Resin composition, prepreg, laminated sheet, and metal-foil-clad laminated board

Patent metadata

Field	Value
Publication number	US-2016237246-A1
Application number	US-201415023879-A
Country	US
Kind code	A1
Filing date	Oct 20, 2014
Priority date	Oct 25, 2013
Publication date	Aug 18, 2016
Grant date	—

Abstract

It is an object of the present invention to provide a resin composition which can realize a printed wired board having not only low water-absorbing property but also excellent heat resistance after moisture absorption, flame retardancy, and solvent solubility. It is another object of the present invention to provide a prepreg and a monolayer or laminate which use the resin composition, and a metal foil clad laminate and a printed wired board which use the prepreg. A resin composition of the present invention contains one or two or more cyanate ester compounds (A) represented by the following formula (1) and an epoxy resin (B):

wherein R 1 , R 2 , R 3 , and R 4 represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and may be the same or different from each other; and n represents an integer of 1 to 50.

First claim

1 . A resin composition comprising one or two or more cyanate ester compounds (A) represented by the following formula (1) and an epoxy resin (B):

wherein R 1 , R 2 , R 3 , and R 4 represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and may be the same or different from each other; and n represents an integer of 1 to 50.

2 . The resin composition according to claim 1 , wherein a content of the cyanate ester compound (A) is 1 to 90 parts by mass based on 100 parts by mass of a resin solid content in the resin composition.

3 . The resin composition according to claim 1 , further comprising an inorganic filler (C).

4 . The resin composition according to claim 3 , wherein a content of the inorganic filler (C) is 50 to 1600 parts by mass based on 100 parts by mass of a resin solid content in the resin composition.

5 . The resin composition according to claim 1 , further comprising one or more compounds selected from the group consisting of a maleimide compound and a cyanate ester compound other than the cyanate ester compound (A).

6 . The resin composition according to claim 1 , wherein the epoxy resin (B) is one or more selected from the group consisting of a biphenyl aralkyl-based epoxy resin, a naphthylene ether-based epoxy resin, a multifunctional phenol-based epoxy resin, and a naphthalene-based epoxy resin.

7 . A prepreg comprising a base material and the resin composition according to claim 1 with which the base material is impregnated or coated.

8 . A metal foil clad laminate comprising one or more of the prepreg according to claim 7 and a metallic foil disposed on one or both surfaces of the prepreg.

9 . A laminate comprising a support and a resin layer formed on a surface of the support by coating and drying of the resin composition according to claim 1 .

10 . A printed wiring board comprising an insulating layer and a conductor layer formed on a surface of the insulating layer, wherein the insulating layer comprises the resin composition according to claim 1 .

11 . The resin composition according to claim 2 , further comprising an inorganic filler (C).

12 . The resin composition according to claim 2 , further comprising one or more compounds selected from the group consisting of a maleimide compound and a cyanate ester compound other than the cyanate ester compound (A).

13 . The resin composition according to claim 2 , wherein the epoxy resin (B) is one or more selected from the group consisting of a biphenyl aralkyl-based epoxy resin, a naphthylene ether-based epoxy resin, a multifunctional phenol-based epoxy resin, and a naphthalene-based epoxy resin.

14 . The resin composition according to claim 3 , further comprising one or more compounds selected from the group consisting of a maleimide compound and a cyanate ester compound other than the cyanate ester compound (A).

15 . The resin composition according to claim 3 , wherein the epoxy resin (B) is one or more selected from the group consisting of a biphenyl aralkyl-based epoxy resin, a naphthylene ether-based epoxy resin, a multifunctional phenol-based epoxy resin, and a naphthalene-based epoxy resin.

16 . The resin composition according to claim 4 , further comprising one or more compounds selected from the group consisting of a maleimide compound and a cyanate ester compound other than the cyanate ester compound (A).

17 . The resin composition according to claim 4 , wherein the epoxy resin (B) is one or more selected from the group consisting of a biphenyl aralkyl-based epoxy resin, a naphthylene ether-based epoxy resin, a multifunctional phenol-based epoxy resin, and a naphthalene-based epoxy resin.

18 . The resin composition according to claim 5 , wherein the epoxy resin (B) is one or more selected from the group consisting of a biphenyl aralkyl-based epoxy resin, a naphthylene ether-based epoxy resin, a multifunctional phenol-based epoxy resin, and a naphthalene-based epoxy resin.

19 . The resin composition according to claim 11 , further comprising one or more compounds selected from the group consisting of a maleimide compound and a cyanate ester compound other than the cyanate ester compound (A).

20 . The resin composition according to claim 11 , wherein the epoxy resin (B) is one or more selected from the group consisting of a biphenyl aralkyl-based epoxy resin, a naphthylene ether-based epoxy resin, a multifunctional phenol-based epoxy resin, and a naphthalene-based epoxy resin.

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Arii Kenji
• Kobayashi Takashi
• Sogame Masanobu
• Mabuchi Yoshinori
• Mishima Hiroyuki

Classifications

• C08L65/00

  Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain (C08L7/00 - C08L57/00, C08L61/00 take precedence); Compositions of derivatives of such polymers · CPC title

• B32B2307/3065

  Flame resistant or retardant, fire resistant or retardant · CPC title

• C08K3/013

  Fillers, pigments or reinforcing additives · CPC title

• C08G73/0655

  from polycyanurates · CPC title

• C08L63/00 Primary

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title