electronic component at a carrier;
encapsulating at least part of the electronic component and at least part of the carrier by an encapsulant;
covering electrically conductive material of the carrier with electrically insulating material at said first main face; and
forming at least one step at the encapsulant at said first main face,
wherein a side wall of the encapsulant comprises a protrusion or an indentation, in particular between different leads or different groups of leads.

Assignees

• Infineon Technologies Ag

Inventors

• Fuergut Edward
• Hong Chii Shang
• Lee Teck Sim
• Schmoelzer Bernd
• Tean Ke Yan
• Wang Lee Shuang

Classifications

• H10W90/811

  Multiple chips on leadframes · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W70/411

  Chip-supporting parts, e.g. die pads · CPC title

• H10W74/111 Primary

  the semiconductor body being completely enclosed · CPC title

• H10W74/01

  Manufacture or treatment · CPC title