Stacked semiconductor method and apparatus
US-2024096745-A1 · Mar 21, 2024 · US
involving heat exchange by flowing fluids
involving heat exchange by flowing fluids · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W40/40 |
| Official title | involving heat exchange by flowing fluids |
| Display label | involving heat exchange by flowing fluids |
| Total patents | 705 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 22 |
| 2016 | 28 |
| 2017 | 39 |
| 2018 | 48 |
| 2019 | 60 |
| 2020 | 73 |
| 2021 | 72 |
| 2022 | 72 |
| 2023 | 73 |
| 2024 | 97 |
| 2025 | 91 |
| 2026 | 30 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Package architecture of scalable compute wall having compute bricks with vertically stacked dies
US-2024006395-A1 · Jan 4, 2024 · US
Bus bar and power electronic device with current shaping terminal connector and method of making a terminal connector
US-2017358897-A1 · Dec 14, 2017 · US
Heat exchanger for cooling electric element
US-9807915-B2 · Oct 31, 2017 · US
Encapsulated power semiconductor device having a metal moulded body as a first connecting conductor
US-2017263530-A1 · Sep 14, 2017 · US
Powermap Optimized Thermally Aware 3D Chip Package
US-2017243806-A1 · Aug 24, 2017 · US
Systems and methods for cooling X-ray tubes and detectors
US-9724059-B2 · Aug 8, 2017 · US
Systems and methods for thermal control of integrated circuits
US-2017162473-A1 · Jun 8, 2017 · US
Heat sink for cooling of power semiconductor modules
US-9666504-B2 · May 30, 2017 · US
Method and apparatus to facilitate direct surface cooling of a chip within a 3D stack of chips using optical interconnect
US-9646916-B1 · May 9, 2017 · US
Cooler and semiconductor module using same
US-2016379914-A1 · Dec 29, 2016 · US
Cooling system for electronics
US-2016374231-A1 · Dec 22, 2016 · US
Micro-hoses for integrated circuit and device level cooling
US-2016358842-A1 · Dec 8, 2016 · US
Cooling system for electronics
US-9513064-B2 · Dec 6, 2016 · US
Electric power converter with a spring member
US-9502331-B2 · Nov 22, 2016 · US
Cooling module, water-cooled cooling module and cooling system
US-2016330868-A1 · Nov 10, 2016 · US
Medium voltage hybrid air/liquid cooled adjustable frequency drive
US-9485889-B2 · Nov 1, 2016 · US
Heat sink for cooling plurality of heat generating components
US-2016313072-A1 · Oct 27, 2016 · US
Semiconductor assembly
US-2016316589-A1 · Oct 27, 2016 · US
Cooling of a volatile memory device to preserve data during power loss
US-9471114-B2 · Oct 18, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W40/40?
- CPC H10W40/40 is the Cooperative Patent Classification code for “involving heat exchange by flowing fluids.”
- How many patents are filed under CPC H10W40/40 (involving heat exchange by flowing fluids)?
- Our database includes 705 publications tagged with this CPC code.
- Is patent activity under CPC H10W40/40 growing?
- Publication counts under this code: 97 in 2024 vs 91 in 2025 (latest complete years).