Method for producing a micro-LED matrix, micro-LED matrix and use of a micro-LED matrix

Patent metadata

Field	Value
Publication number	US-10276631-B2
Application number	US-201314042991-A
Country	US
Kind code	B2
Filing date	Oct 1, 2013
Priority date	Oct 1, 2012
Publication date	Apr 30, 2019
Grant date	Apr 30, 2019

Abstract

A method for producing a micro-LED matrix by (A) depositing an LED layer structure onto a working substrate; (B) singulating a plurality of LED structures from the LED layer structure on the working substrate; (C) applying a first contact-making structure to a carrier substrate; and (D) transferring the plurality of LED structures from the working substrate to the carrier substrate by bonding and laser lift-off. An at least two-layered carrier substrate is used, including a carrier layer and a first flexible polymer layer, in step C the first contact-making structure is applied indirectly or directly to a side of the first polymer layer which faces away from the carrier layer, and in an additional method step D-0 between method steps C and D, a second flexible polymer layer is formed at least between the singulated LED structures. A micro-LED matrix and use are also provided.

First claim

The invention claimed is:

1. A method for producing a flexible micro-LED matrix comprising the following method steps:
A depositing an LED layer structure onto a working substrate ( 5 );
B singulating a plurality of LED structures ( 6 ) from the LED layer structure on the working substrate ( 5 ) into singulated LED structures ( 6 );
C applying a first contact-making structure ( 4 ) to a carrier substrate ( 1 );
D bonding the working substrate ( 5 ) to the carrier substrate ( 1 ), filling a second flexible polymer layer ( 13 ) between the singulated LED structures ( 6 ) to form embedded LED structures, and transferring the embedded LED structures ( 6 ) from the working substrate ( 5 ) to the carrier substrate ( 1 ) by laser lift-off; and
an at least two-layered carrier substrate ( 1 ) is used, comprising a carrier layer ( 2 ) and a first flexible polymer layer ( 3 ), in method step C the first contact-making structure ( 4 ) is applied indirectly or directly to that side of the first flexible polymer layer ( 3 ) which faces away from the carrier layer ( 2 ).

2. The method as claimed in claim 1 , wherein
in an additional method step E, a third flexible polymer layer ( 16 ) is applied to the second flexible polymer layer ( 13 ) and the embedded LED structures ( 6 ).

3. The method as claimed in claim 2 , wherein
in an additional method step E-0 before method step E a second contact-making structure ( 15 ) formed as a metallic contact-making structure, is applied at least to the embedded LED structures ( 6 ).

4. The method as claimed in claim 1 , wherein
the singulation of the plurality of LED structures ( 6 ) in method step B is effected by at least one of laser ablation or etching.

5. The method as claimed in claim 2 , wherein
a flexible biocompatible polymer is used for at least one of the first flexible polymer layer ( 3 ), the second flexible polymer layer ( 13 ), or the third flexible polymer layer ( 16 ).

6. The method as claimed in claim 1 , wherein
the second flexible polymer layer ( 13 ) is introduced into a region between the singulated LED structures ( 6 ) by application of reduced pressure.

7. The method as claimed in claim 1 , wherein
the carrier layer ( 2 ) of the at least two-layered carrier substrate ( 1 ) is removed by a peel-off process in a method step F.

Assignees

• Fraunhofer Ges Forschung
• Univ Freiburg Albert Ludwigs

Inventors

• Gossler Christian
• Schwarz Ulrich
• Ruther Patrick

Classifications

• A61N1/0541

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• A61N2005/0652

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• A61N5/0601

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• A61N5/0622 Primary

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• A61N1/0551

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