Greyscale lithography for substrate topography correction
US-2026093184-A1 · Apr 2, 2026 · US
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Briggs Benjamin D patents
Briggs Benjamin D is listed as an inventor on 330 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Briggs Benjamin D |
| Total patents | 330 |
| First publication | Aug 16, 2016 |
| Latest publication | Apr 2, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Fabricating dual damascene structures using multilayer photosensitive dielectrics
US-12538778-B2 · Jan 27, 2026 · US
Methods and Apparatus for Chucking a Bowed Substrate
US-2025343061-A1 · Nov 6, 2025 · US
Doped Aluminum Oxide Bonding Layer for Hybrid Bonding
US-2025285856-A1 · Sep 11, 2025 · US
Aluminum Oxide Crystallization Barrier for Hybrid Bonding
US-2025286002-A1 · Sep 11, 2025 · US
Aluminum Oxide Isolation for Hybrid Bonding
US-2025285919-A1 · Sep 11, 2025 · US
Methods for enabling chemical mechanical polishing and bonding of aluminum-containing materials
US-2025183037-A1 · Jun 5, 2025 · US
Structure and technique of photo-defined semiconductor device with selective dielectric constant reduction
US-2025117561-A1 · Apr 10, 2025 · US
Fabricating dual damascene structures using multilayer photosensitive dielectrics
US-2025046652-A1 · Feb 6, 2025 · US
Integrated plasma clean and dielectric passivation deposition processes
US-2025029835-A1 · Jan 23, 2025 · US
Recent patents
Latest publications not already listed above.
Structure and method of bi-layer pixel isolation in advanced LCOS back-plane
US-12055821-B2 · Aug 6, 2024 · US
Method of CMP integration for improved optical uniformity in advanced LCOS back-plane
US-11908678-B2 · Feb 20, 2024 · US
Structure and method of advanced LCoS back-plane having highly reflective pixel via metallization
US-11881539-B2 · Jan 23, 2024 · US
Structure and method of mirror grounding in LCoS devices
US-11880052-B2 · Jan 23, 2024 · US
Structure and method for maximizing air gap in back end of the line interconnect through via landing modification
US-2024014133-A1 · Jan 11, 2024 · US
Optimizating semiconductor binning by feed-forward process adjustment
US-11869783-B2 · Jan 9, 2024 · US
Paint on micro chip touch screens
US-2023409692-A1 · Dec 21, 2023 · US
Paint on micro chip touch screens
US-11790072-B2 · Oct 17, 2023 · US
Forming high carbon content flowable dielectric film with low processing damage
US-11756786-B2 · Sep 12, 2023 · US
Electrical device having conductive lines with air gaps therebetween and interconnects without exclusion zones
US-11735524-B2 · Aug 22, 2023 · US
Buried near-gate local interconnects and methods of their manufacture
US-2023223447-A1 · Jul 13, 2023 · US
Cognitive system for localized LIDAR pollution detection using autonomous vehicles
US-11636353-B2 · Apr 25, 2023 · US
Structure and method of advanced LCoS back-plane having robust pixel via metallization
US-11586067-B2 · Feb 21, 2023 · US
Method for LCoS DBR multilayer stack protection via sacrificial hardmask for RIE and CMP processes
US-11573452-B2 · Feb 7, 2023 · US
Self-aligned contact scheme for pillar-based memory elements
US-11488863-B2 · Nov 1, 2022 · US
Method of cmp integration for improved optical uniformity in advanced lcos back-plane
US-2022223402-A1 · Jul 14, 2022 · US
Selective recessing to form a fully aligned via
US-2022181205-A1 · Jun 9, 2022 · US
Hybrid dielectric scheme for varying liner thickness and manganese concentration
US-11348872-B2 · May 31, 2022 · US
Increasing cost benefit and energy efficiency with modular delivery drones in inclement weather
US-11348060-B2 · May 31, 2022 · US
Structure and method of bi-layer pixel isolation in advanced lcos back-plane
US-2022163834-A1 · May 26, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 294 |
| Applied Materials Inc | 22 |
| Tessera Inc | 14 |
| Int Businesss Machines Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/056 | 123 |
| H10W20/42 | 113 |
| H01L23/5226 | 105 |
| H10W20/425 | 96 |
| H10W20/069 | 87 |