Light emitting device package

Patent metadata

Field	Value
Publication number	US-9842975-B2
Application number	US-201615082091-A
Country	US
Kind code	B2
Filing date	Mar 28, 2016
Priority date	Sep 25, 2012
Publication date	Dec 12, 2017
Grant date	Dec 12, 2017

Abstract

A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.

First claim

What is claimed is:

1. A light emitting device package comprising:
a package body including ceramic material and a cavity;
a pad disposed at the package;
a light emitting device electrically connected to the pad;
a metal layer inserted into the package body and including a body, an upper surface and a lower surface; and
an electrode disposed at the package body,
wherein the pad vertically overlaps with the metal layer,
wherein the light emitting device emits light in a wavelength range of 190 nm to 290 nm,
wherein the light emitting device has a first conductive type semiconductor layer, a second conductive type semiconductor layer, an active layer including an AlGaN barrier layer disposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer, and a conductive clad layer including AlGaN or InAlGaN disposed on the active layer,
wherein a portion of the package body is disposed between the light emitting device and the metal layer,
wherein at least one width of the upper surface and the lower surface of the metal layer is wider than a width of the body of the metal layer, and
wherein the upper surface of the metal layer has a first part and the first part is provided outwardly from a side surface of the body of the metal layer, the lower surface of the metal layer has a second part and the second part is provided outwardly from the side surface of the body of the metal layer, and a width of the first part and a width of the second part are different.

2. The light emitting device package according to claim 1 , wherein the cavity has a first side surface and a second side surface, and a width between the first side surface and the second side surface of the cavity is narrower than a maximum width of the metal layer.

3. The light emitting device package according to claim 1 , wherein the cavity includes a first cavity and a second cavity, the pad is disposed on a bottom surface of the first activity, the light emmitting device is disposed on the second cavity, the first cavity has a step portion, and the scond cavity is provided at the bottom surface of the first cavity.

4. The light emitting device package according to claim 1 , wherein the width of the upper surface of the metal layer is narrower than the width of the lower surface of the metal layer.

5. The light emitting device package according to claim 1 , wherein the width of the upper surface of the metal layer is wider than the width of the lower surface of the metal layer.

6. The light emitting device package according to claim 1 , wherein the width of the upper surface of the metal layer is different from the width of the lower surface of the metal layer.

7. The light emitting device packaged according to claim 1 , wherein a width of a top open region of the cavity is wider than a width of a bottom surface of the cavity.

8. The light emitting device package according to claim 1 , wherein the electrode has a first portion and a second portion vertically overlaps with the first portion, and the first portion is disposed in the package body and the second portion is disposed under a bottom surface of the package body.

9. The light emitting device package according to claim 1 , further comprising an adhesive layer disposed between the light emitting device and the package body.

10. The light emitting device package according to claim 3 , wherein a top surface of the light emitting device is disposed above the second cavity.

11. The light emitting device package according to claim 10 , wherein the bottom surface of the electrode is disposed under the bottom surface of the package body.

12. The light emitting device package according to claim 3 , wherein the pad is spaced apart from an edge of the second cavity.

13. A light emitting device package comprising:
a package body including ceramic material and a cavity;
a pad disposed at the cavity;
a light emitting device disposed on the cavity and electrically connected to the pad;
an adhesive layer disposed between the light emitting device and a bottom surface of the cavity:
a metal layer inserted into the package body and including a center portion, a first expanded portion and a second expanded portion, wherein the center portion has a region disposed under the light emitting device; and
an electrode disposed at the package body,
wherein the metal layer is disposed under the cavity,
wherein the light emitting device emits light in a wavelength range of 190 nm to 397 nm,
wherein the first expanded portion is disposed at an upper edge of the center portion,
wherein the second expanded portion disposed at a lower edge of the center portion,
wherein the first expanded portion and the second expanded portion are provided at a same side surface from the center portion,
wherein a width of the first expanded portion and a width of the second expanded portion are different,
wherein a width of the center portion is wider than a width of the first expanded portion or the second expanded portion,
wherein the cavity has a first side surface and a second side surface, and
wherein at least one of a width between the first side surface of the cavity or a width of the second side surface of the cavity is narrower than a width of the metal layer.

14. The light emitting device package according to claim 13 , wherein a portion of the package body is disposed between the adhesive layer and the metal layer, and wherein the portion of the package body is composed of same material as the other portion of the package body.

15. The light emitting device package according to claim 13 , wherein the cavity has a step portion, and wherein the step portion has a flat bottom surface.

16. The light emitting device package according to claim 13 , wherein the electrode has a first portion and a second portion, the first portion is disposed in the package body and the second portion disposed under a bottom surface of the package body, and the first portion of electrode vertically overlaps with the second portion of the electrode.

17. The light emitting device package according to claim 13 , wherein the pad vertically overlaps with the metal layer and is spaced apart from an edge of the second cavity.

18. The light emitting device package according to claim 13 , wherein a top surface of the light emitting device is disposed above a top surface of the second cavity, and the bottom surface of the elctrode is disposed under the bottom surface of the package body.

19. The light emitting device package according to claim 13 , wherein a top surface of the pad is disposed above a top surface of the adhesive layer, and a top surface of the light emitting device is disposed above the top surface of the pad.

20. The light emitting device package according to claim 13 , wherein the light emitting device has a conductive layer and a light emitting structure, the light emitting structure having an active layer, wherein the conductive layer is disposed on the active layer, and wherein the conductive layer includes AlGaN or InAlGaN.

21. A light emitting device package comprising:
a package body including an accommodation space and the accommodation space having a first bottom surface, a second bottom surface, a first side surface and a second side surface;
a pad disposed on the first bottom surface;
a light emitting device disposed on the second bottom surface and electrically connected to the pad;
an adhesive layer disposed between the light emitting device and the

Assignees

• Lg Innotek Co Ltd

Inventors

• Kim Byung Mok
• Kang Bo Hee
• Kim Ha Na
• Kodaira Hiroshi
• Tanda Yuichiro
• Ozeki Satoshi

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/655

  Fan-out layouts · CPC title

• A61L2/08

  Radiation · CPC title

• A61L2/10

  Ultraviolet [UV] radiation · CPC title

• H01L2924/15174

  Electricity · mapped topic