Electronic device

Patent metadata

Field	Value
Publication number	US-11144101-B2
Application number	US-201916529075-A
Country	US
Kind code	B2
Filing date	Aug 1, 2019
Priority date	Jun 4, 2014
Publication date	Oct 12, 2021
Grant date	Oct 12, 2021

Abstract

An electronic device includes a heat emitting element disposed on a PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.

First claim

What is claimed is:

1. A mobile phone, comprising:
a circuit board;
a heat emitting element disposed on a first side of the circuit board, wherein the heat emitting element comprises a first heating element and a second heating element, and wherein the first heating element or the second heating element is a central processing unit (CPU); and
a heat pipe group comprising:
a first heat pipe positioned on the first heating element such that the first heat pipe is separated from the circuit board by the first heating element, wherein the first heat pipe is configured to absorb heat generated from both the first heating element and the second heating element, and wherein the first heat pipe operates in a first working area when a first power consumption of the first heating element is in a first power consumption state; and
a second heat pipe positioned on the second heating element such that the second heat pipe is separated from the circuit board by the second heating element, wherein the second heat pipe is configured to absorb heat generated from both the first heating element and the second heating element, wherein the second heat pipe operates in a second working area when a second power consumption of the second heating element is in a second power consumption state, wherein the first power consumption is different from the second power consumption, wherein the first working area corresponding to the first heat pipe is different from the second working area corresponding to the second heat pipe, wherein a thermal resistance range of the first heat pipe and the second heat pipe is 0.05-1 degrees Celsius per watt (° C./W) when the first heat pipe works in the first working area and the second heat pipe works in the second working area, wherein the first power consumption is greater than the second power consumption, and wherein the first heat pipe has a lower thermal resistance when the first power consumption of the first heating element is at the first power consumption state than when the second power consumption of the second heating element is at the second power consumption state.

2. The mobile phone of claim 1 , wherein the first heat pipe and the second heat pipe have different characteristic parameters, wherein the characteristic parameters comprise maximum heat transfer capacity, capillary layer sectional area, and pipe thickness, and wherein the maximum heat transfer capacity, the capillary layer sectional area, and the pipe thickness of the first heat pipe are different from those of the second heat pipe.

3. The mobile phone of claim 1 , wherein the first heating element or the second heating element that is not the CPU is a graphic processing unit (GPU).

4. The mobile phone of claim 1 , wherein the first heating element is the CPU, and wherein the second heating element is a graphics processing unit (GPU).

5. The mobile phone of claim 1 , wherein the first heating element is a graphics processing unit (GPU), and wherein the second heating element is the CPU.

6. The mobile phone of claim 1 , wherein the first heat pipe and the second heat pipe are formed of copper.

7. The mobile phone of claim 1 , wherein the first heat pipe and the second heat pipe are formed of aluminum.

8. The mobile phone of claim 1 , wherein the first power consumption comprises approximately 10 watts, and wherein the second power consumption comprises approximately 2-3 watts.

9. The mobile phone of claim 1 , wherein optimal working regions of the first heat pipe and the second heat pipe do not overlap.

10. An electronic device, comprising:
a circuit board;
a heat emitting element disposed on a first side of the circuit board, wherein the heat emitting element comprises a first heating element and a second heating element, and wherein the first heating element or the second heating element is a central processing unit (CPU); and
a heat pipe group comprising:
a first heat pipe positioned on the first heating element such that the first heat pipe is separated from the circuit board by the first heating element, wherein the first heat pipe is configured to absorb heat generated from both the first heating element and the second heating element, and wherein the first heat pipe operates in a first working area when a first power consumption of the first heating element is in a first power consumption state; and
a second heat pipe positioned on the second heating element such that the second heat pipe is separated from the circuit board by the second heating element, wherein the second heat pipe is configured to absorb heat generated from both the first heating element and the second heating element, wherein the second heat pipe operates in a second working area when a second power consumption of the second heating element is in a second power consumption state, wherein the first power consumption is different from the second power consumption, wherein the first working area corresponding to the first heat pipe is different from the second working area corresponding to the second heat pipe, wherein a thermal resistance range of the first heat pipe and the second heat pipe is 0.05-1 degrees Celsius per watt (° C./W) when the first heat pipe works in the first working area and the second heat pipe works in the second working area, wherein the first power consumption is greater than the second power consumption, and wherein the first heat pipe has a lower thermal resistance when the first power consumption of the first heating element is at the first power consumption state than when the second power consumption of the second heating element is at the second power consumption state.

11. The electronic device of claim 10 , wherein the first heat pipe and the second heat pipe have different characteristic parameters, wherein the characteristic parameters comprise maximum heat transfer capacity, capillary layer sectional area, and pipe thickness, and wherein the maximum heat transfer capacity, the capillary layer sectional area, and the pipe thickness of the first heat pipe are different from those of the second heat pipe.

12. The electronic device of claim 10 , wherein the first heating element or the second heating element that is not the CPU is a graphic processing unit (GPU).

13. The electronic device of claim 10 , wherein the first heating element is the CPU, and wherein the second heating element is a graphics processing unit (GPU).

14. The electronic device of claim 10 , wherein the first heating element is a graphics processing unit (GPU), and wherein the second heating element is the CPU.

15. The electronic device of claim 10 , wherein the first heat pipe and the second heat pipe are formed of copper.

16. The electronic device of claim 10 , wherein the first heat pipe and the second heat pipe are formed of aluminum.

17. The electronic device of claim 10 , wherein the first power consumption comprises approximately 10 watts, and wherein the second power consumption comprises approximately 2-3 watts.

18. The electronic device of claim 10 , wherein optimal working regions of the first heat pipe and the second heat pipe do not overlap.

Assignees

• Huawei Tech Co Ltd

Inventors

• Jin Linfang
• Hui Xiaowei
• Yang Xiangyang
• Zhou Shaoxin

Classifications

• F28D15/0275

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• G06F1/20 Primary

  Cooling means · CPC title

• G06F1/203

  for portable computers, e.g. for laptops · CPC title

• H05K7/20336

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title