Semiconductor wafer storage system and method of supplying fluid for semiconductor wafer storage

Patent metadata

Field	Value
Publication number	US-2020176293-A1
Application number	US-201916529082-A
Country	US
Kind code	A1
Filing date	Aug 1, 2019
Priority date	Dec 3, 2018
Publication date	Jun 4, 2020
Grant date	—

Abstract

A semiconductor wafer storage system includes a container that provides a space in which a semiconductor wafer is to be stored, a fluid supply that provides a fluid to the container, a connection part that receives the fluid from the fluid supply and transfers the fluid to the container, and a nozzle part that connects the connection part to the container. The container may include a coupling plate to which the nozzle part is coupled, and the nozzle part may include a first nozzle and a second nozzle.

First claim

What is claimed is:

1 . A semiconductor wafer storage system, comprising:
a container that provides a space in which a semiconductor wafer is to be stored; a fluid supply that provides a fluid to the container; a connection part that receives the fluid from the fluid supply and transfers the fluid to the container; and a nozzle part that connects the connection part to the container, wherein the container includes a coupling plate to which the nozzle part is coupled, and wherein the nozzle part includes a first nozzle and a second nozzle.

2 . The system as claimed in claim 1 , wherein:
the nozzle part further includes: a sidewall disposed on an edge of the coupling plate; and an upper plate covering the sidewall and the coupling plate, and the coupling plate has a shape of quadrangle having first and fourth corners.

3 . The system as claimed in claim 2 , wherein:
the nozzle part further includes a third nozzle, and the first and third nozzles are adjacent the first and third corners.

4 . The system as claimed in claim 3 , further comprising an exhaust part exhausting the fluid in the container, and
the exhaust part is adjacent the fourth corner.

5 . The system as claimed in claim 3 , wherein:
the connection part includes: a filter that filters an impurity of the fluid; and a manifold fitting that branches a path of the fluid passing through the filter.

6 . The system as claimed in claim 5 , wherein the connection part further includes:
a first supply line that connects the first nozzle and the manifold fitting to each other; a second supply line that connects the second nozzle and the manifold fitting to each other; and a third supply line that connects the third nozzle and the manifold fitting to each other.

7 . The system as claimed in claim 6 , wherein the first, second, and third supply lines have different lengths from each other.

8 . The system as claimed in claim 1 , wherein the connection part further includes:
a valve that adjusts a flow rate of the fluid supplied from the fluid supply; a flowmeter that measures the flow rate of the fluid passing through the valve; and a controller that controls the valve.

9 . The system as claimed in claim 1 , wherein:
the fluid supply provides the fluid in the container at ten times the space.

10 . The system as claimed in claim 9 , wherein:
the space has a volume of 64 liters, and the fluid supply provides the fluid of 900 liters.

11 . A semiconductor wafer storage system, comprising:
a wafer container accommodating a semiconductor wafer; a fluid supply providing a fluid in the wafer container; a nozzle part connecting the wafer container into the fluid supply and providing the fluid in the wafer container; and an exhaust part exhausting the fluid in the wafer container, wherein the wafer container has a shape of a hexahedron, and wherein the nozzle part is adjacent corners of a lower surface of the hexahedron.

12 . The system as claimed in claim 11 , wherein:
the nozzle part includes first to third nozzle.

13 . The system as claimed in claim 11 , wherein:
the exhaust part is adjacent one of the corners of the lower surface of the hexahedron.

14 . The system as claimed in claim 11 , wherein:
the wafer container has an inner space in the hexahedron, and the fluid supply provides the fluid at ten times the inner space.

15 . The system as claimed in claim 14 , wherein:
the inner space has a volume of 64 liters, and the fluid supply provides the fluid of 900 liters.

16 . A semiconductor wafer storage system, comprising:
a gas supply providing an inert gas; and a wafer container having a coupling plate connected to the gas supply and accommodating a semiconductor wafer, wherein the wafer container includes:
nozzle holes adjacent corners of the coupling plate to provide the inert gas in the wafer container; and
an exhaust hole adjacent one of the corners of the coupling plate to exhaust the inert gas in the wafer container.

17 . The system as claimed in claim 16 , wherein:
the nozzle holes are 3.

18 . The system as claimed in claim 16 , wherein:
the wafer container has an inner space, and the gas supply provides the inert gas at ten times the inner space.

19 . The system as claimed in claim 18 , wherein:
the inner space has a volume of 64 liters, and the gas supply provides the fluid of 900 liters.

20 . The system as claimed in claim 16 , wherein:
the wafer container is cubic.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Sangkyung
• Ahn Yong-Jun
• Jeon Taijo
• Cho Kyubum
• Kim Jongsam
• Park Gi-Nam
• Park Chul-Jun
• Lee Junyong

Classifications

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P72/1926 Primary

  characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier · CPC title

• H01L21/67393 Primary

  Electricity · mapped topic

• H01L21/67017

  Electricity · mapped topic

• B05B1/30

  designed to control volume of flow, e.g. with adjustable passages {(B05B11/0094 takes precedence)} · CPC title