Wafer transport assembly with integrated buffers
US-11764086-B2 · Sep 19, 2023 · US
Trussell David is listed as an inventor on 18 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Trussell David |
| Total patents | 18 |
| First publication | Mar 24, 2016 |
| Latest publication | Sep 19, 2023 |
Publications ranked by popularity score, then publication date.
US-11764086-B2 · Sep 19, 2023 · US
US-2022344183-A1 · Oct 27, 2022 · US
US-11393705-B2 · Jul 19, 2022 · US
US-2021005485-A1 · Jan 7, 2021 · US
US-10804079-B2 · Oct 13, 2020 · US
US-10790174-B2 · Sep 29, 2020 · US
US-2019371573-A1 · Dec 5, 2019 · US
US-10403476-B2 · Sep 3, 2019 · US
US-10304707-B2 · May 28, 2019 · US
US-2018233387-A1 · Aug 16, 2018 · US
Latest publications not already listed above.
US-10014196-B2 · Jul 3, 2018 · US
US-2018130640-A1 · May 10, 2018 · US
US-9929028-B2 · Mar 27, 2018 · US
US-2017110351-A1 · Apr 20, 2017 · US
US-2017110354-A1 · Apr 20, 2017 · US
US-2017110350-A1 · Apr 20, 2017 · US
US-9502275-B1 · Nov 22, 2016 · US
US-2016086864-A1 · Mar 24, 2016 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 18 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/0462 | 14 |
| H10P72/3302 | 13 |
| H10P72/3304 | 13 |
| H10P72/3216 | 13 |
| H10P72/0466 | 13 |