Vacuum pump, and control device of vacuum pump

US11821440B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11821440-B2
Application numberUS-201916967892-A
CountryUS
Kind codeB2
Filing dateFeb 8, 2019
Priority dateFeb 16, 2018
Publication dateNov 21, 2023
Grant dateNov 21, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

To provide a vacuum pump capable of efficiently cooling electrical equipment. The vacuum pump comprises a pump main body, and an electrical equipment case disposed outside the pump main body, wherein the electrical equipment case includes a cooling jacket in which a cooling medium flow passage is formed, and a power supply circuit portion that has a circuit component and can be cooled by the cooling jacket, the power supply circuit portion being attached to the cooling jacket so that heat from the electrical component portion can be transferred, and the cooling jacket includes a jacket main body and a cooling pipe for circulating cooling water in the jacket main body, and partially exposes the cooling pipe toward the power supply circuit portion.

First claim

Opening claim text (preview).

What is claimed is: 1. A vacuum pump, comprising: a pump main body; and a control device disposed outside the pump main body, wherein the control device includes a cooling portion in which a cooling medium flow passage is formed, and an electrical component portion that has a heat generating component and is capable of being cooled by the cooling portion, the electrical component portion is attached to the cooling portion so that heat from the electrical component portion be transferable, the electrical component portion is provided with a circuit board that has the heat generating component mounted thereon and is fixed to the cooling portion, and a mold portion that at least partially covers the circuit board and the heat generating component, the heat is transferable toward the cooling portion via the mold portion, the cooling medium flow passage is formed inside of a cooling pipe casted into the cooling portion, the cooling pipe has an exposed portion which is partially exposed from the cooling portion to the electrical component portion side, and the mold portion is in contact with the exposed portion. 2. The vacuum pump according to claim 1 , wherein a penetrating portion that penetrates the circuit board and which the mold portion enters is formed in the circuit board, and the heat is transferrable toward the cooling portion via the mold portion and the penetrating portion. 3. The vacuum pump according to claim 2 , wherein the cooling portion faces the mold portion entering the penetrating portion, at a position opposite to a side of the circuit board on which the heat generating component is mounted. 4. A control device of a vacuum pump, comprising: a cooling portion in which a cooling medium flow passage is formed; and an electrical component portion that has a heat generating component and is capable of being cooled by the cooling portion, wherein the electrical component portion is attached to the cooling portion so that heat from the electrical component portion be transferable, the electrical component portion is provided with a circuit board that has the heat generating component mounted thereon and is fixed to the cooling portion, and a mold portion that at least partially covers the circuit board and the heat generating component, the heat is transferable toward the cooling portion via the mold portion the cooling medium flow passage is formed inside of a cooling pipe casted into the cooling portion, the cooling pipe has an exposed portion which is partially exposed from the cooling portion to the electrical component portion side, and the mold portion is in contact with the exposed portion.

Assignees

Inventors

Classifications

  • Cooling the control unit · CPC title

  • the conduits for one heat-exchange medium being formed by a single plate-like element (F28D9/0012 takes precedence); the conduits for one heat-exchange medium being integrated in one single plate-like element (F28D9/0012 takes precedence) · CPC title

  • Turbomolecular vacuum pumps · CPC title

  • F04D25/068Primary

    Mechanical details of the pump control unit (pump control details F04D27/00) · CPC title

  • F04B37/14Primary

    to obtain high vacuum · CPC title

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Frequently asked questions

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What does patent US11821440B2 cover?
To provide a vacuum pump capable of efficiently cooling electrical equipment. The vacuum pump comprises a pump main body, and an electrical equipment case disposed outside the pump main body, wherein the electrical equipment case includes a cooling jacket in which a cooling medium flow passage is formed, and a power supply circuit portion that has a circuit component and can be cooled by the co…
Who is the assignee on this patent?
Edwards Japan Ltd
What technology area does this patent fall under?
Primary CPC classification F04D29/5813. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Nov 21 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).