Electronic device

Patent metadata

Field	Value
Publication number	US-11789504-B2
Application number	US-202117474564-A
Country	US
Kind code	B2
Filing date	Sep 14, 2021
Priority date	Jun 4, 2014
Publication date	Oct 17, 2023
Grant date	Oct 17, 2023

Abstract

An electronic device includes a heat emitting element disposed on a circuit board and a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1 degrees Celsius per Watt (° C./W).

First claim

What is claimed is:

1. An electronic device, comprising:
a circuit board;
a heat emitting element disposed on the circuit board;
a heat pipe group disposed on the heat emitting element and comprising at least two heat pipes, wherein the at least two heat pipes have at least one different characteristic parameter, wherein optimal working regions of the at least two heat pipes to emit heat from the heat emitting element are different, wherein a first one of the at least two heat pipes performs heat dissipation on the heat emitting element when power consumption of the heat emitting element is relatively high, wherein a second one of the at least two heat pipes performs the heat dissipation on the heat emitting element when the power consumption of the heat emitting element is relatively low, wherein thermal resistance ranges of the at least two heat pipes are 0.05-1 degrees Celsius per Watt (° C./W) when in the optimal working regions, wherein the optimal working regions correspond to different power consumptions of the heat emitting element, wherein a first thermal resistance of the first one of the at least two heat pipes is lower than a second thermal resistance of the second one of the at least two heat pipes when the power consumption of the heat emitting element is relatively high, and wherein the second thermal resistance is lower than the first thermal resistance when the power consumption of the heat emitting element is relatively low; and
a thermal interface material disposed between the heat emitting element and the heat pipe group.

2. The electronic device of claim 1 , wherein the at least one different characteristic parameter is one or more of a pipe diameter of one of the at least two heat pipes, a capillary layer cross-sectional area of the one of the at least two heat pipes, a working substance amount of the one of the at least two heat pipes, a working substance type of the one of the at least two heat pipes, a pipe material of the one of the at least two heat pipes, or a pipe material thickness when the at least two heat pipes are made of a same material.

3. The electronic device of claim 2 , wherein the at least two heat pipes comprise a first heat pipe and a second heat pipe, wherein when the at least one different characteristic parameter comprises the pipe diameter, a first pipe diameter of the first heat pipe is greater than a second pipe diameter of the second heat pipe, other characteristic parameters of the first heat pipe and the second heat pipe are the same, the first heat pipe is a high-temperature efficient heat pipe, and the second heat pipe is a low-temperature efficient heat pipe, wherein when the at least one different characteristic parameter comprises the capillary layer cross-sectional area, a first capillary layer cross-sectional area of the first heat pipe is greater than a second capillary layer cross-sectional area of the second heat pipe, the other characteristic parameters of the first heat pipe and the second heat pipe are the same, the first heat pipe is the high-temperature efficient heat pipe, and the second heat pipe is the low-temperature efficient heat pipe, wherein when the at least one different characteristic parameter comprises the working substance amount, a first working substance amount of the first heat pipe is an actual capillary requirement, a second working substance amount of the second heat pipe is less than the actual capillary requirement, the other characteristic parameters of the first heat pipe and the second heat pipe are the same, the first heat pipe is the high-temperature efficient heat pipe, and the second heat pipe is the low-temperature efficient heat pipe, or wherein when the at least one different characteristic parameter comprises the working substance type, a first working substance type of the first heat pipe has a first latent heat that is greater than a second latent heat of a second working substance type of the second heat pipe, the other characteristic parameters of the first heat pipe and the second heat pipe are the same, the first heat pipe is the high-temperature efficient heat pipe, and the second heat pipe is the low-temperature efficient heat pipe.

4. The electronic device of claim 1 , wherein the heat emitting element comprises a central processing unit (CPU), a graphics processing unit (GPU), or the CPU and the GPU.

5. The electronic device of claim 1 , wherein the at least one different characteristic parameter is a pipe diameter of one of the at least two heat pipes.

6. The electronic device of claim 1 , wherein the at least one different characteristic parameter is a capillary layer cross-sectional area of one of the at least two heat pipes.

7. The electronic device of claim 1 , wherein the at least one different characteristic parameter is a working substance amount of one of the at least two heat pipes.

8. The electronic device of claim 1 , wherein the at least one different characteristic parameter is a working substance type of one of the at least two heat pipes.

9. The electronic device of claim 1 , wherein the at least one different characteristic parameter is a pipe material of one of the at least two heat pipes.

10. The electronic device of claim 1 , wherein the at least one different characteristic parameter is a pipe material thickness of one of the at least two heat pipes.

11. The electronic device of claim 1 , wherein the heat emitting element comprises a central processing unit (CPU).

12. The electronic device of claim 1 , wherein the heat emitting element comprises a graphics processing unit (GPU).

13. An electronic device, comprising:
a circuit board;
a heat emitting element disposed on the circuit board;
a heat pipe disposed on the heat emitting element and comprising at least two independent heat conduction paths, wherein the at least two independent heat conduction paths have at least one different characteristic parameter, wherein optimal working regions of the at least two independent heat conduction paths to emit heat from the heat emitting element are different, wherein a first one of the at least two independent heat conduction paths performs heat dissipation on the heat emitting element when power consumption of the heat emitting element is relatively high, wherein a second one of the at least two independent heat conduction paths performs the heat dissipation on the heat emitting element when the power consumption of the heat emitting element is relatively low, wherein thermal resistance ranges of the at least two independent heat conduction paths are 0.05-1 degrees Celsius per Watt (° C./W) when in the optimal working regions, wherein the optimal working regions correspond to different power consumptions of the heat emitting element, wherein a first thermal resistance of the first one of the at least two independent heat conduction paths is lower than a second thermal resistance of the second one of the at least two independent heat conduction paths when the power consumption of the heat emitting element is relatively high, and wherein the second thermal resistance is lower than the first thermal resistance when the power consumption of the heat emitting element is relatively low; and
a thermal interface material disposed between the heat emitting element and the heat pipe.

14. The electronic device of claim 13 , wherein the at least one different characteristic parameter is one or more of a diameter of a heat conduction path, a capillary layer cross-sectional area of the heat conduction path, a working substance amount of the heat conduction path, a working substance type of the heat conduction path, a pipe material of the heat

Assignees

• Huawei Tech Co Ltd

Inventors

• Jin Linfang
• Hui Xiaowei
• Yang Xiangyang
• Zhou Shaoxin

Classifications

• G06F1/20 Primary

  Cooling means · CPC title

• F28D15/0275

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• G06F1/203

  for portable computers, e.g. for laptops · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H05K7/20336

  Heat pipes, e.g. wicks or capillary pumps · CPC title