Systems for integrated decomposition and scanning of a semiconducting wafer

Patent metadata

Field	Value
Publication number	US-11705351-B2
Application number	US-201816200010-A
Country	US
Kind code	B2
Filing date	Nov 26, 2018
Priority date	Dec 1, 2017
Publication date	Jul 18, 2023
Grant date	Jul 18, 2023

Abstract

Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.

First claim

What is claimed is:

1. A chamber for decomposing and scanning a surface of a semiconducting wafer comprising:
a chamber body defining an interior region and a first aperture at a top portion of the chamber to receive a semiconducting wafer into the interior region of the chamber body;
a ledge projecting into the interior region at an intermediate portion of the chamber body between the top portion of the chamber body and a bottom portion of the chamber body, the ledge defining a second aperture within the interior region at the intermediate portion;
a wafer support configured to hold at least a portion of the semiconducting wafer, the wafer support positionable between at least a first position adjacent the first aperture and a second position adjacent the second aperture within the interior region of the chamber body;
a motor system operably coupled with the wafer support, the motor system configured to control a vertical position of the wafer support with respect to the chamber body at least to the first position for access to the semiconducting wafer by a scanning nozzle and the second position for decomposition of a surface of the semiconducting wafer;
a nebulizer positioned within an aperture in a wall of the chamber body and configured to spray a decomposition fluid into the interior region of the chamber body, the nebulizer extending no further than an inner periphery of the wall of the chamber body during spraying of the decomposition fluid;
a gas outlet port beneath the second aperture within the interior region of the chamber body; and
a controller coupled to a gas source, the controller configured to introduce gas from the gas source to the gas outlet port during introduction of the decomposition fluid onto the surface of the semiconducting wafer by the nebulizer at a pressure greater than a pressure of the decomposition fluid introduction when the wafer support is positioned at the second position.

2. The chamber of claim 1 , wherein the first aperture and the second aperture are coaxially arranged.

3. The chamber of claim 1 , wherein the motor system is further configured to control the vertical position of the wafer support with respect to the chamber body to a third position between the second aperture and the bottom portion of the chamber.

4. The chamber of claim 3 , wherein the motor system is further configured to rotate the wafer support at the third position during at least one of a rinse procedure of the semiconducting wafer or a drying procedure of the semiconducting wafer.

5. The chamber of claim 1 , wherein the motor system is further configured to rotate the wafer support at least one of at the first position and at the second position.

6. The chamber of claim 1 , wherein the chamber body defines one or more channels between an interior surface of the chamber body and the ledge, the one or more channels providing access to fluids between the first aperture and the second aperture.

7. The chamber of claim 6 , further comprising one or more drains fluidically coupled with the one or more channels, the one or more drains providing an outlet for the fluids from the interior region of the chamber body.

8. The chamber of claim 1 , further comprising one or more drains coupled to the bottom portion of the chamber body.

9. A system for decomposing and scanning a surface of a semiconducting wafer comprising:
a chamber configured to receive a semiconducting wafer, the chamber defining a first aperture at a top portion of the chamber to receive the semiconducting wafer into an interior region of the chamber, the chamber including
a ledge at an intermediate portion of the chamber between the top portion of the chamber and a bottom portion of the chamber, the ledge defining a second aperture at the intermediate portion,
a wafer support configured to hold at least a portion of the semiconducting wafer, the wafer support positionable between at least a first position adjacent the first aperture and a second position adjacent the second aperture,
a motor system operably coupled with the wafer support, the motor system configured to control a vertical position of the wafer support with respect to the chamber at least to the first position and the second position,
a nebulizer positioned within an aperture in a wall of the chamber body and configured to spray a decomposition fluid into the interior region of the chamber body, the nebulizer extending no further than an inner periphery of the wall of the chamber body during spraying of the decomposition fluid,
a gas outlet port beneath the second aperture within the interior region of the chamber, and
a controller coupled to a gas source, the controller configured to introduce gas from the gas source to the gas outlet port during introduction of the decomposition fluid onto the surface of the semiconducting wafer by the nebulizer at a pressure greater than a pressure of the decomposition fluid introduction when the wafer support is positioned at the second position;

a lid positionable between an open position and a closed position, the lid having a size and shape to cover the first aperture when in the closed position; and
a scan arm coupled with a nozzle, at least a portion of the scan arm positioned exterior the chamber above the top portion of the chamber, the scan arm rotatable to position the nozzle adjacent the semiconducting wafer when the wafer support is positioned at the first position by the motor system and to position the nozzle outside a path of the lid from the open position to the closed position when the wafer support is positioned at the second position by the motor system.

10. The system of claim 9 , wherein the nebulizer is disposed at least partially within a wall of the chamber.

11. The system of claim 9 , wherein the lid is in the closed position when the wafer support is in the second position to prevent fluid passage through the first aperture.

12. The system of claim 9 , wherein the lid is in the open position when the wafer support is in the first position to provide access to the semiconducting wafer by the nozzle.

13. The system of claim 9 , further comprising a rinse trough having an elongated channel to receive the nozzle, the elongated channel configured to couple with a rinse fluid source to introduce a rinse fluid into the elongated channel to rinse the nozzle.

14. The system of claim 13 , further wherein the rinse trough includes a second elongated channel to receive the nozzle, the elongated channel configured to couple with a drying gas source to introduce a drying gas fluid into the elongated channel to dry the nozzle.

15. The system of claim 9 , wherein the motor system is further configured to control the vertical position of the wafer support with respect to the chamber to a third position between the second aperture and the bottom portion of the chamber.

16. The system of claim 15 , wherein the motor system is further configured to rotate the wafer support at the third position during at least one of a rinse procedure of the semiconducting wafer or a drying procedure of the semiconducting wafer.

17. The system of claim 9 , wherein the motor system is further configured to rotate the wafer support at least one of at the first position and at the second position.

Assignees

• Elemental Scientific Inc

Inventors

• Yost Tyler
• Wiederin Daniel R
• Marth Beau
• Kaser Jared
• Hein Jonathan
• Lee Jae Seok
• Kim Jae Min
• Sudyka Stephen H

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/277

  Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers · CPC title

• H10P74/207

  Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics · CPC title

• H10P72/3406

  involving removal of lid, door or cover · CPC title

• H10P72/3306

  Horizontal transfer of a single workpiece · CPC title