Multilayer substrate

Patent metadata

Field	Value
Publication number	US-11043626-B2
Application number	US-201916294975-A
Country	US
Kind code	B2
Filing date	Mar 7, 2019
Priority date	Oct 24, 2016
Publication date	Jun 22, 2021
Grant date	Jun 22, 2021

Abstract

A multilayer substrate includes a stacked body including first and second flexible insulating base material layers, and an actuator conductor pattern on at least the first insulating base material layer. The stacked body includes a first region including stacked first and second insulating base material layers, and a second region including stacked second insulating base material layers. The first region includes an actuator function portion in a portion thereof, the actuator function portion including the actuator conductor pattern. The thickness of the first insulating base material layer including the actuator conductor pattern is smaller than the thickness of one second insulating base material layer.

First claim

What is claimed is:

1. A multilayer substrate comprising:
a stacked body including a plurality of first insulating layers and a plurality of second insulating layers that are stacked and have flexibility, the stacked body including a first region and a second region; and
an actuator conductor pattern provided on each of the plurality of first insulating layers in the first region; wherein
a number of stacked layers of the plurality of first and second insulating layers in the first region is greater than a number of stacked layers of the plurality of second insulating layers in the second region;
the plurality of second insulating layers are provided over the first region and the second region;
the plurality of the first insulating layers are provided only in the first region;
the first region is obtained by stacking the plurality of first insulating layers and the plurality of second insulating layers and includes an actuator function portion in a portion, the actuator function portion including the actuator conductor patterns;
a thickness of the stacked body in the second region is smaller than a thickness of the stacked body in the first region;
a thickness of each of the plurality of first insulating layers which are provided only in the first region in which the thickness of the stacked body is larger than the thickness of the stacked body in the second region is smaller than a thickness of one of the plurality of second insulating layers;
a conductor ratio of the actuator function portion in the first region in which the thickness of the stacked body is larger than the thickness of the stacked body in the second region is higher than a conductor ratio of the stacked body in the second region in which the thickness of the stacked body is smaller than the thickness of the stacked body in the first region; and
a rigidity of the conductor pattern is higher than a rigidity of the plurality of first insulating layers which are provided only in the first region in which the thickness of the stacked body is larger than the thickness of the stacked body in the second region.

2. The multilayer substrate according to claim 1 , wherein the thickness of each of the plurality of first insulating layers which are provided only in the first region in which the thickness of the stacked body is larger than the thickness of the stacked body in the second region is smaller than a thickness of at least two second insulating layers among the plurality of second insulating layers.

3. The multilayer substrate according to claim 1 , wherein the thickness of each of the plurality of first insulating layers which are provided only in the first region in which the thickness of the stacked body is larger than the thickness of the stacked body in the second region is smaller than a thickness of each second insulating layer among the plurality of second insulating layers.

4. The multilayer substrate according to claim 1 , wherein the actuator conductor patterns are provided only on each of the plurality of first insulating layers and are disposed on layers other than a boundary surface between the plurality of first insulating layers and the plurality of second insulating layers.

5. The multilayer substrate according to claim 1 , further comprising a reinforcement film in contact with one of the plurality of first insulating layers and having a modulus of elasticity greater than a modulus of elasticity of the plurality of first and second insulating layers.

6. The multilayer substrate according to claim 1 , further comprising a dummy conductor in contact with one of the plurality of first insulating layers and not electrically connected to the actuator conductor patterns.

7. The multilayer substrate according to claim 1 , wherein the actuator conductor patterns include a coil conductor.

8. The multilayer substrate according to claim 1 , wherein the actuator conductor patterns provided on each of the plurality of first insulating layers are coil conductors.

9. The multilayer substrate according to claim 1 , wherein the actuator conductor patterns provided on each of the plurality of first insulating layers are plane electrodes that are opposed in a stacking direction of the stacked body.

10. The multilayer substrate according to claim 1 , wherein the stacked body is a rectangular or substantially rectangular flat plate.

11. The multilayer substrate according to claim 1 , wherein the plurality of first and second insulating layers are resin layers.

12. The multilayer substrate according to claim 1 , wherein the plurality of first insulating layers are free from external connection terminals.

13. The multilayer substrate according to claim 7 , wherein the coil conductor is a rectangular or substantially rectangular loop shaped conductor pattern including about one turn wound along an outer periphery of the plurality of first insulation layers.

14. The multilayer substrate according to claim 8 , wherein each of the coil conductors is a rectangular or substantially rectangular loop shaped conductor pattern including about one turn wound along an outer periphery of a respective one of the plurality of first insulating layers.

15. The multilayer substrate according to claim 8 , wherein the coil conductors define a coil including a rectangular or substantially rectangular helical shape including about three turns.

16. The multilayer substrate according to claim 9 , wherein the plurality of first insulating layers have piezoelectric properties.

17. The multilayer substrate according to claim 9 , wherein the plurality of first insulating layers are made of polyvinylidene fluoride.

18. The multilayer substrate according to claim 9 , wherein the plane electrodes are made of a Cu foil.

19. The multilayer substrate according to claim 11 , wherein the plurality of first and second insulating layers are made of polyimide or liquid crystal polymer.

20. The multilayer substrate according to claim 11 , wherein the actuator conductor patterns are made of Cu foil.

Assignees

• Murata Manufacturing Co

Inventors

• Yosui Kuniaki
• Ito Shingo
• Morita Isamu
• Gouchi Naoki

Classifications

• H05K3/4691 Primary

  Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers · CPC title

• H05K3/4635

  laminating flexible circuit boards using additional insulating adhesive materials between the boards · CPC title

• H01F2017/006

  flexible printed inductors · CPC title

• H05K1/165

  incorporating printed inductors · CPC title

• H05K1/147

  at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence) · CPC title