Bonding member and bonding method
US-11819915-B2 · Nov 21, 2023 · US
Soldering by means of dipping in a fused salt bath · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K1/0002 |
| Official title | {Soldering by means of dipping in a fused salt bath} |
| Display label | Soldering by means of dipping in a fused salt bath |
| Total patents | 4 |
Year-over-year patent counts classified under this CPC code.
Filing activity appears stable based on the most recent years.
| Year | Patents |
|---|---|
| 2017 | 1 |
| 2018 | 1 |
| 2020 | 1 |
| 2023 | 1 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-11819915-B2 · Nov 21, 2023 · US
US-2020047289-A1 · Feb 13, 2020 · US
US-2018036798-A1 · Feb 8, 2018 · US
US-2017197270-A1 · Jul 13, 2017 · US