Electronic device

Patent metadata

Field	Value
Publication number	US-10409340-B2
Application number	US-201415311927-A
Country	US
Kind code	B2
Filing date	Jun 4, 2014
Priority date	Jun 4, 2014
Publication date	Sep 10, 2019
Grant date	Sep 10, 2019

Abstract

An electronic device is provided. The electronic device includes a heat emitting element, and the heat emitting element is disposed on a circuit board PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.

First claim

What is claimed is:

1. An electronic device comprising:
a printed circuit board (PCB);
a heat emitting element disposed on the PCB; and
a heat pipe group coupled to the heat emitting element, the heat pipe group comprising:
a first heat pipe coupled to the heat emitting element and comprising a first low thermal resistance within a first working region, the first working region defining a first power dissipation region with the first low thermal resistance and a first heat conduction path during low power consumption of the heat emitting element, the first heat pipe conducting a heat load up to a first heat load within the first working region, the first heat pipe comprising a first characteristic parameter; and
a second heat pipe coupled to the heat emitting element and comprising a second low thermal resistance within a second working region, the second working region of the second heat pipe defining a second power dissipation region with the second low thermal resistance and a second heat conduction path during high power consumption of the heat emitting element, the second heat pipe conducting a heat load exceeding the first heat load within the second working region, the second heat pipe comprising a second characteristic parameter, the first heat conduction path being different than the second heat conduction path, a thermal resistance range of the first heat pipe and the second heat pipe being 0.05-1 degrees Celsius per watt (° C./W) when the first heat pipe works in the first working region and the second heat pipe works in the second working region, and the low power consumption of the heat emitting element being lower than the high power consumption of the heat emitting element, the first characteristic parameter and the second characteristic parameter comprising a working substance type, the first heat pipe comprising a first latent heat of vaporization of a first working substance type injected in a longitudinal cavity of the first heat pipe and the second heat pipe comprising a second latent heat of vaporization of a second working substance type injected in a longitudinal cavity of the second heat pipe, and the second heat pipe being a high-temperature efficient heat pipe and the first heat pipe being a low-temperature efficient heat pipe when the first latent heat of vaporization is greater than the second latent heat of vaporization.

2. The electronic device of claim 1 , wherein the first characteristic parameter and the second characteristic parameter are different characteristic parameters, the different characteristic parameters further comprise at least one characteristic parameter selected from the group comprising a pipe diameter, a capillary layer cross-sectional area, a working substance amount, a pipe material, and a pipe material thickness.

3. The electronic device of claim 2 , wherein the first characteristic parameter comprises a first pipe diameter and the second characteristic parameter comprises a second pipe diameter, and the second heat pipe being a high-temperature efficient heat pipe and the first heat pipe being a low-temperature efficient heat pipe when the first pipe diameter is lesser relative to the second pipe diameter.

4. The electronic device of claim 2 , wherein the first characteristic parameter and the second characteristic parameter comprise the capillary layer cross-sectional area, the first heat pipe comprising a first capillary layer cross-sectional area and the second heat pipe comprising a second capillary layer cross-sectional area, and the second heat pipe is a high-temperature efficient heat pipe and the first heat pipe is a low-temperature efficient heat pipe when the first capillary layer cross-sectional area is lesser than the second capillary layer cross-sectional area.

5. The electronic device of claim 2 , wherein the first characteristic parameter and the second characteristic parameter comprise the working substance amount, the first heat pipe comprising a first working substance amount injected in a longitudinal cavity of the first heat pipe and the second heat pipe comprising a second working substance amount injected in a longitudinal cavity of the second heat pipe, and the second heat pipe being a high-temperature efficient heat pipe and the first heat pipe being a low-temperature efficient heat pipe when the second working substance amount is equal to or greater than a capillary requirement and the first working substance amount is less than the capillary requirement.

6. The electronic device of claim 1 , further comprising a thermal interface material disposed between the heat emitting element and the heat pipe group.

7. The electronic device of claim 1 , wherein the heat emitting element is a central processing unit (CPU), a graphics processing unit (GPU), or both a CPU and a GPU.

8. An electronic device comprising:
a printed circuit board (PCB);
a heat emitting element disposed on the PCB; and
a heat pipe coupled to the heat emitting element, the heat pipe comprising a first and a second heat conduction path, the heat pipe having a first low thermal resistance within a first working region of the heat pipe and a second low thermal resistance within a second working region of the heat pipe, the first working region defining a first power dissipation region with the first low thermal resistance and a first heat conduction path during a first power consumption of the heat emitting element, the first heat pipe conducting a heat load up to a first heat load within the first working region, the second working region defining a second power dissipation region with the second low thermal resistance and a second heat conduction path during a second power consumption of the heat emitting element, the heat pipe conducting a heat load exceeding the first heat load within the second working region, the first heat conduction path being different than the second heat conduction path, and a thermal resistance range of the first heat conduction path and the second heat conduction path of the heat pipe is 0.05-1 degrees Celsius per watt (° C./W) when the first heat conduction path and the second heat conduction path of the heat pipe works in the first working region and works in the second working region, the first power consumption of the heat emitting element being lower than the second power consumption of the heat emitting element, the first heat conduction path having a first characteristic parameter and the second heat conduction path having a second characteristic parameter, the first characteristic parameter and the second characteristic parameter comprising a working substance type, the heat pipe comprising a first latent heat of vaporization of a first working substance type injected in a longitudinal cavity of the heat pipe and a second latent heat of vaporization of a second working substance type injected in the longitudinal cavity of the heat pipe, and the first latent heat of vaporization is greater than the second latent heat of vaporization.

9. The electronic device of claim 8 , wherein the first characteristic parameter and the second characteristic parameter are different characteristic parameters, the different characteristic parameters further comprise at least one characteristic parameter selected from the group comprising a diameter, a capillary layer cross-sectional area, a working substance amount, a pipe material, or a pipe material thickness.

10. The electronic device of claim 8 , further comprising a thermal interface material disposed between the heat emitting element and the heat pipe.

11. An electronic device comprising:
a printed circuit board (PCB) comprising a front side and a back side;
a heat emitting element disposed on t

Assignees

• Huawei Tech Co Ltd

Inventors

• Jin Linfang
• Hui Xiaowei
• Yang Xiangyang
• Zhou Shaoxin

Classifications

• G06F1/203

  for portable computers, e.g. for laptops · CPC title

• F28D15/0275

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• H05K7/20336

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• G06F1/20 Primary

  Cooling means · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title