Multi-component shared cooling system

Patent metadata

Field	Value
Publication number	US-9459669-B2
Application number	US-201414166351-A
Country	US
Kind code	B2
Filing date	Jan 28, 2014
Priority date	Jan 28, 2014
Publication date	Oct 4, 2016
Grant date	Oct 4, 2016

Abstract

Multi-component shared cooling systems include a chassis housing a first heat exchanger device and a second heat exchanger device. A first component such as, for example, a system processor, is housed in the chassis, includes a first thermal connection to the first heat exchanger device, and includes a second thermal connection to the second heat exchanger device. A second component such as, for example, a graphics processor, is housed in the chassis and includes a third thermal connection to the first heat exchanger device. The first heat exchanger device is configured to dissipate heat that is produced by the second component and transmitted by the third thermal connection. The second heat exchanger device is configured to dissipate the heat that is produced by the second component and transmitted by the third thermal connection, the first heat exchanger device, the first thermal connection, the first component, and the second thermal connection.

First claim

What is claimed is:

1. A component cooling system, comprising:
a chassis including an outer surface and a plurality of vents allowing air to pass through the chassis;
a first heat sink located in the chassis and adjacent to a first one of the vents;
a second heat sink located in the chassis and adjacent to a second one of the vents;
a plurality of heat producing components located in the chassis, the plurality of heat producing components including a first heat producing component and a second heat producing component;
wherein the first heat producing component is directly connected to a first heat pipe that extends between the first heat producing component and the first heat sink such that the first heat sink is not adjacent to the first heat producing component, and that is directly connected to a second heat pipe that extends between the first heat producing component and the second heat sink such that the second heat sink is not adjacent to any of the heat producing component, and
wherein the second heat producing component is directly connected to a third heat pipe that extends between the second heat producing component and the first heat sink such that the first heat sink is not adjacent to any of the heat producing components,
wherein the first heat sink and the second heat sink are configured to dissipate heat that is produced by the first heat producing component and the second heat producing component and conducted through the first heat pipe, the second heat pipe, and the third heat pipe, and
wherein the configuration of the third heat pipe, the first heat sink, the first heat pipe, the first heat producing component, the second heat pipe, and the second heat sink provides for the dissipation of the heat by the first heat sink and the second heat sink as well as the conduction of the heat that is produced by the second heat producing component sequentially through the third heat pipe, the first heat sink, the first heat pipe, the first heat producing component, the second heat pipe, and the second heat sink while ensuring that no portion of the outer surface of the chassis exceeds a predetermined temperature.

2. The multi-component cooling system of claim 1 , further comprising: a fan located adjacent to the first heat sink and configured to provide an airflow through the first sink.

3. The multi-component cooling system of claim 1 , further comprising: a fan located adjacent to the second heat sink and configured to provide an airflow through the second heat sink.

4. The multi-component cooling system of claim 1 , wherein the first heat producing component includes one of a system processor and graphics processor.

5. The multi-component cooling system of claim 4 , wherein the second heat producing component includes another of the system processor and the graphics processor.

6. The multi-component cooling system of claim 1 , wherein the first heat sink includes a plurality of first fins and the second heat sink includes a plurality of second fins.

7. The multi-component cooling system of claim 1 , wherein the predetermined temperature is less than 42° Celsius.

8. An information handling system (IHS) comprising:
a chassis including a plurality of vents allowing air to pass through the chassis;
a first heat sink located in the chassis and adjacent to a first one of the vents;
a second heat sink located in the chassis and adjacent to a second one of the vents; and
a plurality of heat producing components located in the chassis, the plurality of heat producing components including a graphics processor and a system processor;
wherein one of the graphics processor and the system processor is:
directly connected to a first heat pipe that extends between the one of the graphics processor and the system processor and the first heat sink such that the first heat sink is not adjacent to any of the heat producing components; and
directly connected to a second heat pipe that extends between the one of the graphics processor and the system processor and the second heat sink such that the second heat sink is not adjacent to any of the heat producing components; and

wherein another of the graphics processor and the system processor is directly connected to a third heat pipe that extends between the another of the graphics processor and the system processor and the first heat sink such that the first heat sink is not adjacent to any of the heat producing components,
wherein the first heat sink and the second heat sink are configured to dissipate heat that is produced by the graphics processor and the system processor and conducted through the first heat pipe, the second heat pipe, and the third heat pipe; and
wherein the configuration of the third heat pipe, the first heat sink, the first heat pipe, the one of the graphics processor and the system processor, the second heat pipe, and the second heat sink provides for the dissipation of the heat by the first heat sink and the second heat sink as well as the conduction of the heat that is produced by the another of the graphics processor and the system processor sequentially through the third heat pipe, the first heat sink, the first heat pipe, the one of the graphics processor and the system processor, the second heat pipe, and the second heat sink while ensuring that no portion of a user engagement surface on the chassis exceeds a predetermined temperature.

9. The IHS of claim 8 , further comprising: a fan located in the chassis and adjacent to the first heat sink, wherein the fan is configured to provide an airflow through the first heat sink.

10. The IHS of claim 8 , further comprising: a fan located in the chassis and adjacent to the second heat sink, wherein the fan is configured to provide an airflow through the second heat sink.

11. The IHS of claim 8 , wherein the system processor produces a temperature of over 85° Celsius during operation.

12. The IHS of claim 11 , wherein the predetermined temperature is less than 42° Celsius during operation of the system processor.

13. The IHS of claim 8 , wherein the first heat sink includes a plurality of fins.

14. The IHS of claim 8 , wherein the second heat sink includes a plurality of fins.

15. A method for cooling an information handling system (IHS), comprising:
providing a chassis including a plurality of vents allowing air to pass through the chassis
providing a plurality of first heat producing components located in the chassis to produce heat, the plurality of heat producing components including a first heat producing component and a second heat producing component, wherein the first heat producing component is:
directly connected to a first heat pipe that extends between the first heat producing component and a first heat sink located in the chassis and adjacent to a first one of the vents such that the first heat sink is not adjacent to any of the heat producing components; and
directly connected to a second heat pipe that extends between the first heat producing component and a second heat sink located in the chassis and adjacent to a second one of the vents such that the second heat sink is not adjacent to any of the heat producing components;

operating the second heat producing component to produce heat, wherein the second heat producing component is:
directly connected to a third heat pipe that extends between the second heat producing component and the first heat sink such that the first heat sink is not adjacent to any of the heat producing components;

dissipating heat produced by the first heat producing component and the second heat producing component using the first heat sink and t

Assignees

• Dell Products Lp

Inventors

• Hrehor Jr Robert D
• North Travis Christian

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• H05K7/20809

  within server blades for removing heat from heat source · CPC title

• G06F1/203 Primary

  for portable computers, e.g. for laptops · CPC title

• H05K7/20336

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• G06F1/206

  comprising thermal management · CPC title