Determination of recipes for manufacturing semiconductor devices

Patent metadata

Field	Value
Publication number	US-11836429-B2
Application number	US-202017770944-A
Country	US
Kind code	B2
Filing date	Oct 22, 2020
Priority date	Oct 23, 2019
Publication date	Dec 5, 2023
Grant date	Dec 5, 2023

Abstract

Methods, systems, and computer programs are presented for determining the recipe for manufacturing a semiconductor with the use of machine learning (ML) to accelerate the definition of recipes. One general aspect includes a method that includes an operation for performing experiments for processing a component, each experiment controlled by a recipe, from a set of recipes, that identifies parameters for manufacturing equipment. The method further includes an operation for performing virtual simulations for processing the component, each simulation controlled by one recipe from the set of recipes. An ML model is obtained by training an ML algorithm using experiment results and virtual results from the virtual simulations. The method further includes operations for receiving specifications for a desired processing of the component, and creating, by the ML model, a new recipe for processing the component based on the specifications.

First claim

What is claimed is:

1. A method comprising:
performing a plurality of experiments for processing and forming a semiconductor device, each experiment controlled by a semiconductor device process recipe from a plurality of semiconductor device process recipes that identifies parameters for manufacturing equipment used for the processing of the semiconductor device;
performing a plurality of virtual simulations for processing the semiconductor device, each virtual simulation controlled by one semiconductor device process recipe from the plurality of semiconductor device process recipes;
obtaining a machine-learning (ML) model by training an ML algorithm using experiment results and virtual results from the plurality of virtual simulations;
receiving specifications for a desired processing of the semiconductor device; and
creating, by the ML model, a new recipe for processing the semiconductor device based on the specifications.

2. The method as recited in claim 1 , wherein the ML model is based on a plurality of features that comprise recipe features, experiment results features, virtual result features, and metrology features.

3. The method as recited in claim 2 , wherein the metrology features include one or more of imaging methods, transmission electron microscopy, typical-thickness measurement, sheet resistance, surface resistivity, stress measurement, and analytical methods used to determine at least one characteristic selected from characteristics including layer thickness, composition, grain, and orientation.

4. The method as recited in claim 2 , wherein the recipe features include workflow, gas flows, chamber temperature, chamber pressure, step durations, and radio-frequency (RF) values.

5. The method as recited in claim 2 , wherein the ML model includes active process control to determine process parameters to satisfy control objectives, the input to the ML model including the control objectives for the recipe and desired active process control.

6. The method as recited in claim 1 , wherein the virtual simulations are performed by a simulation tool based on behavior modeling.

7. The method as recited in claim 1 , wherein the experiment results include values measured from the processing of the component, the values including one or more of lateral ratio, isotropic ratio, deposition depth, global sticking coefficient, surface dependent sticking coefficient, delay thickness, neutral-to-ion ratio, and ion angular distribution function.

8. The method as recited in claim 1 , wherein each experiment is performed on a semiconductor manufacturing apparatus based on the recipe for the experiment, wherein one experiment is performed to measure effects of changing a value of one parameter from a previous recipe used in a previous experiment.

9. The method as recited in claim 1 , wherein the processing the component is for a deposition process using an inhibition profile.

10. The method as recited in claim 1 , wherein the processing the component is for a deposition in a 3D NAND word line (WL) fill.

11. A system comprising:
a memory comprising instructions; and
one or more computer processors, the instructions, when executed by the one or more computer processors, cause the system to perform operations comprising:
performing a plurality of experiments for processing and forming a semiconductor device, each experiment controlled by a semiconductor device process recipe from a plurality of semiconductor device process recipes that identifies parameters for manufacturing equipment used for the processing of the semiconductor device;
performing a plurality of virtual simulations for processing the semiconductor device, each virtual simulation controlled by one semiconductor device process recipe from the plurality of semiconductor device process recipes;
obtaining a machine-learning (ML) model by training an ML algorithm using experiment results and virtual results from the plurality of virtual simulations;
receiving specifications for a desired processing of the semiconductor device; and
creating, by the ML model, a new recipe for processing the semiconductor device based on the specifications.

12. The system as recited in claim 11 , wherein the ML model is based on a plurality of features that comprise recipe features, experiment results features, virtual result features, and metrology features.

13. The system as recited in claim 12 , wherein the metrology features include one or more of imaging methods, transmission electron microscopy, typical-thickness measurement, sheet resistance, surface resistivity, stress measurement, and analytical methods used to determine at least one characteristic selected from characteristics including layer thickness, composition, grain, and orientation.

14. The system as recited in claim 12 , wherein the recipe features include workflow, gas flows, chamber temperature, chamber pressure, step durations, and radio-frequency (RF) values.

15. The system as recited in claim 11 , wherein the experiment results include values measured from the processing of the component, the values including one or more of lateral ratio, isotropic ratio, deposition depth, global sticking coefficient, surface dependent sticking coefficient, delay thickness, neutral-to-ion ratio, and ion angular distribution function.

16. The system as recited in claim 11 , wherein each experiment is performed on a semiconductor manufacturing apparatus based on the recipe for the experiment, wherein one experiment is performed to measure effects of changing a value of one parameter from a previous recipe used in a previous experiment.

17. A tangible machine-readable storage medium including instructions that, when executed by a machine, cause the machine to perform operations comprising:
performing a plurality of experiments for processing and forming a semiconductor device, each experiment controlled by a semiconductor device process recipe from a plurality of semiconductor device process recipes that identifies parameters for manufacturing equipment used for the processing of the semiconductor device;
performing a plurality of virtual simulations for processing the semiconductor device, each virtual simulation controlled by one semiconductor device process recipe from the plurality of semiconductor device process recipes;
obtaining a machine-learning (ML) model by training an ML algorithm using experiment results and virtual results from the plurality of virtual simulations;
receiving specifications for a desired processing of the semiconductor device; and
creating, by the ML model, a new recipe for processing the semiconductor device based on the specifications.

18. The tangible machine-readable storage medium as recited in claim 17 , wherein the ML model is based on a plurality of features that comprise recipe features, experiment results features, virtual result features, and metrology features.

19. The tangible machine-readable storage medium as recited in claim 18 , wherein the metrology features include one or more of imaging methods, transmission electron microscopy, typical-thickness measurement, sheet resistance, surface resistivity, stress measurement, and analytical methods used to determine at least one characteristic selected from characteristics including layer thickness, composition, grain, and orientation.

20. The tangible machine-readable storage medium as recited in claim 18 , wherein the recipe features include workflow, gas flows, chamber temperature, chamber pressure, step durations, and radio-frequenc

Assignees

• Lam Res Corp

Inventors

• Sawlani Kapil Umesh
• Basu Atashi
• Fried David Michael
• Danek Michal
• Alden Emily Ann

Classifications

• H10W20/056

  by filling conductive material into holes, grooves or trenches · CPC title

• G06F30/3308 Primary

  using simulation · CPC title

• G06F30/27 Primary

  using machine learning, e.g. artificial intelligence, neural networks, support vector machines [SVM] or training a model · CPC title

• G06F30/337

  Design optimisation · CPC title

• G06N20/00 Primary

  Machine learning · CPC title