Electrical device having conductive lines with air gaps therebetween and interconnects without exclusion zones

Patent metadata

Field	Value
Publication number	US-11735524-B2
Application number	US-201916576201-A
Country	US
Kind code	B2
Filing date	Sep 19, 2019
Priority date	Mar 22, 2016
Publication date	Aug 22, 2023
Grant date	Aug 22, 2023

Abstract

An electrical device includes a plurality of metal lines in a region of a substrate positioned in an array of metal lines all having parallel lengths, and a plurality of air gaps between the metal lines in a same level as the metal lines, wherein an air gap is present between each set of adjacent metal lines. A plurality of interconnects may be present in electrical communication with said plurality of metal lines, wherein an exclusion zone for said plurality of interconnects is not present in said array of metal lines.

First claim

What is claimed is:

1. An electrical device comprising:
a plurality of electrically conductive lines on a substrate that are positioned in an array having parallel lengths;
a plurality of air gaps between the plurality of electrically conductive lines and in a same level as the plurality of electrically conductive lines, wherein one air gap of the plurality of air gaps is present between each adjacent pair of the plurality of electrically conductive lines; and
a plurality of interconnects in electrical communication with said plurality of electrically conductive lines, wherein an exclusion zone for said plurality of interconnects is not present in said array of electrically conductive lines.

2. The electrical device of claim 1 , wherein the plurality of interconnects do not enter the air gaps.

3. The electrical device of claim 1 , wherein a pitch separating adjacent ones of the plurality of electrically conductive lines in the plurality of electrically conductive lines ranges from 30 nm to 80 nm.

4. The electrical device of claim 1 , wherein each of the plurality of electrically conductive lines is comprised of a doped semiconductor material.

5. The electrical device of claim 1 , wherein each of the plurality of electrical conductive lines is comprised of a metal.

6. The electrically device of claim 5 , wherein the metal of the plurality of electrically conductive lines is present in trenches in a low-k dielectric material.

7. An electrical device comprising:
a plurality of electrically conductive lines on a substrate that are positioned in an array having parallel lengths;
a plurality of air gaps between the plurality of electrically conductive lines and in a same level as the plurality of electrically conductive lines, wherein one air gap of the plurality of air gaps is present between each adjacent pair of the plurality of electrically conductive lines; and
a plurality of interconnects in electrical communication and self-aligned with said plurality of electrically conductive lines, wherein an exclusion zone for said plurality of interconnects is not present in said array of electrically conductive lines.

8. The electrical device of claim 7 , wherein the plurality of interconnects do not enter the air gaps.

9. The electrical device of claim 7 , wherein a pitch separating adjacent ones of the plurality of electrically conductive lines in the plurality of electrically conductive lines ranges from 30 nm to 80 nm.

10. The electrical device of claim 7 , wherein each of the plurality of electrically conductive lines is comprised of a doped semiconductor material.

11. The electrical device of claim 7 , wherein each of the plurality of electrically conductive lines are comprised of a metal present in trenches in a low-k dielectric material.

Assignees

• IBM

Inventors

• Briggs Benjamin D
• Clevenger Lawrence A
• Penny Christopher J
• Rizzolo Michael

Classifications

• H10W20/0693

  by forming self-aligned vias · CPC title

• H10P50/283

  by chemical means · CPC title

• H10P50/264

  by chemical means · CPC title

• H10P14/6334

  using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition (deposition by physical ablation of a target H10P14/6329) · CPC title

• H10P14/6329

  using physical ablation of a target, e.g. physical vapour deposition or pulsed laser deposition · CPC title