Plate, plating apparatus, and method of manufacturing plate

Patent metadata

Field	Value
Publication number	US-11725296-B2
Application number	US-202117314491-A
Country	US
Kind code	B2
Filing date	May 7, 2021
Priority date	May 12, 2020
Publication date	Aug 15, 2023
Grant date	Aug 15, 2023

Abstract

Provided is a plate that is arranged between a substrate and an anode in a plating tank. This plate has a plurality of circular pores on each one of at least three reference circles that are concentric with each other and that are different from each other in diameter. The plurality of circular pores include three circular pores that are arranged respectively on adjacent three of the at least three reference circles, and that have centers which are out of alignment with each other on an arbitrary radius on the plate.

First claim

What is claimed is:

1. A plating apparatus comprising:
a plating tank,
a substrate holder configured to hold a substrate,
an anode arranged to face the substrate holder, and
a single plate arranged between the substrate holder and the anode in the plating tank, the single plate having a plurality of circular pores on each one of at least three reference circles that are concentric with each other and centered on the single plate and that are different from each other in diameter,
the plurality of circular pores including three circular pores that are arranged respectively on adjacent three of the at least three reference circles and that have centers which are out of alignment with each other on substantially all arbitrary radii on the single plate that are inclusive of circular pores,
wherein the single plate comprises only circular pores that are substantially the same size.

2. The plating apparatus according to claim 1 ,
wherein the plurality of circular pores are arranged at an equal pitch along a circumferential direction of a corresponding one of the at least three reference circles.

3. The plating apparatus according to claim 1 ,
wherein a difference between a diameter of an arbitrary one of the at least three reference circles and a diameter of adjacent another one of the at least three reference circles is constant.

4. A plating apparatus comprising:
a plating tank,
a substrate holder configured to hold a substrate,
an anode arranged to face the substrate holder, and
a single plate arranged between the substrate holder and the anode in the plating tank, the single plate having a plurality of circular pores on each one of at least three reference circles that are concentric with each other and centered on the single plate and that are different from each other in diameter,
the plurality of circular pores including three circular pores that are arranged respectively on adjacent three of the at least three reference circles and that have centers which are out of alignment with each other on an arbitrary radius on the single plate that is inclusive of circular pores, wherein the single plate comprises no openings larger than the plurality of circular pores,
wherein each of the three circular pores have no substantial variation in size.

5. A plating apparatus comprising:
a plating tank,
a substrate holder configured to hold a substrate,
an anode arranged to face the substrate holder, and
a single plate arranged between the substrate holder and the anode in the plating tank, the single plate having a plurality of circular pores on each one of at least three reference circles that are concentric with each other and centered on the single plate and that are different from each other in diameter,
the plurality of circular pores including three circular pores that are arranged respectively on adjacent three of the at least three reference circles and that have centers which are out of alignment with each other on an arbitrary radius on the single plate that is inclusive of circular pores, wherein the single plate comprises only circular pores that are substantially the same size.

6. The plating apparatus according to claim 5 , wherein the single plate comprises no openings substantially larger than the circular pores.

Assignees

• Ebara Corp

Inventors

• Shamoto Mitsuhiro
• Shimoyama Masashi
• Chang Shao Hua

Classifications

• C25D17/001 Primary

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D3/02

  from solutions (C25D5/34 - C25D5/46 take precedence) · CPC title

• C25D17/008 Primary

  Current shielding devices · CPC title

• C25D17/14

  for pad-plating · CPC title

• C25D21/12

  Process control or regulation (controlling or regulating in general G05) · CPC title