Cover to vacuum debris while grinding

Patent metadata

Field	Value
Publication number	US-11872669-B2
Application number	US-202117452616-A
Country	US
Kind code	B2
Filing date	Oct 28, 2021
Priority date	Nov 11, 2020
Publication date	Jan 16, 2024
Grant date	Jan 16, 2024

Abstract

A processing machine includes a chuck table, a chuck table cover having an opening through which a holding surface of the chuck table can protrude, a processing unit having a spindle, a spindle housing, and a mount portion arranged on a lower end portion of the spindle, the processing unit being configured to process a workpiece by a processing tool mounted on a lower part of the mount portion, a processing chamber construction cover that covers the chuck table and the mount portion. The processing machine further includes a processing tool cover that is secured to a lower end portion of the spindle housing and that has an upper wall and a side wall that extends downwardly from the upper wall. The processing tool cover is disposed inside the processing chamber construction cover and covers the processing tool from above and sides by the upper and side walls.

First claim

What is claimed is:

1. A processing machine comprising:
a chuck table having a holding surface that holds a workpiece thereon;
a chuck table cover enclosing surroundings of the chuck table and having an opening through which the holding surface of the chuck table is able to protrude;
a processing unit including a spindle, a spindle housing that rotatably holds the spindle therein, and a disc-shaped mount portion arranged on a lower end portion of the spindle, the lower end portion projecting from the spindle housing, the processing unit being configured to process the workpiece by a processing tool mounted on a lower part of the mount portion;
a processing feed mechanism that feeds the processing unit in an up-down direction to perform processing;
a processing chamber construction cover that covers the chuck table and the mount portion; and
a processing tool cover that is secured to a lower end portion of the spindle housing, the lower end portion being located inside the processing chamber construction cover, has an upper wall defining an insertion opening through which the spindle is able to be inserted at the lower end portion thereof, and a side wall that is connected to the upper wall and extends downwardly from the upper wall, is disposed inside the processing chamber construction cover, and covers the processing tool from above and sides by the upper wall and the side wall.

2. The processing machine according to claim 1 , wherein the processing tool cover is secured to the lower end portion of the spindle housing in a manner that allows detachment of the processing tool cover from the spindle housing.

3. The processing machine according to claim 1 , further comprising:
an exhaust unit including an exhaust duct that is connected at an end portion thereof to the processing tool cover and at an opposite end portion thereof to a suction source.

Assignees

• Disco Corp

Inventors

• Moriya Toshiyuki
• Shirahama Tomohiro

Classifications

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P72/7604

  the wafers being placed on a susceptor, stage or support · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• B24B7/04 Primary

  involving a rotary work-table · CPC title

• B24B37/345

  Feeding, loading or unloading work specially adapted to lapping · CPC title