Reducing the influence of thermal expansion of connector pins on a substrate in a vacuum pump

Patent metadata

Field	Value
Publication number	US-9534506-B2
Application number	US-201113877527-A
Country	US
Kind code	B2
Filing date	Jul 28, 2011
Priority date	Oct 19, 2010
Publication date	Jan 3, 2017
Grant date	Jan 3, 2017

Abstract

A vacuum pump including a pump main unit and a control unit is disclosed. The control unit includes a substrate having electronic elements mounted thereon and terminal pins soldered to the substrate at a first end edge of the substrate. The substrate is mounted to a plate via an attachment near a second end edge opposing the first end edge and the plate is mounted to the pump main unit. The terminal pins extend through the plate. Upon linear thermal expansion of the terminal pins, by reason of the location of the terminal pins near the first end edge and the attachment near the second end edge, stresses in the soldered pin connections are reduced. A molding material having a Shore hardness of less than 50, is molded around the electronic elements on the substrate in one embodiment.

First claim

The invention claimed is:

1. A vacuum pump comprising:
a pump main unit having a rotor and sucking a as by rotation of the rotor; and
a control unit configured to control rotation of the rotor;
the control unit further comprising:
a substrate on which electronic elements are mounted;
a plurality of straight pins soldered to the substrate so that the plurality of straight pins are arranged near a first end edge apart from a center of the substrate;
a plate having the plurality of straight pins; and
an attachment attaching the substrate to the plate,
wherein the attachment is arranged near a second end edge apart from the center of the substrate.

2. The vacuum pump of claim 1 , wherein a ratio of a distance from a center of a group of the plurality of straight pins to the attachment to a distance from the center of the group of the plurality of straight pins to the center of the substrate is 1.5 or greater.

3. The vacuum pump of claim 1 wherein the pump main unit includes magnetic bearings and the electronic elements are configured to control the magnetic bearings within the pump main unit to support the rotor.

4. The vacuum pump of claim 1 wherein the electronic elements are configured to control the rotation of the rotor within the pump main unit.

5. The vacuum pump of claim 1 wherein the control unit is configured to control the rotation of the rotor to create a vacuum atmosphere in an area within the pump main unit and wherein the substrate is disposed within the area within the pump main unit having the vacuum atmosphere.

6. The vacuum pump of claim 1 wherein the pump main unit has an inlet port and an exhaust port, the control unit is configured to produce rotation of the rotor to suck the gas into the pump main unit through the inlet port and to exhaust the gas from the pump main unit through the exhaust port, the electronic elements are configured to control at least one aspect of an operation of the pump main unit, and the plurality of straight pins are electrically coupled to the electronic elements.

7. A vacuum pump comprising:
a pump main unit having a rotor and sucking a gas by rotation of the rotor; and
a control unit configured to control rotation of the rotor;
the control unit further comprising:
a substrate on which electronic elements are mounted;
a plurality of pins soldered to the substrate so that the plurality of pins are arranged near an end edge apart from a center of the substrate;
a plate having the plurality of pins;
an attachment attaching the substrate to the plate; and
a molding material for molding the electronic elements on the substrate,

wherein the molding material has a Shore D hardness of less than 50.

8. The vacuum pump of claim 7 wherein the pump main unit includes magnetic bearings and the electronic elements are configured to control the magnetic bearings within the pump main unit to support the rotor.

9. The vacuum pump of claim 7 wherein the electronic elements are configured to control the rotation of the rotor within the pump main unit.

10. The vacuum pump of claim 7 wherein the control unit is configured to control the rotation of the rotor to create a vacuum atmosphere in an area within the pump main unit and wherein the substrate is disposed within the area within the pump main unit having the vacuum atmosphere.

11. The vacuum pump of claim 7 wherein the pump main unit has an inlet port and an exhaust port, the control unit is configured to produce rotation of the rotor to suck the gas into the pump main unit from the inlet port and to exhaust the gas from the pump main unit through the exhaust port, the electronic elements are configured to control at least one aspect of an operation of the pump main unit, and the plurality of pins are electrically coupled to the electronic elements.

12. A vacuum pump comprising:
a pump main unit having a rotor; and
a control unit configured to produce rotation of the rotor within the pump main unit to create an area having a vacuum atmosphere within the pump main unit; and
a plate mounted to the pump main unit and at least partially defining the area having the vacuum atmosphere;
the control unit further comprising:
a substrate disposed within the area having the vacuum atmosphere and having electronic elements mounted thereon for controlling at least one aspect of the operation of the pump main unit, wherein the substrate includes a center and first and second opposed end edges;
a plurality of straight pins extending through the plate, soldered to the substrate and in electrical communication with the electronic elements, the plurality of straight pins being disposed near the first end edge and spaced from the center of the substrate; and
an attachment for attaching the substrate to the plate,

wherein a first end of the substrate adjacent the first end edge having the straight pins soldered thereto is not affixed to the plate so as to permit flexing of the first end of the substrate in response to linear expansion of the plurality of straight pins and wherein a second end of the substrate adjacent the second end edge is fixedly mounted to the plate via the attachment.

Assignees

• Okudera Satoshi
• Schroder Ulrich
• Carrasco Eduardo
• Henry Benoit
• Edwards Japan Ltd
• Soc De Mec Magnetique

Inventors

• Okudera Satoshi
• Schroder Ulrich
• Carrasco Eduardo
• Henry Benoit

Classifications

• F04B37/08 Primary

  by condensing or freezing, e.g. cryogenic pumps · CPC title

• H05K1/144

  Stacked arrangements of planar printed circuit boards · CPC title

• F04D19/042

  Turbomolecular vacuum pumps · CPC title

• H05K2201/10409

  Screws · CPC title

• H05K2201/068

  wherein the coefficient of thermal expansion is important · CPC title