High power module cooling system

Patent metadata

Field	Value
Publication number	US-9252069-B2
Application number	US-87322610-A
Country	US
Kind code	B2
Filing date	Aug 31, 2010
Priority date	Aug 31, 2010
Publication date	Feb 2, 2016
Grant date	Feb 2, 2016

Abstract

A cooling apparatus includes a direct-bonded copper (“DBC”) substrate, the DBC substrate having a plurality of micro-structure tabs formed on a fluid impingement side of the DBC substrate, and a jet head in complementary opposition to the fluid impingement side. The jet head has a first plurality of micro-jets facing the fluid impingement side, each of the first plurality of micro-jets having a nozzle, and a second plurality of micro-jets facing the fluid impingement side so the jet head is configured to deliver a fluid to the plurality of micro-structure tabs through the first and second plurality of micro-jets.

First claim

We claim:

1. A high-power module cooling apparatus, comprising:
a direct-bonded copper (“DBC”) substrate, said DBC substrate having a plurality of micro-studs formed on a fluid impingement side of said DBC substrate; and
a jet head in complementary opposition to said fluid impingement side, said jet head comprising:
a substantially planar upper surface in complementary opposition to said fluid impingement side; and
a first cluster of micro-jets facing said fluid impingement side, each of said micro-jets having an exit nozzle that terminates co-planar with said upper surface; and
a second plurality of micro-jets facing said fluid impingement side;

wherein said jet head delivers a fluid to said plurality of micro-studs through said first and second plurality of micro-jets without said first and second plurality of micro-jets extending between said upper surface and said fluid impingement side to enable both confined micro-jet impingement and free surface micro-jet impingement.

2. The apparatus of claim 1 , wherein said first cluster of micro-jets positioned in complementary opposition to a first heat source seated on an opposite side of said DBC substrate.

3. The apparatus of claim 2 , wherein said second plurality of micro-jets is a second cluster of micro-jets set apart from said first cluster of micro-jets, said second cluster of micro-jets positioned in complementary opposition to a second heat source seated on the opposite side of said DBC substrate.

4. The apparatus of claim 3 , wherein said first and second heat sources are each high power devices of a power module.

5. The apparatus of claim 1 , wherein said first cluster of micro-jets is defined by central and outer micro-jet regions, said outer micro-jet regions bounding said central micro-jet region on at least two sides, and each of said nozzles in said central micro-jet region having a larger exit nozzle diameter than each of said nozzles in said outer micro-jet region.

6. The apparatus of claim 1 , wherein said first plurality of micro-jets comprise micro-jets having converging nozzles.

7. The apparatus of claim 6 , wherein said converging nozzles are countersunk nozzles.

8. The apparatus of claim 1 , further comprising:
a base plate to seat said DBC substrate, said base plate having an opening to expose said fluid impingement side to said jet head.

9. The apparatus of claim 8 , further comprising:
a conformal cooling chamber frame to receive said base plate.

10. The apparatus of claim 1 , wherein said plurality of micro-studs are milled micro-studs.

11. The apparatus of claim 10 , wherein said plurality of milled micro-studs are polyhedron with a square base.

12. The apparatus of claim 10 , wherein said plurality of milled micro-studs are polyhedron with a triangular base.

13. The apparatus of claim 1 , wherein said plurality of micro-studs are etched micro-studs.

14. A high-power module cooling apparatus, comprising:
a direct-bonded copper (“DBC”) substrate, said DBC substrate having a plurality of milled micro-studs formed on a fluid impingement side of said DBC substrate; and
a jet head in complementary opposition to said fluid impingement side, said jet head comprising
a substantially planar upper surface in complementary opposition to said fluid impingement side;
a first cluster of micro-jets facing said fluid impingement side, each of said micro-jets in said first cluster having a nozzle; and
a second cluster of micro-jets set apart from said first cluster of micro-jets, said second cluster of micro-jets facing said fluid impingement side;

wherein said jet head delivers a phase-change material to said plurality of milled micro-studs through said first and second plurality of micro-jets without said first and second clusters of micro jets extending between said upper surface and said fluid impingement side to enable both confined micro-jet impingement and free surface micro-jet impingement.

15. The apparatus of claim 14 , further comprising:
a first heat source seated on an opposite side of said DBC substrate and aligned with said first cluster of micro-jets; and
a second heat source seated on said opposite side of said DBC substrate and aligned with said second cluster of micro-jets;
wherein said first and second heat sources are targeted by said first and second clusters of microjets, respectively.

16. The apparatus of claim 14 , wherein each of said micro-jets in said first cluster of micro-jets and said second cluster of micro-jets have an input diameter of about 100-150 μm, an output diameter of about 100 μm, and a length of about 630 μm.

17. The apparatus of claim 14 , wherein each of said plurality of milled micro-studs has a depth of about 150 μm and at least one of: a square base measuring about 150 μm on each side, and a triangular base measuring about 150 μm on each side.

18. The apparatus of claim 1 , wherein each of said micro-jets in said first cluster of micro-jets have approximately equal micro-jet lengths between an input orifice and an output orifice within each of said micro-jets.

19. The apparatus of claim 18 , wherein said jet head further comprises first and second chambers of equal volume.

20. The apparatus of claim 19 , wherein each of said first and second chambers have respective downstream portions that are larger than respective upstream portions.

21. The apparatus of claim 19 , wherein each of said first and second chambers have respective constant cross section areas.

22. The apparatus of claim 2 , wherein said first cluster of micro-jets is defined by central and outer micro-jet regions, said central micro-jet region corresponding to a central region of said first heat source, each of said exit nozzles in said central micro-jet region having a larger exit nozzle diameter than each of said exit nozzles in said outer micro-jet region.

23. The apparatus of claim 1 , wherein said micro-studs are spaced apart between 500-900 microns.

24. The apparatus of claim 1 , wherein said micro-studs do not form high-aspect ratio microchannels.

25. The apparatus of claim 1 , wherein the micro-studs are a part of a layer of said DBC substrate so that a height of the micro-studs does not exceed the thickness of the layer.

Assignees

• Bhunia Avijit
• Moffatt Alex P
• Gardner Mark R
• Chen Chung-Lung
• Teledyne Scient & Imaging Llc

Inventors

• Bhunia Avijit
• Moffatt Alex P
• Gardner Mark R
• Chen Chung-Lung

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W40/475

  using jet impingement (H10W40/776 takes precedence) · CPC title

• H10W40/255 Primary

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title