Deformation detection sensor, electronic device, and method for manufacturing detecting deformation detection sensor

Patent metadata

Field	Value
Publication number	US-11747222-B2
Application number	US-202218069348-A
Country	US
Kind code	B2
Filing date	Dec 21, 2022
Priority date	Aug 3, 2016
Publication date	Sep 5, 2023
Grant date	Sep 5, 2023

Abstract

A method for manufacturing a deformation detection sensor that includes: preparing a plurality of thermoplastic resin layers, at least one of which has a main surface on which a conductive member is formed; laminating the plurality of thermoplastic resin layers; after lamination, integrally forming the plurality of thermoplastic resin layers by hot pressing to obtain a laminated body configured so that a transmission line is formed from a first portion of the conductive member and the laminated body; and attaching a piezoelectric film to the laminated body so that a piezoelectric element is formed from a second portion of the conductive member, the laminated body, and the piezoelectric film.

First claim

The invention claimed is:

1. A method for manufacturing a deformation detection sensor, the method comprising:
preparing a plurality of thermoplastic resin layers, at least one of which has a main surface on which a conductive member is formed;
laminating the plurality of thermoplastic resin layers;
after lamination, integrally forming the plurality of thermoplastic resin layers by hot pressing to obtain a laminated body configured so that a transmission line is formed from a first portion of the conductive member and the laminated body; and
attaching a piezoelectric film to the laminated body so that a piezoelectric element is formed from a second portion of the conductive member, the laminated body, and the piezoelectric film.

2. The method for manufacturing a deformation detection sensor according to claim 1 , wherein
the piezoelectric film and the transmission line are disposed so as to overlap each other in a planar view, and
a ground conductor is positioned between the piezoelectric film and the transmission line.

3. The method for manufacturing a deformation detection sensor according to claim 1 , wherein the piezoelectric element and the transmission line are disposed so as to not overlap each other in a planar view.

4. The method for manufacturing a deformation detection sensor according to claim 3 , wherein the laminated body between the piezoelectric element and the transmission line is bent.

5. The method for manufacturing a deformation detection sensor according to claim 1 , wherein the transmission line and a signal line of the piezoelectric element are made of a single conductive member.

6. The method for manufacturing a deformation detection sensor according to claim 1 , wherein
the first portion of the conductive member includes a first signal line and a second signal line, and
a part of the laminated body is removed between the first signal line and the second signal line.

7. The method for manufacturing a deformation detection sensor according to claim 6 , wherein the first portion of the conductive member and the second portion of the conductive member are separate from each other.

8. The method for manufacturing a deformation detection sensor according to claim 1 , wherein the first portion of the conductive member and the second portion of the conductive member are separate from each other.

9. The method for manufacturing a deformation detection sensor according to claim 1 , wherein laminated body includes a resin base material selected from a liquid crystal polymer resin, polyetheretherketone, polyetherimide, polyphenylene sulfide, or polyimide.

Assignees

• Murata Manufacturing Co

Inventors

• Kihara Takashi
• Endo Jun
• Ando Masamichi

Classifications

• G01L1/162 Primary

  using piezoelectric resonators · CPC title

• G01L1/16 Primary

  using properties of piezoelectric devices · CPC title

• G01L5/22

  for measuring the force applied to control members, e.g. control members of vehicles, triggers · CPC title

• G01L9/08

  by making use of piezoelectric devices {, i.e. electric circuits therefor} · CPC title

• H10N30/302

  Sensors · CPC title