Electronic component and method of manufacturing the same

US10340072B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10340072-B2
Application numberUS-201615204113-A
CountryUS
Kind codeB2
Filing dateJul 7, 2016
Priority dateJan 31, 2014
Publication dateJul 2, 2019
Grant dateJul 2, 2019

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electronic component includes a body made of a material containing particles of a metallic magnetic material, and an outer electrode disposed on a surface of the body. The surface of the body has a contact portion with which the outer electrode is in contact, and the surface of the body includes particles of the metallic magnetic material which are exposed from the surface of the body.

First claim

Opening claim text (preview).

The invention claimed is: 1. An electronic component, comprising: a body made of a material containing particles of a metallic magnetic material; and an outer electrode disposed on a surface of the body, wherein, the surface of the body has a contact portion which is in direct contact with the outer electrode, and the contact portion includes particles of the metallic magnetic material which are exposed from the surface of the body, surfaces of the particles of the metallic magnetic material are coated with respective insulating films, and at the contact portion, the insulating films are removed to expose the particles of the metallic magnetic material. 2. The electronic component according to claim 1 , wherein the particles of the metallic magnetic material at the contact portion are exposed through forming the contact portion by cutting. 3. The electronic component according to claim 1 , wherein the body has a rectangular cuboid shape and has a mounting surface that is to face a circuit board in a mounting process, and opposing first and second end surfaces adjacent to the mounting surface, and wherein the outer electrode extends into at least one of the mounting surface and the first end surface. 4. The electronic component according to claim 1 , wherein the outer electrode includes a close-contact layer made of Ti, Cr, or Ni. 5. The electronic component according to claim 1 , wherein the outer electrode is made of Cu, Ag, or an alloy of Cu and Ag. 6. The electronic component according to claim 1 , further comprising: a circuit element mounted in the body and electrically connected to the outer electrode.

Assignees

Inventors

Classifications

  • with a magnetic layer · CPC title

  • with the coil helically wound around a magnetic core · CPC title

  • Manufacturing of magnetic circuits by moulding or by pressing powder (magnetic cores made by moulding or by pressing powder H01F27/255; soft magnetic particles H01F1/20, H01F1/36) · CPC title

  • Manufacturing of magnetic cores by mechanical means (magnetic cores per se H01F27/24) · CPC title

  • structurally combined with ferromagnetic material · CPC title

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Frequently asked questions

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What does patent US10340072B2 cover?
An electronic component includes a body made of a material containing particles of a metallic magnetic material, and an outer electrode disposed on a surface of the body. The surface of the body has a contact portion with which the outer electrode is in contact, and the surface of the body includes particles of the metallic magnetic material which are exposed from the surface of the body.
Who is the assignee on this patent?
Murata Manufacturing Co
What technology area does this patent fall under?
Primary CPC classification H01F27/255. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 02 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).