Bonding member and bonding method

Patent metadata

Field	Value
Publication number	US-11819915-B2
Application number	US-201715786964-A
Country	US
Kind code	B2
Filing date	Oct 18, 2017
Priority date	May 29, 2015
Publication date	Nov 21, 2023
Grant date	Nov 21, 2023

Abstract

A bonding member that includes a resin body defining an airtight interior, and a bonding material enclosed in the interior of the resin body. The bonding material is a mixed powder that includes a plurality of particles of a first metal powder and a plurality of particles of a second metal powder. The second metal powder reacts with the first metal powder when melted to thereby produce an intermetallic compound. The resin body has a melting point higher than a softening point of the mixed powder.

First claim

The invention claimed is:

1. A bonding member comprising:
a resin body comprising two resin films attached to each other so as to define an airtight interior; and
a bonding material comprising multiple metal powders, and enclosed within the airtight interior defined by the two resin films,
wherein the two resin films comprise a material having a melting point higher than a melting point of the multiple metal powders, and
wherein the bonding material comprises no flux.

2. The bonding member according to claim 1 , wherein the multiple metal powders comprise a first metal powder, and a second metal powder that reacts with the first metal powder when melted to produce an intermetallic compound that has a higher melting point than the first metal powder.

3. The bonding member according to claim 2 , wherein the first metal powder comprises Sn, and the second metal powder comprises a Cu—Ni alloy, a Cu—Mn alloy, a Cu—Cr alloy, or a Cu—Al alloy.

4. The bonding member according to claim 3 , wherein a ratio between the first metal powder and the second metal powder is within a range of 50:50 to 70:30 by weight.

5. The bonding member according to claim 3 , wherein an average D50 particle size of the first metal powder is within a range of 1 to 30 μm, and an average D50 particle size of the second metal powder is within a range of 1 to 30 μm.

6. The bonding member according to claim 2 , wherein the melting point of the material of the two resin films is in a temperature range in which the intermetallic compound is produced.

7. The bonding member according to claim 1 , wherein the material of the two resin films is selected from polyester resins, polyethylene terephthalate, polybutylene terephthalate, polycarbonate, nylon 6, nylon 66, polyvinyl chloride, polyacetal resins, polyphenylene sulfide, polyimide, polyetheramide, polyetheretherketone, and polypropylene.

8. A bonding method comprising:
disposing a bonding member between a first bonding object and a second bonding object, the bonding member comprising a resin body comprising two resin films attached to each other so as to define an airtight interior, and a bonding material comprising multiple metal powders enclosed within the airtight interior defined by the two resin films, the two resin films comprising a material having a melting point higher than a melting point of the multiple metal powders, and the bonding material comprising no flux; and
applying, to the bonding member disposed between the first bonding object and the second bonding object, a heat treatment at a temperature at which the two resin films are melted.

9. The bonding method according to claim 8 , further comprising applying a pressure to the bonding member through the first bonding object and the second bonding object during the applying of the heat treatment.

10. The bonding method according to claim 8 , wherein the heat treatment is conducted such that the two resin films flow and surround a metal bonding body which is a reaction product of the multiple metal powders.

11. The bonding method according to claim 10 , wherein the two resin films penetrate into voids in the metal bonding body.

12. The bonding method according to claim 8 ,
wherein the multiple metal powders comprise a first metal powder and a second metal powder that reacts with the first metal powder when melted to produce an intermetallic compound that has a higher melting point than the first metal powder, and
at least one of the first bonding object and the second bonding object has a surface that contacts the bonding material and comprises a metal of the second metal powder.

13. The bonding method according to claim 12 , wherein the first metal powder comprises Sn, and the second metal powder comprises a Cu—Ni alloy, a Cu—Mn alloy, a Cu—Cr alloy, or a Cu—Al alloy.

14. The bonding member according to claim 13 , wherein a ratio between the first metal powder and the second metal powder is within a range of 50:50 to 70:30 by weight.

15. The bonding method according to claim 13 , wherein an average D50 particle size of the first metal powder is within a range of 1 to 30 μm, and an average D50 particle size of the second metal powder is within a range of 1 to 30 μm.

16. The bonding method according to claim 12 , wherein the melting point of the material of the two resin films is in a temperature range in which the intermetallic compound is produced.

17. The bonding method according to claim 8 , wherein the material of the two resin films is selected from polyester resins, polyethylene terephthalate, polybutylene terephthalate, polycarbonate, nylon 6, nylon 66, polyvinyl chloride, polyacetal resins, polyphenylene sulfide, polyimide, polyetheramide, polyetheretherketone, and polypropylene.

Assignees

• Murata Manufacturing Co

Inventors

• Washizuka Seitaro

Classifications

• H05K3/3465

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• B22F1/09 Primary

  Mixtures of metallic powders · CPC title

• B22F7/064

  using an intermediate powder layer · CPC title

• B23K1/0002

  Soldering by means of dipping in a fused salt bath · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title