Carrier for measurement and wafer transfer system including the same

Patent metadata

Field	Value
Publication number	US-11733077-B2
Application number	US-202117504212-A
Country	US
Kind code	B2
Filing date	Oct 18, 2021
Priority date	Mar 29, 2021
Publication date	Aug 22, 2023
Grant date	Aug 22, 2023

Abstract

A measurement carrier includes a housing having an internal space, and a flow-rate measuring device located within the internal space. A bottom surface of the housing includes a first inflow hole, a second inflow hole, and an outflow hole, which provide fluid communication between the internal space and an outer space. The flow-rate measuring device may include a first flow-rate measuring sensor in fluid communication with the first inflow hole, and a second flow-rate measuring sensor in fluid communication with the second inflow hole.

First claim

What is claimed is:

1. A measurement carrier, comprising:
a housing having an internal space; and
a flow-rate measuring device located within the internal space,
wherein a bottom surface of the housing comprises a first inflow hole, a second inflow hole, and an outflow hole, each of which is configured to provide fluid communication between the internal space and an outer space,
wherein the flow-rate measuring device comprises:
a first flow-rate measuring sensor in fluid communication with the first inflow hole; and
a second flow-rate measuring sensor in fluid communication with the second inflow hole.

2. The carrier of claim 1 , wherein the flow-rate measuring device further comprises:
a first nozzle in fluid communication with the first inflow hole and coupled to the bottom surface of the housing;
a second nozzle in fluid communication with the second inflow hole and coupled to the bottom surface of the housing;
a first conduit connected to and in fluid communication with the first nozzle; and
a second conduit connected to and in fluid communication with the second nozzle,
wherein the first flow-rate measuring sensor is in fluid communication with the first conduit, and
the second flow-rate measuring sensor is in fluid communication with the second conduit.

3. The carrier of claim 1 , wherein the flow-rate measuring device further comprises:
a power supply configured to provide power to the first flow-rate measuring sensor and the second flow-rate measuring sensor;
a transceiver configured to transmit signals from the first flow-rate measuring sensor and the second flow-rate measuring sensor to a control unit; and
a tilt sensor.

4. The carrier of claim 1 , wherein the bottom surface of the housing further comprises a third inflow hole configured to provide fluid communication between the internal space and the outer space, and
the flow-rate measuring device further comprises a third flow-rate measuring sensor in fluid communication with the third inflow hole.

5. The carrier of claim 4 , wherein the flow-rate measuring device further comprises:
a third nozzle in fluid communication with the third inflow hole and coupled to the bottom surface of the housing; and
a third conduit in fluid communication with the third nozzle,
wherein the third flow-rate measuring sensor is in fluid communication with the third conduit.

6. The carrier of claim 1 , wherein a side surface of the housing comprises a penetration hole configured to provide fluid communication between the internal space and the outer space, and
the carrier further comprises a differential pressure sensor located within the penetration hole.

7. A measurement carrier, comprising:
a housing having an internal space; and
a particle measurement device located within the housing,
wherein a bottom surface of the housing comprises a first inflow hole, a second inflow hole, a third inflow hole, and an outflow hole, each of which is configured to provide fluid communication between the internal space and an outer space, and
the particle measurement device comprises:
a first conduit in fluid communication with the first inflow hole;
a second conduit in fluid communication with the second inflow hole;
a third conduit in fluid communication with the third inflow hole;
a measurement conduit in fluid communication with each of the first conduit, the second conduit, and the third conduit; and
a particle measuring sensor in fluid communication with the measurement conduit.

8. The carrier of claim 7 , wherein the particle measurement device further comprises:
a connection conduit in fluid communication with the second conduit and the third conduit; and
a valve in fluid communication with the connection conduit, wherein the valve is configured to control flow of a gas between the connection conduit and the measurement conduit,
wherein the measurement conduit is in fluid communication with the connection conduit and the first conduit.

9. The carrier of claim 7 , wherein the particle measurement device further comprises:
a first nozzle coupled to the bottom surface of the housing and in fluid communication with the first inflow hole and the first conduit;
a second nozzle coupled to the bottom surface of the housing and in fluid communication with the second inflow hole and the second conduit; and
a third nozzle coupled to the bottom surface of the housing and in fluid communication with the third inflow hole and the third conduit.

10. The carrier of claim 7 , wherein the particle measurement device further comprises:
a branch conduit in fluid communication with the measurement conduit; and
an additional flow-rate measuring sensor in fluid communication with the branch conduit.

11. The carrier of claim 10 , wherein the particle measurement device further comprises a measurement pump in fluid communication with to the measurement conduit, wherein the measurement pump is configured to prevent gas in the measurement conduit from being entirely exhausted to the branch conduit.

12. The carrier of claim 11 , wherein the measurement pump is driven based on a signal transmitted from the additional flow-rate measuring sensor.

13. A wafer transfer system, comprising:
a carrier having an internal space;
a transfer device configured to transfer the carrier;
a carrier base configured to receive the carrier thereon; and
a gas supplying apparatus in fluid communication with the carrier base and configured to supply a gas into the carrier,
wherein the carrier comprises:
a wafer carrier configured to receive a wafer;
a flow-rate measure carrier configured to measure a flow rate of the gas; and
a particle measure carrier configured to measure an amount of particles in the gas,

the carrier base comprises a supply hole and an exhaust hole, each of which are in fluid communication with the gas supplying apparatus and are exposed near a top surface of the carrier base,
each of the wafer carrier, the flow-rate measure carrier, and the particle measure carrier comprising a respective inflow hole configured to be in fluid communication with the supply hole and an outflow hole configured to be in fluid communication with the exhaust hole,
the flow-rate measure carrier comprises a flow-rate measuring sensor, and
the particle measure carrier comprises a particle measuring sensor.

14. The wafer transfer system of claim 13 , further comprising a control unit,
wherein each of the flow-rate measure carrier and the particle measure carrier further comprises a transceiver configured to transmit information to the control unit.

15. The wafer transfer system of claim 13 , wherein a number of the supply hole in the carrier base is two or more, and
a number of the inflow hole in each of the wafer carrier, the flow-rate measure carrier, and the particle measure carrier is two or more.

16. The wafer transfer system of claim 15 , wherein the flow-rate measure carrier comprises a plurality of flow-rate measuring sensors in fluid communication with the two or more inflow holes, respectively, and
the particle measure carrier comprises a particle measuring sensor in fluid communication with the two or more inflow holes.

17. The wafer transfer system of claim 13 , wherein the carrier base further comprises a base flow-rate measuring sensor in fluid communication with the supply hole.

18. The wafer transfer system of claim 17 , wherein the carrier base is provided in plural, and
the gas supplying apparatus is in fluid communication with each of the plurality of carrier bases an

Assignees

• Samsung Electronics Co Ltd

Inventors

• Bang Sanga
• Kim Geunhyung
• Kim Sangmin
• Park Gi-Nam
• Park Chul-Jun
• Ahn Yong-Jun
• Ahn Jongjin
• Lee Min Kyun
• Lee Sangkyung
• Cho Kyubum

Classifications

• H10P72/0604 Primary

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/1926

  characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier · CPC title

• H10P72/3402

  Mechanical parts of transfer devices · CPC title

• H10P72/1924 Primary

  characterised by atmosphere control · CPC title

• H10P72/3218

  Conveying cassettes, containers or carriers · CPC title