Bonding method for three-layer substrate
US-10145745-B2 · Dec 4, 2018 · US
by making use of piezoelectric devices {, i.e. electric circuits therefor} · Cooperative Patent Classification (CPC)
Computing, optics, measurement, and control technologies.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | G01L9/08 |
| Official title | by making use of piezoelectric devices {, i.e. electric circuits therefor} |
| Display label | by making use of piezoelectric devices {, i.e. electric circuits therefor} |
| Total patents | 250 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 8 |
| 2016 | 21 |
| 2017 | 26 |
| 2018 | 31 |
| 2019 | 32 |
| 2020 | 33 |
| 2021 | 27 |
| 2022 | 20 |
| 2023 | 22 |
| 2024 | 15 |
| 2025 | 12 |
| 2026 | 3 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-10145745-B2 · Dec 4, 2018 · US
US-2018317022-A1 · Nov 1, 2018 · US
US-2018242851-A1 · Aug 30, 2018 · US
US-10054509-B2 · Aug 21, 2018 · US
US-2018106689-A1 · Apr 19, 2018 · US
US-2017350780-A1 · Dec 7, 2017 · US
US-9836171-B2 · Dec 5, 2017 · US
US-9835511-B2 · Dec 5, 2017 · US
US-2017343442-A1 · Nov 30, 2017 · US
US-9793830-B2 · Oct 17, 2017 · US
US-2017292863-A1 · Oct 12, 2017 · US
US-2017284883-A1 · Oct 5, 2017 · US
US-9772236-B2 · Sep 26, 2017 · US
US-9772314-B2 · Sep 26, 2017 · US
US-2017234672-A1 · Aug 17, 2017 · US
US-2017234751-A1 · Aug 17, 2017 · US
US-2017216917-A1 · Aug 3, 2017 · US
US-2017212000-A1 · Jul 27, 2017 · US
US-2017190227-A1 · Jul 6, 2017 · US
US-2017160153-A1 · Jun 8, 2017 · US
Answers are generated from the same data shown on this page.