Copper electroplating baths containing compounds of reaction products of amines, polyacrylamides and sultones

US11761107B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11761107-B2
Application numberUS-202016745400-A
CountryUS
Kind codeB2
Filing dateJan 17, 2020
Priority dateOct 8, 2015
Publication dateSep 19, 2023
Grant dateSep 19, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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Copper electroplating baths include reaction products of amines, polyacrylamides and sultones. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.

First claim

Opening claim text (preview).

What is claimed is: 1. A compound comprising a reaction product of one or more compounds having the formula: wherein R 24 -R 27 are independently chosen from hydrogen, (C 1 -C 3 )alkyl, hydroxyl, and acetate moiety, an amine and an acrylamide, wherein the amine has a formula: wherein R′ is hydrogen; R comprises H 2 N—(CH 2 ) m —, HO—(CH 2 ) m —, Q-(CH 2 ) m —, a moiety having a structure: a moiety having a structure: or a moiety having a structure: where R 1 -R 14 are independently chosen from hydrogen and (C 1 -C 3 )alkyl; m is an integer from 2-12, n is an integer from 2-10, p is an integer from 1-10, q is an integer from 2-10 and r, s and t are numbers from 1 to 10; Q is a 5-6 membered heterocyclic ring having one or two nitrogen atoms in the ring or Q is a benzene sulfonamide moiety; and the acrylamide has a formula: wherein R″ is a moiety having a structure: a moiety having a structure: a moiety having a structure: or a substituted or unsubstituted triazinane ring or a piperizine ring, wherein R 15 comprises hydrogen or hydroxyl; u is an integer from 1 to 2 and v, x and y are independently integers of 1 to 10; R 16 and R 17 are independently chosen from hydrogen and carbonyl moiety, and with the proviso that when R 16 and R 17 are carbonyl moieties, the carbonyl moieties form a covalent bond with the carbons of the vinyl groups of formula (VI) displacing a hydrogen to form the covalent bond with the carbons of the vinyl groups to form a five membered heterocyclic ring. 2. The compound of claim 1 , wherein the amine has a formula: wherein R′ is hydrogen and R is H 2 N—(CH 2 ) m — and m is an integer of 2-3.

Assignees

Inventors

Classifications

  • C25D3/38Primary

    of copper · CPC title

  • containing more than 50% by weight of copper · CPC title

  • Semiconductors · CPC title

  • Semiconductors first coated with a seed layer or a conductive layer · CPC title

  • characterised by electroplating method · CPC title

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What does patent US11761107B2 cover?
Copper electroplating baths include reaction products of amines, polyacrylamides and sultones. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
Who is the assignee on this patent?
Dow Global Technologies Llc, Rohm & Haas Elect Mat
What technology area does this patent fall under?
Primary CPC classification C25D3/38. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 19 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).