Semiconductor light-emitting device and method of fabricating the same

Patent metadata

Field	Value
Publication number	US-11742469-B2
Application number	US-202017036090-A
Country	US
Kind code	B2
Filing date	Sep 29, 2020
Priority date	Nov 26, 2019
Publication date	Aug 29, 2023
Grant date	Aug 29, 2023

Abstract

A semiconductor light-emitting device includes a plurality of light-emitting device structures separated from each other, each of the plurality of light-emitting device structures including a first conductivity type semiconductor layer, an active layer on the first conductivity type semiconductor layer, a second conductivity type semiconductor layer on the active layer, a first electrode connected to the first conductivity type semiconductor layer, and a second electrode connected to the second conductivity type semiconductor layer, and a partition wall structure between two adjacent light-emitting device structures of the plurality of light-emitting device structures, the partition wall structure defining a pixel space.

First claim

What is claimed is:

1. A semiconductor light-emitting device, comprising:
a plurality of light-emitting device structures separated from each other, each of the plurality of light-emitting device structures including:
a first conductivity type semiconductor layer,
an active layer on the first conductivity type semiconductor layer,
a second conductivity type semiconductor layer on the active layer,
a first electrode connected to the first conductivity type semiconductor layer, and
a second electrode connected to the second conductivity type semiconductor layer; and

a partition wall structure between two adjacent light-emitting device structures of the plurality of light-emitting device structures, the partition wall structure defining a pixel space,
wherein the partition wall structure is continuous with the second electrode of each of adjacent light-emitting device structures of the plurality of light-emitting structures, the second electrode of each of the plurality of light-emitting device structures being continuous with a conductive portion of the partition wall structure.

2. The semiconductor light-emitting device as claimed in claim 1 , wherein a lateral width of the first conductivity type semiconductor layer is greater than a lateral width of the second conductivity type semiconductor layer.

3. The semiconductor light-emitting device as claimed in claim 2 , wherein a vertical thickness of the first conductivity type semiconductor layer is less than a vertical thickness of the second conductivity type semiconductor layer.

4. The semiconductor light-emitting device as claimed in claim 1 , wherein the partition wall structure surrounds a side surface of the second conductivity type semiconductor layer and protrudes over an upper surface of the second conductivity type semiconductor layer.

5. The semiconductor light-emitting device as claimed in claim 4 , further comprising an encapsulation layer in a space defined by the partition wall structure on the second conductivity type semiconductor layer.

6. The semiconductor light-emitting device as claimed in claim 4 , wherein the partition wall structure protrudes by about 0.1 μm to about 50 μm from the upper surface of the second conductivity type semiconductor layer.

7. The semiconductor light-emitting device as claimed in claim 1 , wherein the partition wall structure extends along side surfaces of the first conductivity type semiconductor layer, the active layer, and the second conductivity type semiconductor layer.

8. The semiconductor light-emitting device as claimed in claim 7 , wherein the second electrode is on an upper surface of the second conductivity type semiconductor layer.

9. The semiconductor light-emitting device as claimed in claim 8 , further comprising an insulating layer on the side surfaces of the first conductivity type semiconductor layer, the active layer, and the second conductivity type semiconductor layer,
wherein the partition wall structure includes a seed layer extending along a surface of the insulating layer and a partition wall body on the seed layer.

10. The semiconductor light-emitting device as claimed in claim 9 , wherein the partition wall body extends from an edge of the second conductivity type semiconductor layer to the second electrode along the upper surface of the second conductivity type semiconductor layer.

11. A semiconductor light-emitting device, comprising:
a first conductivity type semiconductor layer;
an active layer on the first conductivity type semiconductor layer;
a second conductivity type semiconductor layer on the active layer;
a first electrode connected to the first conductivity type semiconductor layer;
an insulating layer on side surfaces of the first conductivity type semiconductor layer, the active layer, and the second conductivity type semiconductor layer; and
a partition wall structure extending along the side surfaces of the first conductivity type semiconductor layer, the active layer, and the second conductivity type semiconductor layer with the insulating layer therebetween, the partition wall structure protruding to a higher level than an upper surface of the second conductivity type semiconductor layer,
wherein the partition wall structure includes:
a partition wall body extending in a direction perpendicular to the upper surface of the second conductivity type semiconductor layer, and
a seed layer extension protruding from a side surface of the partition wall body and extending along the upper surface of the second conductivity type semiconductor layer.

12. The semiconductor light-emitting device as claimed in claim 11 , wherein the first electrode extends along a lower surface of the first conductivity type semiconductor layer and is spaced apart from the partition wall structure.

13. The semiconductor light-emitting device as claimed in claim 11 , wherein the partition wall structure extends along the side surfaces of the first conductivity type semiconductor layer, the active layer, and the second conductivity type semiconductor layer with the insulating layer therebetween, the partition wall structure extending to a lower level than a lower surface of the first conductivity type semiconductor layer.

14. The semiconductor light-emitting device as claimed in claim 11 , wherein a distance between an end of the seed layer extension and an edge of the upper surface of the second conductivity type semiconductor layer ranges from about 0.01 μm to about 5 μm.

15. The semiconductor light-emitting device as claimed in claim 11 , further comprising a second electrode connected to the second conductivity type semiconductor layer, a contact portion between the second electrode and the second conductivity type semiconductor layer extending along an edge of the upper surface of the second conductivity type semiconductor layer with a gap therebetween.

16. The semiconductor light-emitting device as claimed in claim 11 , wherein the partition wall body extends to protrude by about 0.1 μm to about 50 μm from the upper surface of the second conductivity type semiconductor layer.

17. The semiconductor light-emitting device as claimed in claim 11 , wherein the partition wall structure includes an electrical conductor.

18. The semiconductor light-emitting device as claimed in claim 17 , wherein the partition wall structure further includes a barrier layer between a seed layer and the partition wall body.

19. A semiconductor light-emitting device, comprising:
a circuit substrate connected to a controller;
a plurality of light-emitting device structures on the circuit substrate and separated from each other;
a partition wall structure between two adjacent light-emitting device structures of the plurality of light-emitting device structures, the partition wall structure defining a pixel space; and
an encapsulation layer in contact with an upper surface of each of the plurality of light-emitting device structures and a sidewall of the partition wall structure,
wherein each of the plurality of light-emitting device structures includes:
a first conductivity type semiconductor layer on the circuit substrate,
an active layer on the first conductivity type semiconductor layer,
a second conductivity type semiconductor layer on the active layer,
a first electrode connected to the first conductivity type semiconductor layer, and
a second electrode connected to the second conductivity type semiconductor layer,

wherein side surfaces of the first conductivity type semiconductor layer, the active layer, and the se

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Donggun
• Kim Gibum
• Kim Joosung
• Kim Juhyun
• Sakong Tan
• Seo Jonguk
• Tak Youngjo

Classifications

• H10H20/857 Primary

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/852

  Encapsulations · CPC title

• H10H20/831

  characterised by their shape · CPC title

• H10H29/142 Primary

  Two-dimensional arrangements, e.g. asymmetric LED layout · CPC title

• H10H20/8506 Primary

  Containers · CPC title