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Soldering by means of dipping in a fused salt bath

Soldering by means of dipping in a fused salt bath · Cooperative Patent Classification (CPC)

Separating, mixing, shaping, printing, and transporting materials.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeB23K1/0002
Official title{Soldering by means of dipping in a fused salt bath}
Display labelSoldering by means of dipping in a fused salt bath
Total patents4

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity appears stable based on the most recent years.

Patents filed per year
YearPatents
20171
20181
20201
20231

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.