Wafer transport assembly with integrated buffers

Patent metadata

Field	Value
Publication number	US-11764086-B2
Application number	US-202217860736-A
Country	US
Kind code	B2
Filing date	Jul 8, 2022
Priority date	Oct 20, 2015
Publication date	Sep 19, 2023
Grant date	Sep 19, 2023

Abstract

A substrate processing system configured to process substrates includes a substrate transport assembly that encloses a controlled environment defined within a continuous transport volume and at least two process modules coupled to the substrate transport assembly. The substrate transport assembly is configured to transport substrates to and from the at least two process modules through the continuous transport volume. At least two gas boxes are configured to deliver gas mixtures to the at least two process modules. An exhaust duct configured to selectively evacuate the at least two process modules through the at least two gas boxes. Surfaces of the at least two gas boxes include perforations configured to allow gases to flow from the at least two gas boxes into the exhaust duct.

First claim

What is claimed is:

1. A substrate processing system configured to process substrates, the substrate processing system comprising:
a substrate transport assembly that encloses a controlled environment defined within a continuous transport volume;
at least two process modules coupled to the substrate transport assembly, wherein the substrate transport assembly is configured to transport substrates to and from the at least two process modules through the continuous transport volume;
at least two gas boxes configured to deliver gas mixtures to the at least two process modules; and
an exhaust duct configured to selectively evacuate the at least two process modules through the at least two gas boxes,
wherein surfaces of the at least two gas boxes include perforations configured to allow gases to flow from the at least two gas boxes into the exhaust duct.

2. The substrate processing system of claim 1 , wherein the at least two gas boxes are arranged below the substrate transport assembly and the at least two process modules.

3. The substrate processing system of claim 1 , further comprising a plurality of gas lines configured to supply gases to the at least two gas boxes, wherein the plurality of gas lines runs through the exhaust duct to the at least two gas boxes.

4. The substrate processing system of claim 3 , wherein the plurality of gas lines runs through the exhaust duct from a region outside of the continuous transport volume to a region inside of the continuous transport volume.

5. The substrate processing system of claim 1 , further comprising a service tunnel defined below the substrate transport assembly, wherein the at least two gas boxes are positioned along sides of the service tunnel below the substrate transport assembly and the at least two process modules.

6. The substrate processing system of claim 5 , wherein:
the substrate transport assembly extends along a longitudinal axis of the substrate processing system;
the at least two process modules are coupled to the substrate transport assembly along a lateral side of the substrate transport assembly; and
the service tunnel extends along the longitudinal axis of the substrate processing system.

7. The substrate processing system of claim 6 , wherein the service tunnel has a vertical dimension defined between an underside of the substrate transport assembly and a service floor that is positioned below the substrate transport assembly.

8. The substrate processing system of claim 7 , wherein the service floor is defined at a height that is less than a height of a fabrication facility floor.

9. The substrate processing system of claim 8 , wherein the height of the service floor is between 30.5 cm to 61 cm below the height of the fabrication facility floor.

10. The substrate processing system of claim 6 , wherein the substrate transport assembly includes at least two substrate transport modules arranged along the longitudinal axis, wherein each of the substrate transport modules is coupled to one of the at least two process modules.

11. The substrate processing system of claim 6 , further comprising:
at least two process module frames configured to support the at least two process modules along the lateral side of the substrate transport assembly above a fabrication facility floor.

12. The substrate processing system of claim 6 wherein the substrate transport assembly includes a first end oriented towards an equipment front end module (EFEM) and a second end opposite the first end.

13. The substrate processing system of claim 12 , wherein the service tunnel extends along the longitudinal axis from the first end to the second end.

14. The substrate processing system of claim 13 , wherein the first end of the substrate transport assembly is configured for connection to a load lock that controls access to and from the EFEM, and wherein one end of the service tunnel extends substantially to the EFEM.

15. The substrate processing system of claim 6 , wherein a height of the service tunnel is in a range from 183 cm to 244 cm.

16. The substrate processing system of claim 1 , wherein:
the substrate transport assembly includes a first substrate transport module, a second substrate transport module, and a first buffer stack located in the continuous transport volume;
a first portion of the first buffer stack defines a first plurality of substrate storage slots and includes one or more separators defined between each of the first plurality of substrate storage slots; and
a second portion of the first buffer stack defines a second plurality of substrate storage slots that does not include separators defined between each of the second plurality of substrate storage slots.

17. The substrate processing system of claim 16 , wherein at least one of the first substrate transport module and the second substrate transport module is configured to store at least one of a seasoning substrate and a cover substrate in the second portion of the first buffer stack.

18. The substrate processing system of claim 16 , wherein at least one of the first substrate transport module and the second substrate transport module is configured to store at least one of an unprocessed substrate and a processed substrate in the first portion of the first buffer stack.

Assignees

• Lam Res Corp

Inventors

• Trussell David
• Daugherty John
• Pena Christopher J
• Kellogg Michael C
• Kunkel Klay
• Gould Richard H

Classifications

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/0452

  characterised by the layout of the process chambers · CPC title

• H10P72/0464 Primary

  characterised by the construction of the transfer chamber · CPC title

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P72/3404

  Storage means · CPC title