Two-dimensional addessable array of piezoelectric MEMS-based active cooling devices

Patent metadata

Field	Value
Publication number	US-11705382-B2
Application number	US-202117179263-A
Country	US
Kind code	B2
Filing date	Feb 18, 2021
Priority date	Aug 10, 2018
Publication date	Jul 18, 2023
Grant date	Jul 18, 2023

Abstract

A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.

First claim

What is claimed is:

1. A cooling system comprising:
a plurality of piezoelectric cooling elements spatially arranged in at least one array, the at least one array extending in at least two dimensions, having a first side distal from at least one heat-generating structure, and having a second side proximate to the at least one heat-generating structure, the at least one array including a plurality of apertures on the first side of the at least one array and a plurality of orifices on the second side of the at least one array, the plurality of apertures corresponding to the plurality of piezoelectric cooling elements, the plurality of piezoelectric cooling elements being between the plurality apertures and the at least one heat-generating structure, the plurality of piezoelectric cooling elements being between the plurality of apertures and the plurality of orifices, the plurality of piezoelectric cooling elements configured to draw fluid through the plurality of apertures on the first side of the at least one array and to drive the fluid from the first side of the at least one array to the second side of the at least one array and through the plurality of orifices;
a communications interface associated with the piezoelectric cooling elements such that selected piezoelectric cooling elements within the array can be activated; and
driving circuitry associated with the plurality of piezoelectric cooling elements and configured to drive the selected piezoelectric cooling elements.

2. The cooling system of claim 1 , wherein each of the plurality of piezoelectric cooling elements has a first cooling element side distal from the heat-generating structure, has a second cooling element side proximate to the at least one heat-generating structure, and is configured to drive the fluid from the first cooling element side to the second cooling element side using vibrational motion.

3. The cooling system of claim 1 , further comprising:
an interface coupled with the driving circuitry and for receiving at least one temperature reading from at least one temperature sensor of the at least one heat-generating structure, the selected piezoelectric cooling elements within the array being activated based on the at least one temperature reading.

4. The cooling system of claim 1 , wherein the at least one array includes a first array including a first portion of the plurality of piezoelectric cooling elements and a second array including a second portion of the plurality of piezoelectric cooling elements, the communications interface associated with the first array and the second array such that the first portion of the piezoelectric cooling elements can be selectively activated separately from the second portion of the piezoelectric cooling elements.

5. The cooling system of claim 4 , wherein the first portion of the plurality of piezoelectric cooling elements are driven at a first frequency corresponding to a first resonant frequency for the first array and wherein the second portion of plurality of piezoelectric cooling elements are driven at a second frequency corresponding to a second resonant frequency for the second array.

6. The cooling system of claim 4 , wherein the driving circuitry is configured such that the first array is separately addressable from the second array.

7. The cooling system of claim 1 , wherein the driving circuitry is further configured to separately drive portions of the plurality of piezoelectric cooling elements in a coordinated pattern.

8. The cooling system of claim 1 , wherein the driving circuitry is configured to drive a first portion of the plurality of piezoelectric cooling elements at a first frequency and a second portion of the plurality of piezoelectric cooling elements at a second frequency different from the first frequency.

9. A piezoelectric cooling system, comprising:
a plurality of arrays, each of the plurality of arrays including a plurality of piezoelectric cooling elements, extending in at least two dimensions, having a first side distal from at least one heat-generating structure, and having a second side proximate to the at least one heat-generating structure, each of the plurality of arrays including a plurality of apertures on the first side of the array and a plurality of orifices on the second side of each of the plurality of arrays, the plurality of apertures corresponding to the plurality of piezoelectric cooling elements, the plurality of piezoelectric cooling elements being between the plurality apertures and the at least one heat-generating structure, the plurality of piezoelectric cooling elements being between the plurality of apertures and the plurality of orifices, the plurality of piezoelectric cooling elements being configured to draw fluid through the plurality of apertures on the first side of each of the plurality of arrays and to drive the fluid from the first side to the second side of each of the plurality of arrays and through the plurality of orifices;
a communications interface coupled with the plurality of arrays, associated with the piezoelectric cooling elements such that each of the plurality of arrays can be selectively activated; and
driving circuitry associated with the piezoelectric cooling elements configured to drive at least a portion of the plurality of piezoelectric cooling elements in each of the plurality of arrays.

10. The piezoelectric cooling system of claim 9 , wherein the plurality of arrays is configured to cool the at least one heat-generating structure, each of the plurality of arrays being configured to address a different one of the at least one heat-generating structure.

11. The piezoelectric cooling system of claim 9 , wherein the driving circuitry selectively drives each of the plurality of arrays.

12. The piezoelectric cooling system of claim 9 , wherein the driving circuitry selectively drives each of the plurality of piezoelectric cooling elements in each of the plurality of arrays.

13. A method of cooling a device comprising:
selectively driving at least a portion of a plurality of piezoelectric cooling elements, the plurality of piezoelectric cooling elements spatially arranged in at least one array extending in at least two dimensions, the at least one array having a first side distal from at least one heat-generating structure and having a second side proximate to the at least one heat-generating structure, the at least one array including a plurality of apertures on the first side of the at least one array and a plurality of orifices on the second side of the at least one array, the plurality of apertures corresponding to the plurality of piezoelectric cooling elements, the plurality of piezoelectric cooling elements being between the plurality apertures and the at least one heat-generating structure, the plurality of piezoelectric cooling elements being between the plurality of apertures and the plurality of orifices, the plurality of piezoelectric cooling elements being configured to draw fluid through the plurality of apertures on the first side of the at least one array and to direct the fluid from the first side of the at least one array to the second side of the at least one array and through the plurality of orifices when activated.

14. The method of claim 13 wherein the driving further includes:
driving the portion of the plurality of piezoelectric cooling elements such that each of the portion of the plurality of piezoelectric cooling elements vibrates at a frequency of at least 15 kHz.

15. The method of claim 14 , wherein the frequency is substantially at a resonance frequency corresponding to the portion of the plurality of

Assignees

• Frore Systems Inc

Inventors

• Ganti Suryaprakash
• Madhavapeddy Seshagiri Rao

Classifications

• H10W40/776

  Arrangements for jet impingement, e.g. for spraying · CPC title

• H10W40/70

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/40

  involving heat exchange by flowing fluids · CPC title

• H10W40/475 Primary

  using jet impingement (H10W40/776 takes precedence) · CPC title