Hermetic semiconductor packages

Patent metadata

Field	Value
Publication number	US-11784102-B2
Application number	US-202117389294-A
Country	US
Kind code	B2
Filing date	Jul 29, 2021
Priority date	Jul 29, 2020
Publication date	Oct 10, 2023
Grant date	Oct 10, 2023

Abstract

A semiconductor package and method for forming thereof are disclosed. The package includes a package substrate having a die cavity with a die attached therein. The package substrate also includes a cavity for bonding a cap thereto to form a hermetic package. The cap is bonded to the cavity using sealing rings.

First claim

What is claimed is:

1. A hermetic package comprising:
a package substrate having a top substrate surface and a bottom substrate surface, the package substrate comprises
a bottom cavity having a bottom cavity bottom surface and bottom cavity sidewalls, wherein the bottom cavity is configured to accommodate a die within the bottom cavity,
a top cavity disposed over the bottom cavity, wherein the top cavity comprises a larger footprint than the bottom cavity, the top cavity having a top cavity bottom surface at a top of the bottom cavity and top cavity sidewalls,
a package bonding region, the package bonding region is a part of the top cavity, the package bonding region includes a first sealing region and a second sealing region,
a first sealing ring bonded to the first sealing region disposed on a first surface of the top cavity, and
a second sealing ring bonded to the second sealing region disposed on a second surface of the top cavity, wherein the first and second surfaces are different surfaces of the top cavity, the first and second sealing rings comprise solid metallic sealing rings;

a die attach region disposed within the bottom cavity bottom surface, the die attach region comprises a footprint smaller than the bottom cavity bottom surface;
a die with inactive and active die surfaces, wherein the inactive surface of the die is attached within the die attach region on the bottom cavity bottom surface, wherein the die includes die pads on the active die surface electrically coupled to package pads disposed on the package substrate;
a cap with a cap bonding region having a first cap sealing region and a second cap sealing region, where the cap bonding region comprises seam bonds with the first and second sealing rings to create a hermetically sealed cavity for the die.

2. The package of claim 1 wherein:
the cap comprises a planar cap having top and bottom major cap surfaces and cap side surfaces;
the first cap sealing region is disposed at the periphery of the bottom major cap surface;
the second cap sealing region is disposed at the cap side surfaces;
the first sealing region is disposed on the top cavity bottom surface;
the second sealing region is disposed on the top cavity sidewalls; and
wherein the bottom major surface of the planar cap forms the hermetically sealed cavity with the bottom cavity with the die.

3. The package of claim 2 wherein:
the package pads are disposed on the top cavity bottom surface inside of the first sealing region with the first sealing ring;
wire bonds electrically connect the package pads to die pads; and
wherein the first sealing ring provides sufficient height for the cap to accommodate the wire bonds.

4. The package of claim 3 wherein:
the cap comprises a metallic cap; and
the bottom major cap surface comprises an insulating layer to prevent shorting of the wire bonds.

5. The package of claim 1 wherein:
the cap comprises a recessed cap, the recessed cap includes
a planar member top and bottom major cap surfaces,
a leg member surrounding the planar member, the leg member includes inner, outer and bottom leg member surfaces,
a cap cavity defined by inner leg member surfaces and the bottom the bottom major cap surface;

the first cap sealing region is disposed on the bottom leg member surfaces;
the second cap sealing region is disposed on a lower portion of the outer leg member surfaces;
the first sealing region is disposed on the top cavity bottom surface;
the second sealing region is disposed on the top cavity sidewalls; and
wherein the planar member extends above the top cavity and the cap cavity forms the hermetically sealed cavity with the bottom cavity with the die.

6. The package of claim 5 wherein:
the package pads are disposed on the top cavity bottom surface inside of the first sealing region with the first sealing ring; and
wire bonds electrically connect the package pads to die pads.

7. The package of claim 6 wherein:
the cap comprises a metallic cap; and
the cap cavity provide sufficient space between the wire bonds and the metallic cap to prevent shorting.

8. The package of claim 6 wherein the cap comprises a metallic cap.

9. The package of claim 1 wherein the package substrate further includes an intermediate cavity disposed between the top cavity and the bottom cavity, the intermediate cavity comprises:
an intermediate cavity footprint which is larger than the footprint of the bottom cavity and smaller than the top cavity;
an intermediate bottom surface at the top of the bottom cavity sidewalls; and
intermediate cavity inner sidewalls abutting the top cavity bottom surface and intermediate bottom surface.

10. The package of claim 9 wherein:
the cap comprises a planar cap having top and bottom major cap surfaces and cap side surfaces;
the first cap sealing region is disposed at the periphery of the bottom major cap surface;
the second cap sealing region is disposed at the cap side surfaces;
the first sealing region is disposed on the top cavity bottom surface;
the second sealing region is disposed on top cavity sidewalls; and
wherein the bottom major surface of the planar cap forms the hermetically sealed cavity with the intermediate cavity and bottom cavity with the die.

11. The package of claim 10 wherein:
the package pads are disposed on the intermediate cavity bottom surface;
wire bonds electrically connect the package pads to die pads; and
wherein the intermediate cavity provides sufficient height for the cap to accommodate the wire bonds without shorting.

12. The package of claim 11 wherein the cap comprises a metallic cap.

13. The package of claim 9 wherein:
the cap comprises a recessed cap, the recessed cap includes
a planar member top and bottom major cap surfaces,
a leg member surrounding the planar member, the leg member includes inner, outer and bottom leg member surfaces,
a cap cavity defined by inner leg member surfaces and the bottom the bottom major cap surface;

the first cap sealing region is disposed on the bottom leg member surfaces;
the second cap sealing region is disposed on a lower portion of the outer leg member surfaces;
the first sealing region is disposed on the top cavity bottom surface;
the second sealing region is disposed on the top cavity sidewalls; and
wherein the planar member extends above the top cavity and the cap cavity forms the hermetically sealed cavity with the intermediate cavity and bottom cavity with the die.

14. The package of claim 13 wherein:
the package pads are disposed on the intermediate bottom cavity surface; and
wire bonds electrically connect the package pads to die pads.

15. The package of claim 1 wherein the top cavity comprises:
a top cavity top surface abutting the top cavity sidewalls;
top cavity outer sidewalls abutting the top cavity top surface; and
a top cavity outer bottom surface abutting a bottom of the top cavity outer sidewalls.

16. The package of claim 15 wherein:
the cap comprises a recessed cap, the recessed cap includes
a planar member top and bottom major cap surfaces,
a leg member surrounding the planar member, the leg member includes inner, outer and bottom leg member surfaces,
a cap cavity defined by inner leg member surfaces and the bottom the bottom major cap surface;

the first cap sealing region is disposed on the bottom leg member surfaces;
the second cap sealing region is disposed on a periphery of the bottom major surface adjacent to the leg member;
the first sealing region is disposed on the top cavity outer bottom surface; and
the se

Assignees

• Utac Headquarters Pte Ltd

Inventors

• Dumsong Eakkasit
• Candelario Mike Jayson
• Sawasdee Phongsak
• Charoenratpratoom Jiraphat
• Phatto Paweena
• Saithong Maythichai

Classifications

• H10W72/071

  Connecting or disconnecting · CPC title

• H10W42/00

  Arrangements for protection of devices (arrangements for thermal protection H10W40/00) · CPC title

• H10W76/60

  Seals · CPC title

• H10W76/15 Primary

  Containers comprising an insulating or insulated base · CPC title

• H10W95/00 Primary

  Packaging processes not covered by the other groups of this subclass · CPC title